The present disclosure provides an acoustic transducer unit and a manufacturing method thereof, and an acoustic transducer, the acoustic transducer unit includes: a base substrate; a first electrode on the base substrate; a support pattern on a side of the first electrode away from the base substrate, which is enclosed into an accommodation groove, at least one release groove and at least one connection groove, an orthographic projection of the release groove on the base substrate is spaced apart from that of the accommodation groove on the base substrate, the connection groove is between the accommodation groove and the release groove to communicate them; a diaphragm pattern on the side of the first electrode away from the base substrate and capable of vibrating in the accommodation groove; a filling pattern in the release groove; a second electrode on a side of the diaphragm pattern away from the base substrate.

Disclosed is an electronic device including a sound output module. The sound output module includes a sound output housing and a motor unit positioned in an inner space and communicating with an inner space of the speaker unit to generate a vibration force. The motor unit may include a motor body forming a volume space communicating with the inner space of the speaker unit and a vibration body positioned in the motor body to generate a vibration force. A communication hole may be formed in an outer wall of the motor body for the inner space of the speaker unit and the volume space to communicate with each other.

An integrated structure of a MEMS microphone and an air pressure sensor, and a fabrication method for the integrated structure, the structure including a base substrate; a vibrating membrane, back electrode, upper electrode, and lower electrode formed on the base substrate, as well as a sacrificial layer formed between the vibrating membrane and the back electrode and between the upper electrode and the lower electrode; a first integrated circuit electrically connected to the vibrating membrane and the back electrode respectively; and a second integrated circuit electrically connected to the lower electrode and the upper electrode respectively, wherein a region of the base substrate corresponding to the vibrating membrane is provided with a back cavity; the sacrificial layer between the vibrating membrane and the back electrode is hollowed out to from a vibrating space that communicates with the exterior of the integrated structure, and the sacrificial layer between the upper electrode and the lower electrode is hollowed out to form a closed space; and the integrated circuits are formed on a chip, thereby reducing the interference of connection lines on the performance of a microphone, reducing the introduction of noise, reducing the size of a product and reducing power consumption.

A force feedback actuator includes a pair of electrodes and a dielectric member. The pair of electrodes are spaced apart from one another to form a gap. The dielectric member is disposed at least partially within the gap. The dielectric member includes a first portion having a first permittivity and a second portion having a second permittivity that is different from the first permittivity. The dielectric member and the pair of electrodes are configured for movement relative to each other.

A microphone and its manufacturing method, relating the semiconductor techniques, are presented. The microphone comprises: a substrate comprising an opening, a first electrode layer at the bottom of the opening, and at least one groove adjacent to the first electrode layer, with the groove and the opening on two opposing sides of a bottom surface of the first electrode layer; a separation material layer filling the groove; and a second electrode layer on the separation material layer, wherein the first electrode layer, the separation material layer, and the second electrode layer form a cavity. In this inventive concept, the separation material layer on the groove works as an anchor node embedding in the substrate to increases the effective contact area and the bonding power, and to improve the bonding quality between the second electrode layer and the substrate, which results in a strengthened second electrode layer.

A method includes a step of forming a sacrificial layer on a first film, a step of forming a second film on the sacrificial layer, a step of forming an etching opening that extends through at least one of the first film and the second film so as to communicate with the sacrificial layer, and a step of forming a hollow portion by etching the sacrificial layer using a gas containing a fluorine-containing gas and hydrogen via the etching opening, wherein a composition ratio of silicon to nitrogen in a first region having a face in contact with the sacrificial layer is larger than a composition ratio of silicon to nitrogen in a second region not including the first region.

A method includes a step of forming a sacrificial layer on a first film, a step of forming a second film on the sacrificial layer, a step of forming an etching opening that extends through at least one of the first film and the second film so as to communicate with the sacrificial layer, and a step of forming a hollow portion by etching the sacrificial layer using a gas containing a fluorine-containing gas and hydrogen via the etching opening, wherein a composition ratio of silicon to nitrogen in a first region having a face in contact with the sacrificial layer is larger than a composition ratio of silicon to nitrogen in a second region not including the first region.

A foil transducer for a valve, including at least one firmly arranged holding part, at least one displaceable force transmission part, an electroactive foil composite structure and at least two electrodes. The electroactive foil composite structure has an actuating direction in which the electroactive foil composite structure is extended on actuation. The actuating direction lies in a plane spanned by the electroactive foil composite structure.

A sensor includes a membrane electrode, a counter-electrode, and at least one spring. The sensor can include a structure; a membrane electrode, which is deformable as a consequence of pressure and which is in contact with the structure; a counter-electrode mechanically connected to the structure and separated from the membrane electrode by a gap; and at least one spring mechanically connected to the membrane electrode and the counter-electrode, so as to exert an elastic force between the membrane electrode and the counter-electrode.

A transducer assembly can include a base. The transducer assembly can include a stress isolation standoff located on the base. The transducer assembly can include a MEMS die disposed on the stress isolation standoff. The transducer assembly can include a die attach adhesive disposed between the MEMS die and the base. The die attach adhesive can bond the MEMS die to the base. The stress isolation standoff can be embedded in the die attach adhesive between the base and the MEMS die.