Provided are a power supply circuit, a power supply device and a control method. The power supply circuit includes a primary rectifier unit, a modulation unit, a transformer, a secondary rectifier and filtering unit, a current feedback unit, and a control unit. The power supply circuit removes a liquid electrolytic capacitor at a primary side. Moreover, the control unit may determine a type of a voltage of input alternating current, and set a current limit value in the current feedback unit according to the type of the voltage of the alternating current.

In a power conversion device, cable connection positions of connections in which a plurality of bus bars is respectively connected to external line cables are non-overlapping with each other as viewed from a side on which the external line cables are pulled out.

This converter comprises: a housing having heat dissipation fins formed on the top surface thereof; a printed circuit board disposed in the inner space of the housing; and a bus bar, the bottom surface of which is in surface contact with the top surface of the printed circuit board, wherein the heat dissipation fins and the bus bar can be disposed overlapping each other in a vertical direction to enhance heat dissipation efficiency and can be further reduced in weight.

A power converter provides a low-voltage output using a full-bridge fault-tolerant rectification circuit. The output circuit uses controlled switches as rectifiers. A fault detection circuit monitors circuit conditions. Upon detection of a fault, the switches are disabled decoupling the power converter from the system. A common-source dual MOSFET device includes a plurality of elements arranged in alternating patterns on a semiconductor die. A common-source dual synchronous rectifier includes control circuitry powered from the drain to source voltage of the complementary switch. A DC-to-DC transformer converts power from an input source to a load using a fixed voltage transformation ratio. A clamp phase may be used to reduce power losses in the converter at light loads, control the effective output resistance of the converter, effectively regulate the voltage transformation ratio, provide narrow band output regulation, and control the rate of change of output voltage for example during start up. One or more of the transformer windings may be clamped. The converter may use the sine amplitude converter topology. The converter may use common-source dual MOSFET devices and fault detection. The density of point of load power conversion may be increased and the associated power dissipation reduced by removing the input driver circuitry from the point of load where it is not necessary. An output circuit may be located at the point of load providing fault tolerant rectification of the AC power from the secondary winding of a power transformer which may be located nearby the output circuit. The resonant voltage and current waveforms on the primary side of the transformer are readily communicated via an AC bus between the driver circuit and the primary winding of the power transformer. The driver circuit may drive a plurality of transformer-output circuit pairs. The transformer and output circuit may be combined in a single module at the point of load. Alternatively, the output circuit may be integrated into point of load circuitry such as a processor core. The transformer may be deployed near the output circuit.

A power conversion device includes a circuit board on which wirings are formed and plural semiconductor switching elements are mounted; and a driver circuit which is mounted on the circuit board, and operates at least two of the plural semiconductor switching elements together; wherein the plural semiconductor switching elements are provided as packages having a same shape, and placed in such a positional relationship in which an inter-control-terminal distance that is a distance between their respective control terminals is shorter than a length of a terminal side that is a side of each of the packages at which the control terminal is placed.

A DC power supply device includes a first conversion unit connected to an AC power supply, a second conversion unit connected to an electric tool, and a cable connecting the first conversion unit and the second conversion unit to each other. The first conversion unit includes a power factor correction circuit, converts an AC voltage having a first voltage value, input from the AC power supply, into a DC voltage having a second voltage value higher than the first voltage value, and outputs the DC voltage having the second voltage value to the cable. The second conversion unit converts the output voltage of the first conversion unit, input via the cable, into a DC voltage having a third voltage value lower than the second voltage value, and outputs the DC voltage having the third voltage value to the electric tool.

A sheet-shaped member 440 including a resin insulating layer 441 and a metal foil 442 is used. The sheet-shaped member 440 is deformed following warpage or step difference in a second conductor plate 431 and a fourth conductor plate 433, and therefore, the thickness of the resin insulating layer 441 can be set to a constant thickness of, for example, 120 μm capable of securing insulation properties. By plastically deforming a metal-based heat conduction member 450 having a thickness of, for example, 120 μm interposed between the sheet-shaped member 440 and a cooling member 340, the thickness of the metal-based heat conduction member 450 is changed to absorb the warpage or step difference generated in the second conductor plate 431 and the fourth conductor plate 433. This results in remarkable improvement in heat dissipation as compared with a case where the conductor plates are brought into contact with the cooling member 340 via an insulating layer alone.

No consideration is given to heat transferred from a semiconductor module to a capacitor via a bus bar module. The heat generated by a semiconductor module (1) is transferred to a bus bar module (3) via a DC terminal (1A) of the semiconductor module (1). As illustrated in FIG. 4(B), the heat transferred to the bus bar module 3 is then transferred to the pressing member 5 via the annular conductor 8 and the bolt 5A. Since the pressing member 5 is in close contact with the second cooler 2B, the heat transferred to the pressing member 5 is cooled by the second cooler 2B. On the other hand, the heat transferred to the convex portion 6A of the housing 6 is transferred to the first cooler 2A via the housing 6 and cooled. As a result, in the configuration in which a capacitor (4) is connected to the semiconductor module (1) via the bus bar module (3), the heat transferred from the semiconductor module (1) to the capacitor (4) can be suppressed.

An electric compressor, an inverter manufacturing equipment and an inverter manufacturing method to prevent soldering defects and damage to elements, wherein an inverter includes a circuit board on which a plurality of elements are mounted and a frame coupled to the circuit board, wherein the frame includes a support plate, a side plate projecting from the support plate toward the circuit board, an array plate on which switching elements connected to the circuit board are arranged, and a connection bar connecting the support plate and the array plate.

A mechanical assembly includes a power semiconductor device located inside of a mechanical enclosure, and a magnetic component located outside of the mechanical enclosure and operably connected to the power semiconductor device. The power semiconductor device and the magnetic component are cooled via a common air pathway outside of the mechanical enclosure. A power converter includes a powered semiconductor device located inside of a mechanical enclosure, the power semiconductor device configured to convert DC input power to AC output power, and an inductor located outside of the mechanical enclosure and operably connected to the power semiconductor device. The power semiconductor device and the magnetic component are cooled via a common air pathway outside of the mechanical enclosure.