A drive unit includes a base member having an operation base having operation recesses in a front surface, a movable member that is disposed to be opposite to the base member and has operation projections to be inserted into the operation recesses in an opposed surface, and a shape memory alloy member that is disposed between the base member and the movable member and shrinks by heat generated by passing an electric current. In conjunction with the shrinkage of the shape memory alloy member by the passage of the electric current, the movable member is moved in a direction away from the base member. The base member has a fixed portion in its middle in a core axial direction of the shape memory alloy member, to fix the middle on a support member.

The invention relates to a thermoelastic energy converter (1), in particular for use in a thermoelastic heating/cooling apparatus or in a combined heat-and-power coupling system, comprising: an arrangement comprising multiple converter devices (3a, 3b), wherein each of the converter devices (3a, 3b) has one or more thermoelastic elements (4) arranged in a direction of extension; a loading device, in order to load the thermoelastic elements (4) of each of the multiple converter devices (3a, 3b) so as to have a temporally variable power curve; a coupling which is designed such that the loading device actuates the converter devices (3a, 3b) in a phase-offset manner with respect to their cyclic loading and unloading.

The invention relates to a thermoelastic energy converter (1), in particular for use in a thermoelastic heating/cooling apparatus or in a combined heat-and-power coupling system, comprising: an arrangement comprising multiple converter devices (3a, 3b), wherein each of the converter devices (3a, 3b) has one or more thermoelastic elements (4) arranged in a direction of extension; a loading device, in order to load the thermoelastic elements (4) of each of the multiple converter devices (3a, 3b) so as to have a temporally variable power curve; a coupling which is designed such that the loading device actuates the converter devices (3a, 3b) in a phase-offset manner with respect to their cyclic loading and unloading.

A thermomagnetic apparatus for electric power production, comprising: a hollow toric vessel (30) delimited by a wall (31) having an outer toric surface (31a) having a toroidal direction, wherein the toric wall (31) encloses a volume containing a ferrofluid which comprises magnetic nanoparticles dispersed or suspended in a fluid carrier; a plurality of hydraulic conduits (36-39) in thermal contact with the outer toric surface (31a); a magnetic field source (62) coupled to the outer toric surface (62) and an extraction coil (65) which comprises a plurality of turns (65′) of electrical conductor wire arranged on the outer toric surface (31a).

A thermomagnetic apparatus for electric power production, comprising: a hollow toric vessel (30) delimited by a wall (31) having an outer toric surface (31a) having a toroidal direction, wherein the toric wall (31) encloses a volume containing a ferrofluid which comprises magnetic nanoparticles dispersed or suspended in a fluid carrier; a plurality of hydraulic conduits (36-39) in thermal contact with the outer toric surface (31a); a magnetic field source (62) coupled to the outer toric surface (62) and an extraction coil (65) which comprises a plurality of turns (65′) of electrical conductor wire arranged on the outer toric surface (31a).

A suspension assembly is described. The suspension assembly including a static member or plate; a moving member or plate movable about an x-axis and a y-axis with respect to the static plate; a sensor mounting region on the moving plate; and one or more shape memory alloy (SMA) elements extending between and coupled to the static plate and moving plate. The SMA elements, when driven by a controller, move the moving plate and the sensor mounting region thereon about the x-axis and the y-axis with respect to the static plate.

A suspension assembly is described. The suspension assembly including a static member or plate; a moving member or plate movable about an x-axis and a y-axis with respect to the static plate; a sensor mounting region on the moving plate; and one or more shape memory alloy (SMA) elements extending between and coupled to the static plate and moving plate. The SMA elements, when driven by a controller, move the moving plate and the sensor mounting region thereon about the x-axis and the y-axis with respect to the static plate.

A system for combined heat and electric power generation, preferably including a heat reservoir and one or more electric generators, each preferably including a heat source and an energy converter. A method for combined heat and electric power generation, preferably including activating an electric generator, deactivating the electric generator, and/or providing heat from a heat reservoir.

A system for combined heat and electric power generation, preferably including a heat reservoir and one or more electric generators, each preferably including a heat source and an energy converter. A method for combined heat and electric power generation, preferably including activating an electric generator, deactivating the electric generator, and/or providing heat from a heat reservoir.

Expansion compensating structures are formed in redistribution layers of a wafer-level chip-scale integrated circuit package (WLCSP) or other IC package having a low-expansion substrate. The structures include micromechanical actuators designed and oriented to move solder bumps attached to them in the same direction and distance as a function of temperature as do pads to which they may be connected on a higher-expansion substrate such as a printed circuit board. Expansion compensated IC packages incorporating these expansion compensating structures are provided, as well as expansion compensated assemblies containing one or more of these IC packages. Methods of fabricating expansion compensated IC packages requiring minimal changes to existing commercial WLCSP fabrication processes are also provided. These devices and methods will result in assemblies having improved board-level reliability during thermal cycling, and allow the use of larger IC die sizes in WLCSP technology.