Patent classifications
H03H1/00
COMMON MODE FILTER
Disclosed herein is a common mode filter that includes a winding core part and first and second wires wound in a same direction around the winding core part. The first and second wires constitute a first winding block on one endmost side in an axial direction of the winding core part, a second winding block on other endmost side in the axial direction of the winding core part, and a third winding block positioned between the first and second winding blocks. The second winding block is a winding block at an odd-numbered position counted from the first winding block. The first and second wires cross each other in an area between the first and third winding blocks and in an area between the second and third winding blocks.
COMMON MODE FILTER
Disclosed herein is a common mode filter that includes a winding core part and first and second wires wound in a same direction around the winding core part. The first and second wires constitute a first winding block on one endmost side in an axial direction of the winding core part, a second winding block on other endmost side in the axial direction of the winding core part, and a third winding block positioned between the first and second winding blocks. The second winding block is a winding block at an odd-numbered position counted from the first winding block. The first and second wires cross each other in an area between the first and third winding blocks and in an area between the second and third winding blocks.
COMPLEX ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
A complex electronic component includes: an element part and an electrostatic discharge (ESD) protection part disposed on the element part. The ESD protection part includes: first and second discharging electrodes having a gap disposed therebetween; a blocking layer disposed between the first and second discharging electrodes; and a discharging layer which is disposed to cover an upper portion of the blocking layer and is in contact with top surfaces of the first and second discharging electrodes.
COMPLEX ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
A complex electronic component includes: an element part and an electrostatic discharge (ESD) protection part disposed on the element part. The ESD protection part includes: first and second discharging electrodes having a gap disposed therebetween; a blocking layer disposed between the first and second discharging electrodes; and a discharging layer which is disposed to cover an upper portion of the blocking layer and is in contact with top surfaces of the first and second discharging electrodes.
Transient noise reduction filtering system
A transient noise reduction filter comprises a cable including one or more twisted pairs of conductors and one or more common mode chokes (CMCs). The one or more CMCs a formed from respective pluralities of turns of the cable. Each of the CMCs may be a magnetic CMC wherein the plurality of turns of the cable are wrapped around a magnetic core, or an air-core CMC wherein the plurality of turns of the cable are not wrapped around a magnetic core but are instead disposed around a non-magnetic material (such as air)
RADIO FREQUENCY DEVICE
Radio frequency devices and methods are provided where a network like a filter network or impedance matching network comprises a series connection of at least two inductors.
ELECTROMAGNETIC INTERFERENCE SHIELDING CONFIGURATION OF ELECTRONIC DEVICE
An electromagnetic interference shielding configuration of an electronic device includes a housing, a connecting circuit board, at least one EMI filter, and a shielding component. The housing has an accommodating space and a shielding space. A mainboard is disposed in the accommodating space, and a connecting circuit board is disposed in the shielding space and electrically conducted to the mainboard. The at least one EMI filter is disposed on the connecting circuit board and electrically conducted to the mainboard through the connecting circuit board. The shielding component combines with the housing and covers the EMI filter. Thus the EMI filter will not have electromagnetic interferences with external electronic components and provide a stable operation of the electronic device.
ROBUST WAVEGUIDE MILLIMETER WAVE NOISE SOURCE
Aspects of the present disclosure involve a system and method for generating noise waves at millimeter wave frequencies. A noise source generator is designed to be connected to a crystalline structure for efficient heat transfer and compatibility with millimeter wave receivers. The use of crystalline structure coupled to the noise source generator allows heat from a biasing device, such as a diode, to be carried away such that the diode is able to generate noise waves while being reversed biased without compromising the device. In another embodiment, the noise source generator includes the use of a backshort transmission line with vias that is connected to the biasing device for heat transfer from the biasing device to the backshort.
Multilayer electronic component
A multilayer electronic component includes: a body including one or more ceramic layers or magnetic layers; an inductor part including coil portions disposed in the body to be perpendicular to a lower surface of the body; a plurality of internal electrodes disposed in the body to be perpendicular to the lower surface of the body; and an input terminal, an output terminal, and a ground terminal disposed on the lower surface of the body, wherein the body includes a capacitor part comprising at least one among the plurality of internal electrodes and at least one among the coil portions with at least one of the ceramic layers or magnetic layers interposed therebetween.
CIRCUIT BOARD AND ELECTRONIC CIRCUIT MODULE USING THE SAME
Disclosed herein is an electronic circuit module that includes a circuit board and a common mode filter mounted on the circuit board. The common mode filter includes first and second terminal electrodes constituting a first pair of terminal electrodes and third and fourth electrodes constituting a second pair of terminal electrodes. The circuit board includes: a first wiring layer having first, second, third, and fourth land patterns connected to the first, second, third, and fourth terminal electrodes, respectively, and first, second, third, and fourth wiring patterns connected to the first, second, third, and fourth land patterns, respectively; and a second wiring layer having a ground pattern that overlaps the first, second, third, and fourth wiring patterns without overlapping the first and second land patterns.