A MEMS device includes a MEMS substrate with a movable element. Further included is a CMOS substrate with a cavity, the MEMS substrate disposed on top of the CMOS substrate. Additionally, a back cavity is connected to the CMOS substrate, the back cavity being formed at least partially by the cavity in the CMOS substrate and the movable element being acoustically coupled to the back cavity.

Provided are a silicon-based microphone device and an electronic apparatus. The silicon-based microphone device comprises: a circuit board, wherein at least two sound inlets are formed on the circuit board; a shielding housing that covers one side of the circuit board; an even number of differential silicon-based microphone chips that all are located in a sound cavity, wherein in each two differential silicon-based microphone chips, the first microphone structure of one differential silicon-based microphone chip is electrically connected to the second microphone structure of the other differential silicon-based microphone chip, and the second microphone structure of said one differential silicon-based microphone chip is electrically connected to the first microphone structure of said other differential silicon-based microphone chip; and a mounting plate, wherein an even number of holes communicated with the sound inlets are formed on the mounting plate.

A MEMS acoustic transducer provided with: a substrate of semiconductor material, having a back surface and a front surface opposite with respect to a vertical direction; a first cavity formed within the substrate, which extends from the back surface to the front surface; a membrane which is arranged at the upper surface, suspended above the first cavity and anchored along a perimeter thereof to the substrate; and a combfingered electrode arrangement including a number of mobile electrodes coupled to the membrane and a number of fixed electrodes coupled to the substrate and facing respective mobile electrodes for forming a sensing capacitor, wherein a deformation of the membrane as a result of incident acoustic pressure waves causes a capacitive variation of the sensing capacitor. In particular, the combfingered electrode arrangement lies vertically with respect to the membrane and extends parallel thereto.

A robust MEMS transducer includes a kinetic energy diverter disposed within its frontside cavity. The kinetic energy diverter blunts or diverts kinetic energy in a mass of air moving through the frontside cavity, before that kinetic energy reaches a diaphragm of the MEMS transducer. The kinetic energy diverter renders the MEMS transducer more robust and resistant to damage from such a moving mass of air.

A method of fabricating a plurality of MEMS microphone modules by providing a first substrate wafer 62 on which are mounted a plurality of sets comprising an LED 102, an IC chip 22 and a MEM microphone device 24, where the LED 102 and IC chip 22 are surrounded and separated by first spacers 104, 64A, 64, the spacer 104 being much taller, attaching a second substrate on top of the first spacer elements above the IC chip 22, mounting a MEMS microphone device 24 to the second substrate 60, the second substrate not extending over the LED 102, surrounding the MEMS microphone device by second spacers 32A, 32, attaching a cover wafer 28 across the whole first substrate wafer 62 covering all the plurality of sets, forming openings 30 to the MEMS cavities, dividing the substrate wafer 62 into individual MEMS microphone modules through the width of the separating spacers 104, 32, 64. Conductive traces may extend through the spacers. Also defined are MEMS modules without LED's, without stacking, on a single substrate, or on either side of a single substrate.

A Micro-Electro-Mechanical System (MEMS) device includes a substrate, and a first sacrificial layer, a first conductive film, a second sacrificial layer, and a second conductive film successively laminated on the substrate, the second sacrificial layer being provided with a cavity; and further includes an amplitude-limiting layer provided with a first through hole and an isolation layer provided with a second through hole. The amplitude-limiting layer is located between the first conductive film and the first sacrificial layer and the isolation layer is located between the amplitude-limiting layer and the first conductive film, and/or the amplitude-limiting layer is located on the second conductive film and the isolation layer is located between the amplitude-limiting layer and the second conductive film. The amplitude-limiting layer extends to a projection region of an opening of the cavity and is in a suspended state.

An improved compact electroacoustic transducer and loudspeaker system. The electroacoustic transducer (or array of electroacoustic transducers) can generate the desired sound by the use of pressurized airflow. The electroacoustic transducer uses a shared stator with an array of vent support fingers and metal frame instead of two stators per electroacoustic transducer.

An improved compact electroacoustic transducer and loudspeaker system. The electroacoustic transducer (or array of electroacoustic transducers) can generate the desired sound by the use of pressurized airflow. The electroacoustic transducer uses a shared stator with an array of vent support fingers and metal frame instead of two stators per electroacoustic transducer.

A control circuit for an electrostatic transducer including: an audio signal input, a detector configured to detect a current or charge signal from the electrostatic transducer. The detector is configured to produce an audio output signal varying at audio frequencies. A transform circuit is configured to transform the audio output signal to produce a feedback signal. A comparator is configured to compare an input audio signal at the audio signal input to the feedback signal to produce an error signal. A controller is configured to input a control signal to the electrostatic transducer, the control signal responsive to the error signal. The control signal is configured to control acoustic transparency of the electrostatic transducer, from outside space through through-holes of the first electrode, across the membrane and through through-holes of the second electrode.

Provided are a silicon-based microphone device and an electronic device. The silicon-based microphone device comprises a circuit board, a shielding housing and at least two differential silicon-based microphone chips, wherein at least two sound inlet holes are provided on the circuit board, the shielding housing covers one side of the circuit board and forms a sound cavity with the circuit board, the silicon-based microphone chips are all located inside the sound cavity, the differential silicon-based microphone chips are respectively disposed at the sound inlet holes, and a back cavity of each differential silicon-based microphone chip is communicated with the sound inlet hole at the corresponding position, each of the differential silicon-based microphone chips comprises a first microphone structure and a second microphone structure, all of the first microphone structures are electrically connected, and all of the second microphone structures are electrically connected.