Methods, systems, and apparatus, for a stray-light testing station. In one aspect, the stray-light testing station includes an illumination assembly including a spatially extended light source and one or more optical elements arranged to direct a beam of light from the spatially extended light source along an optical path to an optical receiver assembly including a lens receptacle configured to receive a lens module and position the lens module in the optical path downstream from the parabolic mirror so that the lens module focuses the beam of light from the spatially extended light source to an image plane, and a moveable frame supporting the optical receiver assembly including one or more adjustable alignment stages to position the optical receiver assembly relative to the illumination assembly such that the optical path of the illumination assembly is within a field of view of the optical receiver assembly.

The present invention relates to a high-speed imaging sensor system in which single-photon detectors are provided in an architecture adapted for high-speed processing of the output of the detectors with high reliability to filter out false positives.

Provided are a vision sensor, an image processing device including the same, and an operating method of the vision sensor. The vision sensor includes a pixel array including a plurality of pixels, a synchronization control module configured to receive a synchronization signal from an external image sensor and generate an internal trigger signal based on the synchronization signal, an event detection circuit configured to receive the internal trigger signal and detect whether an event has occurred in the plurality of pixels and generate event signals corresponding to pixels in which the event has occurred, and an interface circuit configured to receive the event signals and transmit to an external processor vision sensor data based on the trigger signal and at least one of the event signals, where the vision sensor data includes matching information for timing image frame information generated by the image sensor and the event signals generated by the vision sensor.

An image sensor including: first and second capacitors; a first transistor between a photodiode and a floating diffusion node, and receiving a transfer signal; a second transistor between a first power terminal and the floating diffusion node and receiving a reset signal; a third transistor between a second power terminal and a first node and having a gate connected to the floating diffusion node; a fourth transistor between the first node and a column line and receiving a precharge signal; a fifth transistor between the first capacitor and a feedback node and receiving a first sampling signal; a sixth transistor between the second capacitor and feedback node and receiving a second sampling signal; a seventh transistor between the first node and feedback node and receiving a first switch signal; and an eighth transistor between the floating diffusion and feedback nodes and receiving a second switch signal.

An optical sensor device may include an optical sensor that includes a set of sensor elements; an optical filter that includes one or more channels; a phase mask configured to distribute a plurality of light beams associated with a subject in an encoded pattern on an input surface of the optical filter; and one or more processors. The one or more processors may be configured to obtain, from the optical sensor, sensor data associated with the subject and may determine a distance of the subject from the optical sensor device. The one or more processors may select, based on the distance, a processing technique to process the sensor data, wherein the processing technique is an imaging processing technique or a spectroscopic processing technique. The one or more processors may process, using the selected processing technique, the sensor data to generate output data and may provide the output data.

An image sensor includes a plurality of pixels configured to receive an optical signal incident through a first lens portion; a planarization layer that has a same refractive index as a refractive index of the first lens portion; a second lens portion that is configured to classify the optical signal incident through the first lens portion according to an incidence angle, and is configured to deliver the optical signal to each of the plurality of pixels; and image processing circuitry configured to generate a subject image by combining one or more subimages obtained from the optical signal, wherein the planarization layer is arranged between the second lens portion and the plurality of pixels.

A quantitative pulse count (event detection) algorithm with linearity to high count rates is accomplished by combining a high-speed, high frame rate camera with simple logic code run on a massively parallel processor such as a GPU or a FPGA. The parallel processor elements examine frames from the camera pixel by pixel to find and tag events or count pulses. The tagged events are combined to form a combined quantitative event image.

Improvement of noise characteristics is achievable. A solid-state imaging device according to an embodiment includes a plurality of photoelectric conversion elements (333) arranged in a two-dimensional grid shape in a matrix direction and each generating a charge corresponding to a received light amount, and a detection unit (400) that detects a photocurrent produced by the charge generated in each of the plurality of photoelectric conversion elements. A chip (201a) on which the photoelectric conversion elements are disposed and a chip (201b) on which at least a part of the detection unit is disposed are different from each other.

A reduction in the visibility of an alignment mark of an imaging device configured by bonding a plurality of semiconductor substrates together is prevented. An imaging element includes a semiconductor substrate, a pad, an alignment mark, and a light shielding film. The semiconductor substrate includes a pixel region which is a region in which pixels for generating an image signal in accordance with incident light are disposed. The pad is disposed on a surface side of the semiconductor substrate. The alignment mark is disposed on a back surface side of the semiconductor substrate. The light shielding film is disposed between the pad and the alignment mark.

The present embodiment relates to a dual camera module comprising: a rigid first substrate having a first image sensor arranged thereon; a rigid second substrate spaced apart from the first substrate and having a second image sensor arranged thereon; a third substrate connected to the first substrate and the second substrate; and a flexible connection unit for connecting the first substrate to the second substrate, wherein the first substrate includes a first side surface, the second substrate includes a second side surface facing the first side surface, and the connection unit connects the first side surface of the first substrate to the second side surface of the second substrate.