Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.

A vacuum cleaner of the present disclosure includes a cleaner body having a suction motor provided inside thereof and a handle provided outside thereof, and a suction nozzle connected to the cleaner body, wherein the suction nozzle includes a housing having at least part of a front portion opened, and a rotary cleaning unit disposed inside the housing, having at least part thereof exposed through the opening of the housing, and configured to clean a floor by a rotating operation, wherein the rotary cleaning unit includes a cylindrical nozzle body rotatably installed inside the housing, and fiber filaments and metal filaments disposed on an outer circumferential surface of the nozzle body.

A vacuum cleaner of the present disclosure includes a cleaner body having a suction motor provided inside thereof and a handle provided outside thereof, and a suction nozzle connected to the cleaner body, wherein the suction nozzle includes a housing having at least part of a front portion opened, and a rotary cleaning unit disposed inside the housing, having at least part thereof exposed through the opening of the housing, and configured to clean a floor by a rotating operation, wherein the rotary cleaning unit includes a cylindrical nozzle body rotatably installed inside the housing, and fiber filaments and metal filaments disposed on an outer circumferential surface of the nozzle body.

Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.

Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.

Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.

Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.

A device to de-ionize a build material, a method to de-ionize, and a 3D printer system including the device are disclosed. The device includes a housing having an outlet port and an enclosed sieve within the housing. An inlet port is coupled to a first end the enclosed sieve to provide the build material. A drive actuator is coupled to a second end of the enclosed sieve. The housing and the enclosed sieve may be made of a polymer selected from the build material and a chemically-similar polymer to the build material.

An adjustable mobile electrostatic discharge cart that includes at least one extendable support connected to at least one level. One each level, a conductive plate is located on each level and covered by a conductive mat. The plate of each level is connected to a electrostatic ground connected in parallel, so that the connection to the electrostatic ground is continuous as the cart moves and the support extends. At least one caster for mobility is in contact with the floor and conductively connected to the electrostatic ground.

A vacuum cleaner of the present disclosure includes a cleaner body having a suction motor provided inside thereof and a handle provided outside thereof, and a suction nozzle connected to the cleaner body, wherein the suction nozzle includes a housing having at least part of a front portion opened, and a rotary cleaning unit disposed inside the housing, having at least part thereof exposed through the opening of the housing, and configured to clean a floor by a rotating operation, wherein the rotary cleaning unit includes a cylindrical nozzle body rotatably installed inside the housing, and fiber filaments and metal filaments disposed on an outer circumferential surface of the nozzle body.