A transducer in which electrical connections between electrode sheets and leading wires can be secured via an approach other than soldering or welding is provided. In a sheet body portion, a dielectric layer and a first electrode sheet are joined by a first main fusion layer formed of a fusion material. A first conductive portion of a first leading wire is fixed to the sheet body portion by a first clamp. The first clamp includes a plurality of first leg portions that penetrates the sheet body portion in a thickness direction, a first coupling portion that couples the proximal ends of the plurality of first leg portions and is disposed across the first conductive portion, and a plurality of first bent-back portions that is formed by bending the respective distal ends of the plurality of first leg portions and is locked with a second surface of the sheet body portion.

A transducer in which electrical connections between electrode sheets and leading wires can be secured via an approach other than soldering or welding is provided. In a sheet body portion, a dielectric layer and a first electrode sheet are joined by a first main fusion layer formed of a fusion material. A first conductive portion of a first leading wire is fixed to the sheet body portion by a first clamp. The first clamp includes a plurality of first leg portions that penetrates the sheet body portion in a thickness direction, a first coupling portion that couples the proximal ends of the plurality of first leg portions and is disposed across the first conductive portion, and a plurality of first bent-back portions that is formed by bending the respective distal ends of the plurality of first leg portions and is locked with a second surface of the sheet body portion.

A MEMS may include a backplate comprising first and second electrodes electrically isolated from one another and mechanically coupled to the backplate in a fixed relationship relative to the backplate, and a diaphragm configured to mechanically displace relative to the backplate as a function of sound pressure incident upon the diaphragm. The diaphragm may comprise third and fourth electrodes electrically isolated from one another and mechanically coupled to the diaphragm in a fixed relationship relative to the diaphragm such that the third and fourth electrodes mechanically displace relative to the backplate as the function of the sound pressure. The first and third electrodes may form a first capacitor, the second and fourth electrodes may form a second capacitor, and the first capacitor may be configured to sense a displacement of the diaphragm responsive to which the second capacitor may be configured to apply an electrostatic force to the diaphragm to return the diaphragm to an original position.

A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.

The present invention disclosed a micro acoustic collector with a lateral cavity, comprising: a base metal layer; a movable film, an annular side wall; a lateral metal layer. The movable film faces towards the base metal layer to form a hollow space. The lateral metal layer is formed at a side of the movable film and around the movable film, fixed by the annular side wall and spaced apart from peripheral of the movable film by a distance, and the lateral metal layer faces towards the base metal layer to form a lateral cavity to assist an acoustic collection.

Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generators and single-ended or differential amplifier arrangements. Various embodiments are described that can effectively increase the bias voltage available to the sensor element without resorting to high breakdown voltage semiconductor processes. In addition, control of the one or more bias voltage generators in various operating modes is described, based on consideration of a number of factors.

According to an embodiment, a circuit includes a high-Ω resistor including a plurality of semiconductor junction devices coupled in series and a plurality of additional capacitances formed in parallel with the plurality of semiconductor junction devices. Each semiconductor junction device of the plurality of semiconductor junction devices includes a parasitic doped well capacitance configured to insert a parasitic zero in a noise transfer function of the high-Ω resistor. Each additional capacitance of the plurality of additional capacitances is configured to adjust a parasitic pole in the noise transfer function of the high-Ω resistor in order to compensate for the parasitic zero.

A interface circuit for an acoustic transducer provided with a first detection structure and a second detection structure has: a first input and a second input; a first processing path and a second processing path coupled, respectively, to the first input and second input and supply a first processed signal and a second processed signal; and a recombination stage, which supplies a mixed signal by combining the first processed signal and the second processed signal with a respective weight that is a function of a first level value of the first processed signal. The first and second inputs receive a respective detection signal associated, respectively, to the first detection structure and to the second detection structure of the acoustic transducer; and an output stage the first processed signal, the second processed signal or the mixed signal, on the basis of a second level value of the first processed signal.

A micro-electro-mechanical system (MEMS) microphone package is provided in the present disclosure. The MEMS microphone package includes a circuit board, an electromagnetic shielding cover mounted on the circuit board to define an accommodating space, electronic components received in the accommodating space and electrically connected to the circuit board, and a shielding ring covering a joint between the electromagnetic shielding cover and the circuit board. The shielding ring is configured for preventing electromagnetic waves from entering the accommodating space via the joint between the electromagnetic shielding cover and the circuit board.

A microphone and a method of manufacturing the microphone are provided. The method includes; preparing a substrate and forming a vibrating membrane having an oxide film and a plurality of slots onto the substrate. A sacrificial layer and a fixed membrane is formed over the vibrating membrane and air intake apertures are formed through the fixed membrane. A first pad is connected to the fixed membrane, a second pad is connected to the vibrating membrane, and a phase delay unit is bonded to the bonding pad. A penetration aperture may be formed by etching the rear side of the substrate and bonding the phase delay unit on the bonding pad. A sound passage, is formed by connecting passage patterns, and sound apertures with the sound passages by sequentially stacking phase delay layers on the bonding pad and simultaneously forming the passage patterns in the phase delay layers.