H04R19/00

MEMS MICROPHONE
20230192473 · 2023-06-22 ·

A MEMS microphone includes a substrate, a base, a capacitance system, and at least one cantilever structure. The substrate includes a back cavity, the base is disposed on one side of the substrate, and the capacitance system is disposed on the base. The capacitance system includes at least one back plate assembly, at least one first vibration diaphragm, and at least one second vibration diaphragm. The at least one first vibration diaphragm includes a first sub-vibration diaphragm, and the at least one second vibration diaphragm includes a second sub-vibration diaphragm. The sub-vibration diaphragm and the second sub-vibration diaphragm form a cantilever beam structure on the base, which increase compliance of the at least one first vibration diaphragm and the at least one second vibration diaphragm and reduce tension of the at least one first vibration diaphragm and the at least one second vibration diaphragm, thereby improving sensitivity of the microphones.

MEMS MICROPHONE AND METHOD OF MANUFACTURING THE SAME
20170359648 · 2017-12-14 ·

A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate to cover the cavity and having a plurality of acoustic holes, a diaphragm disposed over the substrate to cover the cavity, the diaphragm being disposed under the back plate, including a venting hole communicating with the cavity, and sensing an acoustic pressure to create a displacement, and a first insulation layer interposed between the substrate and the diaphragm to support an end portion of the diaphragm to separate the diaphragm from the substrate, and the first insulation layer having an opening formed at a position corresponding to the cavity to expose the diaphragm. Thus, since the process of forming an anchor may be omitted, the process may be simplified, and process time may be shortened.

Acoustic transducer

Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.

Support structure and method of forming a support structure

A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.

Two-way communication system and method of use

The two-way communication system comprises a non-invasive and non-implanted system which allows for clear two-way communications. This system is generally comprised of a mouthpiece component, relay component, infrastructure communication device, an optional earpiece component, and an optional system control which may interface with the relay component.

Direction finding system using MEMS sound sensors

Provided is a Direction Finding Acoustic Sensor comprising a first sound sensor and a second sound sensor, where the first and second sound sensors are generally maintained in a reflectional symmetry around an axis of symmetry. A digital device in data communication both sound sensors receives a signal P.sub.L from the first sensor a signal P.sub.R from the second sensor based on displacement respective sensors. The digital device evaluates a difference between an α.sub.1P.sub.L and an α.sub.2P.sub.R relative to a sum of the α.sub.1P.sub.L and the α.sub.2P.sub.R, and provides an angle θ.sub.S corresponding to the result. Typically, the Direction Finding Acoustic Sensor communicates the θ.sub.s determined using some appropriate reference frame, such as the axis of symmetry. The Direction Finding Acoustic Sensor is capable of providing an unambiguous direction within an angle of ±(90°−θ.sub.off) of the axis of symmetry.

MEMS device and manufacturing method thereof

A MEMS device and a method for manufacturing a MEMS device are provided. The MEMS device includes an anchor, a diaphragm structure, and a sealing film. The diaphragm structure is disposed over the anchor and has an opening through the diaphragm structure. The sealing film covers at least a portion of the opening of the diaphragm structure.

MEMS SOUND TRANSDUCER WITH A CURVED CONTOUR OF A CANTILEVER ARM ELEMENT

A MEMS sound transducer for generating and/or detecting sound waves includes a support having a cavity wall which at least partially delimits a cavity of the MEMS sound transducer. At least one cantilever arm element includes a base section that is fixedly connected to the support. Each cantilever arm includes a flexible deflection section overhanging the cavity wall. At one end of the deflection portion is a base end that is disposed to face the cavity wall. Opposite the base end is a free end that is configured to be deflectable relative to the support in the direction of a stroke axis of the MEMS sound transducer. The base end of the deflection section in a sound transducer top view has a curved first contour.

MICROPHONE DEVICE WITH INTEGRATED PRESSURE SENSOR

A microphone device comprises a microphone die including a first microphone motor and a second microphone motor, an acoustic integrated circuit structured to process signals produced by the first microphone motor and the second microphone motor, and a sensor die stacked on top of the acoustic integrated circuit, wherein the sensor die comprises a pressure sensor. Another microphone comprises a microphone die including a first microphone motor and a second microphone motor and an integrated circuit die. The integrated circuit die comprises an acoustic integrated circuit structured to process signals produced by the first microphone motor and the second microphone motor, a pressure sensor, and a pressure integrated circuit structured to press signals produced by the pressure sensor.

MICROPHONE AND MANUFACTURING METHOD THEREOF
20170347185 · 2017-11-30 ·

A microphone includes an acoustic element including an acoustic hole; a case disposed below the acoustic element and including an acoustic inlet formed in a position corresponding to the acoustic hole; and a plurality of through holes formed between the acoustic element and the case and formed in a position corresponding to the acoustic hole.