Provided are a pattern formation method including a step of preparing a base material which has an etching layer transparent to an exposure wavelength on each of two surfaces thereof and is transparent to the exposure wavelength, a step of forming a photosensitive resin layer, in which an optical density to the exposure wavelength is in a range of 0.50 to 2.50, on the etching layer on each of the two surfaces of the base material, a step of pattern-exposing the photosensitive resin layer, a step of developing the photosensitive resin layer to form a resist pattern on two surfaces, a step of removing the etching layer on a portion that is not coated with the resist pattern, and a step of peeling the resist pattern off, in this order, a laminate, and a method of producing a touch panel.

A capacitance detection area sensor includes capacitance sensor elements arranged in a two-dimensional array, is shaped into an appropriate shape, and capacitively coupled to an external electrode. To the external electrode, a sensing signal having a potential difference is supplied. The first and second sensor output signals are acquired from a capacitance sensor element capacitively coupled to the external electrode, at the timing of the sensing signal being a first signal and being a second signal, respectively. A differential signal is generated from a difference between the acquired first and second sensor output signals, and an image indicating the shape of the external electrode is generated based on the level of the differential signal, in different colors or different tones.

A method may include obtaining a printed circuit board (PCB) that includes a set of vias that include a set of stub regions. The PCB may include a set of layers perpendicular to the set of vias. The set of layers may include a signal layer and a ground layer. The ground layer may be located between the set of stub regions and the signal layer. The method may include drilling to remove at least a portion of a stub region of a via of the set of vias. The method may include performing an electrical test to determine whether a sliver of conductive material is included within the via after drilling to remove the at least a portion of the stub region of the via.

A board design assistance device includes a design data acquirer to acquire design data for a printed circuit board, a first determiner to determine, based on the design data for the printed circuit board, whether a lengthwise direction of board fiber in the printed circuit board is perpendicular to a longitudinal direction of an electronic component mounted on the printed circuit board, a second determiner to determine, based on the design data for the printed circuit board, whether a wire is routed crosswise from a pad receiving the electronic component mounted on the printed circuit board, and a notifier to provide a notification including error information specifying an electronic component determined to have a longitudinal direction not perpendicular to the lengthwise direction of the board fiber and determined to be connected to a pad from which a wire is not routed crosswise.

A device for current determination includes a shunt and a device for temperature measurement including a printed circuit board, an evaluation unit and a temperature sensor. The printed circuit board has a milled groove which runs spirally around the temperature sensor, so that the temperature sensor is arranged on a printed circuit board plateau defined by the milled groove and is displaceable in a direction that is parallel to a normal vector of a plane defined by the printed circuit board. When the temperature sensor is displaced relative to the plane of the printed circuit board, a restoring force is brought about between the printed circuit board and the temperature sensor, wherein the shunt includes a resistance region having a substantially flat surface, wherein the device for current determination is arranged in the resistance region on the surface of the shunt in such a way that the temperature sensor is arranged in thermal connection with the resistance region of the shunt, wherein voltage taps are arranged on both sides of the temperature sensor and electrically contact the surface of the shunt in order to detect a potential difference along the resistance region.

Printed wiring board manufacturing method, and printed wiring board. The method includes preparing sheet material including cloth-like material woven of reinforced fiber with a 90 degree between warp thread and a weft thread; arranging the sheet material on a cutting-out apparatus so that the sheet material is tilted 5 to 30 degrees with respect to threads configuring the cloth-like material and cutting a portion to cross the cloth-like-material configuration threads aligned on a cutting blade at 5 to 30 degrees; cutting the sheet material from the tilted sheet material with the cut portion crossing the cloth-like-material configuration threads aligned on the cutting blade to form the sheet material with a circumferential edge of the sheet material crossing the cloth-like material configuration threads at 5 to 30 degrees; creating a mother laminate configured with the sheet material as an inner-layer board or an insulating board; and providing a conductor pattern on a metal layer of the mother laminate along a circumferential edge portion of the mother laminate.

An upper mechanism including a table provided with a placement surface of an inspection target, a lower mechanism configured to rotatably support the upper mechanism, and a lifting operation unit configured to be supported by the upper mechanism so as to be movable up and down are provided. The lower mechanism includes a rotation drive unit configured to rotate the upper mechanism, and a push-up force output unit configured to lift and lower the lifting operation unit. A transmission member with which a tip of the push-up force output unit can contact or separate is provided at a lower end of the lifting operation unit.

There is provided a method which includes placing a component on a substrate and extending an alignment member through an opening in the substrate. Once the alignment member is extended through the opening, the component is moved to abut against the alignment member to align the component relative to the substrate. After the component is aligned relative to the substrate, the component is secured to the substrate and the alignment member is retracted through the opening.

The present invention provides a method for detecting and adjusting failed back-drills in PCBs in the process of fabricating a PCB so that the failed back-drill can be screened out or repaired. This is accomplished, by after detecting poor back drills in a PCB, measuring the actual thickness of each PCB board. Next, the measured actual thickness of each PCB board is compared with .the theoretical thickness of each PCB board. The back drill depth for each area of the PCB board is then adjusted for its theoretical thickness and percent variation from the measured thickness.to adjust the poor back drill.

Back plates to support integrated circuit packages in sockets on printed circuit boards and associated methods are disclosed. An example back plate includes a ceramic substrate having a first surface and a second surface opposite the first surface. The example back plate further includes metal coupled to the ceramic substrate. At least a portion of the metal is disposed between planes defined by the first and second surfaces of the ceramic substrate.