Disclosed herein is an in-mold electronics (IME) structure. The IME structure includes a film, a first plastic resin positioned under the film, and a second plastic resin positioned under the first plastic resin. An electronic circuit is formed on a top or bottom surface of the second plastic resin by a plating method and also electronic elements are mounted thereon. The electronic elements include LED light sources, a plurality of protruding light guides configured to guide lighting through distribution and direction is formed on the top surface of the second plastic resin, and the LED light sources are installed in respective spaces provided by the light guides.

A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying liquid resist on the seed layer formed on the surface of the resin insulating layer, drying the liquid resist applied on the seed layer such that a resist layer is formed on the seed layer, applying pressure and heat simultaneously to an entire surface of the resist layer formed on the seed layer, forming a plating resist on the seed layer from the resist layer formed on the seed layer using a photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the plating resist, removing the plating resist from the seed layer, and removing part of the seed layer exposed from the electrolytic plating film.

The invention discloses a circuit board enhancing structure and a manufacture method thereof. The method includes the following steps: providing a substrate; forming a first circuit on the substrate; forming a first dielectric layer enclosing the first circuit on the substrate; forming a first opening on the first dielectric layer; forming a first pattern photoresist layer on the first dielectric layer to divide a surface of the first dielectric layer as a first structure enhancing area and a second circuit area, wherein the first opening is disposed in the first structure enhancing area; forming a second circuit in the second circuit area and a first enhancing structure in the first opening, wherein the first enhancing structure protrudes from the first opening; removing the first pattern photoresist layer; and forming a second dielectric layer enclosing the second circuit and the first enhancing structure on the first dielectric layer.

The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one example, an optoelectronic assembly may include a printed circuit board including a laser-roughened area, at least one optoelectronic component coupled to a surface of the printed circuit board, and an optical component attached to the printed circuit board. The coupling area may be defined by the optical component contacting the printed circuit board, and the laser-roughened area may be positioned entirely within the coupling area defined by the optical component contacting the printed circuit board.

A bending apparatus includes a fixing structure, a first driving mechanism, a first pressing head connected to the first driving mechanism, a second driving mechanism and a second pressing head connected to the second driving mechanism. The first driving mechanism is configured to drive the first pressing head to move onto a first surface of a first portion, and to drive the first pressing head to push the first portion to rotate to a first side of a body portion, so that the first portion is parallel or substantially parallel to the body portion. The second driving mechanism is configured to drive the second pressing head to move onto a second surface of a second portion, and is further configured to drive the second pressing head to pull the second portion to rotate to the first side of the body portion while the first pressing head pushes the first portion.

Electrical circuitry is produced on the surface of an organic polymer. The electrical circuitry is produced on a support, and a polymerizable composition is brought into contact with the support and the circuitry. The polymerizable composition is polymerized while in contact with support and the circuitry to produce a solid, organic polymer. The electrical circuitry becomes adhered to and partially embedded in a surface of the solid organic polymer. The support may be removed subsequent to the polymerization step to expose the circuitry at the surface of the solid organic polymer.

A device includes a porous substrate that include a plurality of pores and a plurality of nanodevices dispersed in at least a portion of the plurality of pores. Each of the plurality of nanodevices includes a magnetic nanowire and a solder nanoparticle. The magnetic nanowires are configured to generate heat in response to an alternating magnetic field. The solder nanoparticles are configured to receive a portion of the heat and reflow to connect to one or more devices or surfaces.

A component carrier with a stack including an electrically insulating layer structure and an electrically insulating structure has a tapering blind hole formed in the stack and an electrically conductive plating layer extending along at least part of a horizontal surface of the stack outside of the blind hole and along at least part of a surface of the blind hole. A minimum thickness of the plating layer at a bottom of the blind hole is at least 8 μm. A demarcation surface of the plating layer in the blind hole and facing away from the stack extends laterally outwardly from the bottom of the blind hole towards a lateral indentation and extends laterally inwardly from the indentation up to an outer end of the blind hole. An electrically conductive structure fills at least part of a volume between the plating layer and an exterior of the blind hole.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

A system and a method are disclosed for placing hardware components on a printed circuit board (“PCB”) in a way that enables all hardware components on the PCB to be passively cooled without using active cooling systems. Components are selected to be placed onto the PCB and heat metrics for each component is obtained (e.g., from a server). The components are ranked based on the amount of heat that each component generates. A corresponding position for each of the hardware components is determined based on the ranking of the components and the orientation of the PCB. The placement is based on the concept that air having higher temperature rises while air having cooler temperature falls. A representation of the PCB according to corresponding positions of the hardware components may be generated for display.