An apparatus includes a plurality of transceiver circuits, each comprising one or more phase shifter circuits. The phase shifter circuits may be configured to make a phase change by switching at least one of a capacitance value and an inductance value in response to a control signal. A characteristic impedance and the phase of each phase shifter circuit are correlated such that after the phase change, a value of the characteristic impedance is maintained at a predefined value.

A system may include a first conductive plate configured at least to receive an input signal. The system may include a second conductive plate configured at least to output an output signal. The system may further include a memristor material positioned between the first conductive plate and the second conductive plate.

A transistor amplifier includes a die comprising a gate terminal, a drain terminal, and a source terminal, a circuitry module on the transistor die and electrically coupled to the gate terminal, the drain terminal, and/or the source terminal, and one or more passive electrical components on a first surface of the circuitry module. The one or more passive electrical components are electrically coupled between the gate terminal and a first lead of the transistor amplifier and/or between the drain terminal and a second lead of the transistor amplifier.

RF transistor amplifiers include an RF transistor amplifier die having a semiconductor layer structure, a coupling element on an upper surface of the semiconductor layer structure, and an interconnect structure on an upper surface of the coupling element so that the RF transistor amplifier die and the interconnect structure are in a stacked arrangement. The coupling element includes a first shielded transmission line structure.

A system may include a first conductive plate configured at least to receive an input signal. The system may include a second conductive plate configured at least to output an output signal. The system may further include a memristor material positioned between the first conductive plate and the second conductive plate.

An electronic device may include wireless circuitry having an LC filter. The LC filter may include first and second series inductors coupled between the input and output of the LC filter. An input capacitor can be coupled at the input of the LC filter, and an output capacitor can be coupled at the output of the LC filter. Feedforward capacitors can be cross-coupled with the first and second series inductors to at least partially or fully cancel out any parasitic capacitance associated with the first and second series inductors to mitigate any undesired self-resonant effects associated with the series inductors.

A magnetoresistive effect element includes: a first ferromagnetic layer; a second ferromagnetic layer; and a non-magnetic layer located between the first ferromagnetic layer and the second ferromagnetic layer, wherein a crystal structure of the non-magnetic layer is a spinel structure, wherein the non-magnetic layer contains Mg, Al, X, and O as elements constituting the spinel structure, and wherein the X is at least one or more elements selected from a group consisting of Ti, Pt, and W.

The magnetoresistance effect device includes: a magnetoresistance effect element that includes a first magnetization free layer, a magnetization fixed layer or a second magnetization free layer, and a spacer layer interposed between the first magnetization free layer and the magnetization fixed layer or the second magnetization free layer; and a magnetic material part that applies a magnetic field to the magnetoresistance effect element, wherein the magnetic material part is arranged to surround an outer circumference of the magnetoresistance effect element in a plan view in a stacking direction L of the magnetoresistance effect element.

The magnetoresistance effect device includes: a magnetoresistance effect element that includes a first magnetization free layer, a magnetization fixed layer or a second magnetization free layer, and a spacer layer interposed between the first magnetization free layer and the magnetization fixed layer or the second magnetization free layer; and a magnetic material part that applies a magnetic field to the magnetoresistance effect element, wherein the magnetic material part is arranged to surround an outer circumference of the magnetoresistance effect element in a plan view in a stacking direction L of the magnetoresistance effect element.

A nonmagnetic spacer layer in a magnetoresistive effect element includes a nonmagnetic metal layer that is formed of Ag and at least one of a first insertion layer that is disposed on a bottom surface of the nonmagnetic metal layer and a second insertion layer that is disposed on a top surface of the nonmagnetic metal layer. The first insertion layer and the second insertion layer include an Fe alloy that is expressed by Fe.sub.X.sub.1-. Here, X denotes one or more elements selected from a group consisting of O, Al, Si, Ga, Mo, Ag, and Au, and satisfies 0<y<1.