A vacuum cleaner of the present disclosure includes a cleaner body having a suction motor provided inside thereof and a handle provided outside thereof, and a suction nozzle connected to the cleaner body, wherein the suction nozzle includes a housing having at least part of a front portion opened, and a rotary cleaning unit disposed inside the housing, having at least part thereof exposed through the opening of the housing, and configured to clean a floor by a rotating operation, wherein the rotary cleaning unit includes a cylindrical nozzle body rotatably installed inside the housing, and fiber filaments and metal filaments disposed on an outer circumferential surface of the nozzle body.

Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.

Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.

An electrical isolator comprising: a first fluid-carrying member and a second fluid-carrying member spaced apart from said first fluid-carrying member; a resistive, semi-conductive or non-conductive component located between said first and second fluid-carrying member, wherein said resistive, semi-conductive or non-conductive component is adapted to convey fluid flowing from said first fluid-carrying member to said second fluid-carrying member; wherein said first fluid-carrying member comprises a first annular projection extending radially outwardly, and said second fluid-carrying member comprises a second annular projection extending radially outwardly such that an annular cavity is formed between the first and second annular projections; wherein the electrical isolator further comprises: a layer of circumferentially wound fiber-reinforced polymer in the annular cavity; and a layer of helical wound fiber-reinforced polymer extending over the first annular projection, the annular cavity and the second annular projection.

An electrical isolator comprising: a first fluid-carrying member and a second fluid-carrying member spaced apart from said first fluid-carrying member; a resistive, semi-conductive or non-conductive component located between said first and second fluid-carrying member, wherein said resistive, semi-conductive or non-conductive component is adapted to convey fluid flowing from said first fluid-carrying member to said second fluid-carrying member; wherein said first fluid-carrying member comprises a first annular projection extending radially outwardly, and said second fluid-carrying member comprises a second annular projection extending radially outwardly such that an annular cavity is formed between the first and second annular projections; wherein the electrical isolator further comprises: a layer of circumferentially wound fiber-reinforced polymer in the annular cavity; and a layer of helical wound fiber-reinforced polymer extending over the first annular projection, the annular cavity and the second annular projection.

A processing liquid supplying apparatus including a reservoir containing an additive to be added to a liquid flowing through a passage connected at one end to a liquid supply source and at another end to a processing apparatus; an injection pump for injecting the additive into the passage; a weight measuring unit for measuring the weight of the reservoir and converting the weight into an electrical signal at a predetermined interval while the liquid flows in the passage and the additive is injected; a deciding unit for receiving the electrical signal from the weight measuring unit and deciding whether the measured value of the weight of the reservoir is being reduced at a predetermined rate; and a warning unit for issuing a warning that injection is improper when it is decided by the deciding unit that the measured value of the weight is not being reduced at the predetermined rate.

A processing liquid supplying apparatus including a reservoir containing an additive to be added to a liquid flowing through a passage connected at one end to a liquid supply source and at another end to a processing apparatus; an injection pump for injecting the additive into the passage; a weight measuring unit for measuring the weight of the reservoir and converting the weight into an electrical signal at a predetermined interval while the liquid flows in the passage and the additive is injected; a deciding unit for receiving the electrical signal from the weight measuring unit and deciding whether the measured value of the weight of the reservoir is being reduced at a predetermined rate; and a warning unit for issuing a warning that injection is improper when it is decided by the deciding unit that the measured value of the weight is not being reduced at the predetermined rate.

In one embodiment, an aircraft electronics system includes a hardware processor, a charge collection circuit to collect charge; a switching circuit controlled by the hardware processor to discharge the charge collected on the charge collection circuit through a bonding circuit formed from a chassis and a bonding surface; and a voltage measurement circuit to measure a voltage difference between measurement terminals across the chassis and the bonding surface.

Provided are a chemical liquid supply apparatus and a semiconductor processing apparatus. The chemical liquid supply apparatus, which supplies a chemical liquid to a process chamber during a semiconductor manufacturing process, may include a chemical liquid supply pipe in which the chemical liquid flows therein and of which a spray end, through which the chemical liquid is sprayed, extends into the process chamber, an external electrode disposed outside the chemical liquid supply pipe, and a power supply module configured to apply power to the external electrode.

The present invention relates to a mobile terminal which comprises: a display unit; a frame for supporting the display unit; a printed circuit board formed on one side of the frame; a case formed on one side of the printed circuit board; first and second beam-shaped metal members arranged on both sides of the frame while being spaced apart from the frame and exposed to the outside; and a first antenna which is formed adjacent to the frame and implements a first frequency band, wherein the first antenna comprises: a first radiator including at least one end of the first metal member or the second metal member; a first power supply unit for supplying power to the first radiator; and a first ground unit for grounding the first radiator.