A package carrier including a flexible substrate, a first build-up structure and a second build-up structure is provided. The flexible substrate has a first surface and a second surface opposite to each other, and has a first opening connected between the first surface and the second surface. The first build-up structure is disposed on the first surface and covers the first opening. The second build-up structure is disposed on the second surface and has a second opening, and the first opening and the second opening are connected to each other to form a chip accommodating cavity together. In addition, a manufacturing method of the package carrier and a chip package structure having the package carrier are also provided.

The present invention relates to a manufacturing method of a metal PCB assembly for a vehicle lamp and the metal PCB assembly made by the method. The manufacturing method of a metal PCB assembly for a vehicle lamp comprises a step S100 in which a material of a metal PCB 14 is prepared, a step S110 in which a circuit pattern 22 and a plurality of unit patterns 16 are formed and cut from the material of a metal PCB 14 to form a metal PCB 14, a step S120 in which a bending groove 24 is formed on a bottom surface of the metal PCB 14, a step S130 in which each of the unit patterns 16 is protruded forward around the bending groove 24 of the metal PCB 14 such that each of the unit patterns 16 is bent to be inclined from the metal PCB 14, and a step S140 in which a stepwise injection molded products 12 is coupled with the metal PCB 14 while the unit pattern 16 is protruded.

A substrate cutting device includes: a first cutter including a plurality of first rotary blades; a second cutter including a plurality of second rotary blades; a first rotation drive unit for rotationally driving the first cutter; a second rotation drive unit for rotationally driving the second cutter; a cutter support unit; and a phase adjustment unit. The cutter support unit supports the first cutter and the second cutter such that the first and second cutters are radially opposed to each other so that rotation axes thereof are parallel to each other. The phase adjustment unit adjusts a phase of at least one of the first cutter and the second cutter such that each of the second rotary blades is located between two adjacent first rotary blades in an opposing area in which the first cutter and the second cutter are opposed to each other.

Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.

A jig includes a base and one or more movable blocks. The base has an upper surface, which is configured to receive a substrate shaped as a flattened polyhedron having multiple facets. The one or more movable blocks are configured to move on the base so as to fold respective ones of the multiple facets, and to hold the substrate in a folded three-dimensional configuration.

A multi head flexible printed circuit (FPC) ultraviolet laser drilling device and a using method thereof are provided, the device includes a body frame; a support frame connected to the body frame; a first movement assembly disposed on the body frame and configured to move along a Y-axis direction of the body frame; a second movement assembly disposed on the support frame and configured to move along an X-axis direction of the body frame; a third movement assembly disposed on the second movement assembly and configured to move along a Z-axis direction of the body frame; a suction assembly slidably connected to the first movement assembly and configured to fix one or more FPC boards; and a drilling assembly including drilling parts. The device can realize the simultaneous processing of FPC board by adopting two or more processing modes, thereby improving the processing efficiency.

Systems and methods that enable printing of conformal materials and other waterproof coating materials at high resolution. An initial printing of a material on edges of a component is performed at high resolution in a first printing step, and a subsequent printing of the material on remaining surfaces of the component is applied in a second printing step, with or without curing of the material printed on the edges between the two printing steps. The printing of the material may be performed by a laser-assisted deposition or using another dispensing system to achieve a high resolution printing of the material and a high printing speed.

A printed circuit board stack structure includes a first printed circuit board, a second printed circuit board, and a filling glue layer. The first printed circuit board has at least one overflow groove, and includes first pads and a retaining wall surrounding the first pads. The second printed circuit board is disposed on the first printed circuit board, and includes second pads and conductive pillars located on some of the second pads. The conductive pillars are respectively connected to some of the first pads to electrically connect the second printed circuit board to the first printed circuit board. The filling glue layer fills between the first and the second printed circuit boards, and covers the first pads, the second pads, and the conductive pillars. The retaining wall blocks the filling glue layer so that a portion of the filling glue layer is accommodated in the overflow groove.

A device includes a first semiconductor chip including a first face, wherein a first contact pad is arranged over the first face. The device further includes a second semiconductor chip including a first face, wherein a first contact pad is arranged over the first face, wherein the first semiconductor chip and the second semiconductor chip are arranged such that the first face of the first semiconductor chip faces in a first direction and the first face of the second semiconductor chip faces in a second direction opposite to the first direction. The first semiconductor chip is located laterally outside of an outline of the second semiconductor chip.

A component carrier including a stack with a plurality of electrically insulating layer structures and/or a plurality of electrically conductive layer structures, and a component embedded in the stack, wherein at least a portion of a side wall of the component is exposed.