A semiconductor device includes first, second and third stacked chips with a first, second and third substrate, respectively, at least three first, second and third logical circuits, respectively, and at least two first, second and third vias, respectively, and a fourth chip stacked on the third chip having a fourth substrate, and at least three fourth logical circuits. First and second ones of the first to third logical circuits of the first to fourth chips are each configured to perform a first and second logical operation, respectively, on a first and second address input signal, respectively, received at the respective chip to thereby output a first and second address output signal, respectively. Third ones are each configured to activate the respective chip based on at least the second address output signal transmitted within the respective chip.

A semiconductor device includes first, second and third stacked chips with a first, second and third substrate, respectively, at least three first, second and third logical circuits, respectively, and at least two first, second and third vias, respectively, and a fourth chip stacked on the third chip having a fourth substrate, and at least three fourth logical circuits. First and second ones of the first to third logical circuits of the first to fourth chips are each configured to perform a first and second logical operation, respectively, on a first and second address input signal, respectively, received at the respective chip to thereby output a first and second address output signal, respectively. Third ones are each configured to activate the respective chip based on at least the second address output signal transmitted within the respective chip.

A semiconductor device includes first, second and third stacked chips with a first, second and third substrate, respectively, at least three first, second and third logical circuits, respectively, and at least two first, second and third vias, respectively, and a fourth chip stacked on the third chip having a fourth substrate, and at least three fourth logical circuits. First and second ones of the first to third logical circuits of the first to fourth chips are each configured to perform a first and second logical operation, respectively, on a first and second address input signal, respectively, received at the respective chip to thereby output a first and second address output signal, respectively. Third ones are each configured to activate the respective chip based on at least the second address output signal transmitted within the respective chip.

A semiconductor device includes first, second and third stacked chips with a first, second and third substrate, respectively, at least three first, second and third logical circuits, respectively, and at least two first, second and third vias, respectively, and a fourth chip stacked on the third chip having a fourth substrate, and at least three fourth logical circuits. First and second ones of the first to third logical circuits of the first to fourth chips are each configured to perform a first and second logical operation, respectively, on a first and second address input signal, respectively, received at the respective chip to thereby output a first and second address output signal, respectively. Third ones are each configured to activate the respective chip based on at least the second address output signal transmitted within the respective chip.

A semiconductor device includes first, second and third stacked chips with a first, second and third substrate, respectively, at least three first, second and third logical circuits, respectively, and at least two first, second and third vias, respectively, and a fourth chip stacked on the third chip having a fourth substrate, and at least three fourth logical circuits. First and second ones of the first to third logical circuits of the first to fourth chips are each configured to perform a first and second logical operation, respectively, on a first and second address input signal, respectively, received at the respective chip to thereby output a first and second address output signal, respectively. Third ones are each configured to activate the respective chip based on at least the second address output signal transmitted within the respective chip.

A semiconductor device includes a first chip having a first via and a second via through the first chip; and a second chip provided on the first chip and having a third via and a fourth via through the second chip. The first chip includes: a first logical operation circuit configured to perform a first logical operation (NOT) on a first address input signal to output a first address output signal to the second chip through the first via; a second logical operation circuit connected to the first logical operation circuit, the second logical operation circuit being configured to perform a second logical operation (XOR) on a second address input signal and the first address output signal to output a second address output signal to the second chip through the second via; and a first activation circuit connected to the second logical operation circuit, the first activation circuit being configured to activate the first chip based on at least the second address output signal.

A semiconductor device includes a first chip having a first via and a second via through the first chip; and a second chip provided on the first chip and having a third via and a fourth via through the second chip. The first chip includes: a first logical operation circuit configured to perform a first logical operation (NOT) on a first address input signal to output a first address output signal to the second chip through the first via; a second logical operation circuit connected to the first logical operation circuit, the second logical operation circuit being configured to perform a second logical operation (XOR) on a second address input signal and the first address output signal to output a second address output signal to the second chip through the second via; and a first activation circuit connected to the second logical operation circuit, the first activation circuit being configured to activate the first chip based on at least the second address output signal.

A mechanism is described for facilitating dynamic pipelining of workload executions at graphics processing units on computing devices. A method of embodiments, as described herein, includes generating a command buffer having a plurality of kernels relating to a plurality of workloads to be executed at a graphics processing unit (GPU), and pipelining the workloads to be processed at the GPU, where pipelining includes scheduling each kernel to be executed on the GPU based on at least one of availability of resource threads and status of one or more dependency events relating to each kernel in relation to other kernels of the plurality of kernels.

A mechanism is described for facilitating dynamic pipelining of workload executions at graphics processing units on computing devices. A method of embodiments, as described herein, includes generating a command buffer having a plurality of kernels relating to a plurality of workloads to be executed at a graphics processing unit (GPU), and pipelining the workloads to be processed at the GPU, where pipelining includes scheduling each kernel to be executed on the GPU based on at least one of availability of resource threads and status of one or more dependency events relating to each kernel in relation to other kernels of the plurality of kernels.

A semiconductor device includes a first chip having a first via and a second via through the first chip; and a second chip provided on the first chip and having a third via and a fourth via through the second chip. The first chip includes: a first logical operation circuit configured to perform a first logical operation (NOT) on a first address input signal to output a first address output signal to the second chip through the first via; a second logical operation circuit connected to the first logical operation circuit, the second logical operation circuit being configured to perform a second logical operation (XOR) on a second address input signal and the first address output signal to output a second address output signal to the second chip through the second via; and a first activation circuit connected to the second logical operation circuit, the first activation circuit being configured to activate the first chip based on at least the second address output signal.