An image sensor according to an embodiment of the present invention includes: a pixel array in which a plurality of pixels are arrayed in a grid shape, and which converts reflection light signals reflected from an object into electrical signals; an image processor which converts the electrical signals to generate subframes, and extracts pieces of second depth information having a higher resolution than pieces of first depth information extracted from a plurality of the subframes; and a memory for storing the pieces of first depth information, wherein the reflection light signals are input to the pixel array through mutually different optical paths shifted in sub-pixel units of the pixel array, and the memory stores a plurality of the pieces of first depth information that correspond to the mutually different optical paths.

The present embodiment relates to a dual camera module comprising: a rigid first substrate having a first image sensor arranged thereon; a rigid second substrate spaced apart from the first substrate and having a second image sensor arranged thereon; a third substrate connected to the first substrate and the second substrate; and a flexible connection unit for connecting the first substrate to the second substrate, wherein the first substrate includes a first side surface, the second substrate includes a second side surface facing the first side surface, and the connection unit connects the first side surface of the first substrate to the second side surface of the second substrate.

An optical sensor device may include an optical sensor that includes a set of sensor elements; an optical filter that includes one or more channels; a phase mask configured to distribute a plurality of light beams associated with a subject in an encoded pattern on an input surface of the optical filter; and one or more processors. The one or more processors may be configured to obtain, from the optical sensor, sensor data associated with the subject and may determine a distance of the subject from the optical sensor device. The one or more processors may select, based on the distance, a processing technique to process the sensor data, wherein the processing technique is an imaging processing technique or a spectroscopic processing technique. The one or more processors may process, using the selected processing technique, the sensor data to generate output data and may provide the output data.

An optical sensor device may include an optical sensor that includes a set of sensor elements; an optical filter that includes one or more channels; a phase mask configured to distribute a plurality of light beams associated with a subject in an encoded pattern on an input surface of the optical filter; and one or more processors. The one or more processors may be configured to obtain, from the optical sensor, sensor data associated with the subject and may determine a distance of the subject from the optical sensor device. The one or more processors may select, based on the distance, a processing technique to process the sensor data, wherein the processing technique is an imaging processing technique or a spectroscopic processing technique. The one or more processors may process, using the selected processing technique, the sensor data to generate output data and may provide the output data.

An endoscope includes an image pickup apparatus, and the image pickup apparatus includes an imager includes an external electrode, a stacked device, a top electrode on a top surface, and a bottom electrode on a bottom surface, a three-dimensional wiring board having a first zone to which the external electrode is bonded, a second zone to which the top electrode or the bottom electrode is bonded, a third zone to which the top electrode or the bottom electrode is bonded, and a fifth zone arranged on a side surface of the stacked device, wherein the top surface, the bottom surface, and at least two side surfaces of the stacked device are covered with the wiring board.

Time deviation between event detection and gradation acquisition is reduced. A solid-state imaging apparatus according to an embodiment includes: a pixel array unit (300) including a plurality of pixel blocks (310) arrayed in a matrix; and a drive circuit (211) that generates a pixel signal in a first pixel block in which firing of an address event has been detected among the plurality of pixel blocks, each of the plurality of pixel blocks including a first photoelectric conversion element (331) that generates an electric charge according to an amount of incident light, a detection unit (400) that detects the firing of the address event based on the electric charge generated in the first photoelectric conversion element, a second photoelectric conversion element (321) that generates an electric charge according to an amount of incident light, and a pixel circuit (322, 323, 324, 325, 326) that generates a pixel signal based on the electric charge generated in the second photoelectric conversion element.

Fabrication processing is executed in a chip of an image sensor. An image capturing device includes an image capturing unit (11) mounted on a vehicle and configured to generate image data by performing image capturing of a peripheral region of the vehicle, a scene recognition unit (214) configured to recognize a scene of the peripheral region based on the image data, and a drive control unit (12) configured to control drive of the image capturing unit based on the scene recognized by the scene recognition unit.

An image capture device includes a plurality of independently formed camera channels. Each of the plurality of independently formed camera channels includes a respective lens that receives incident light and transmits the incident light to a respective sensor without transmitting the incident light to respective sensor of other camera channels within the plurality of independently formed camera channels. Further, a processor that is communicatively coupled to the respective sensor of each of the plurality of independently formed camera channels. The processor is configured to control an integration time of the respective sensor of each of the plurality of independently formed camera channels individually with the receive respective images from the respective sensor of each of the plurality of independently formed camera channels, and form a combined image by combing each of the respective images.

An image capture device includes a plurality of independently formed camera channels. Each of the plurality of independently formed camera channels includes a respective lens that receives incident light and transmits the incident light to a respective sensor without transmitting the incident light to respective sensor of other camera channels within the plurality of independently formed camera channels. Further, a processor that is communicatively coupled to the respective sensor of each of the plurality of independently formed camera channels. The processor is configured to control an integration time of the respective sensor of each of the plurality of independently formed camera channels individually with the receive respective images from the respective sensor of each of the plurality of independently formed camera channels, and form a combined image by combing each of the respective images.

Images can be processed using an image processing apparatus including: an image data obtaining section that obtains at least two pieces of parallax image data from an image capturing element that includes color filters and opening masks so that one color filter and one opening mask correspond to one of at least a part of photoelectric conversion elements and outputs the at least two pieces of parallax image data; and a correcting section that corrects color imbalance of a corresponding pixel caused between the at least two pieces of parallax image data, based on at least one of a position of the at least a part of photoelectric conversion elements in the image capturing element and an opening displacement of the opening mask.