A solution is provided that can be used in a communication node. A case is provided that supports a card module. The card module includes a circuit board with a front edge and a rear edge and includes a chiclet mounted adjacent the front edge. A housing can be pressed onto the circuit board and chiclet and be retain the housing in place. A transformer box is provided is provided on the circuit board between the housing and the rear edge. A POE card can be mounted on the circuit board between the transformer box and the housing.

The present disclosure relates to a component structure, a power module and a power module assembly structure having the component structure. The component structure comprises: a first bus bar, having one end extending to a first plane to form a first connecting terminal; a second bus bar, comprising a front portion of the second bus bar and a rear portion of the second bus bar, wherein the front portion of the second bus bar is laminated in parallel with the first bus bar, and the rear portion of the second bus bar is extended to a second plane to form a second connecting terminal; and an external circuit comprising a third bus bar, wherein the third bus bar is settled in parallel with the rear portion of the second bus bar, to reduce a parasitic inductance between the first connecting terminal and the second connecting terminal.

Electrical energy storage device (1), including at least one electrical component (2) and a busbar (5) for electrical power distribution, where the electrical component (2) is arranged on the busbar (5), and at least a first contact side (11) and/or a second contact side (12) of the electrical component (2) is connected to the busbar (5) by a contact element (8), and wherein the contact element (8) is formed at least partially as a mesh (7). The electrical component (2) is preferably a capacitor.

A base module for a control-cabinet system includes a housing with a first housing face and further housing faces, the first housing face having a grid of openings. The housing has connection elements for functional modules, the connection elements each being arranged in the region of the openings of the first housing face, the connection elements comprising data connections, extra-low voltage connections and low-voltage connections. The data connections are interconnected by a data line of the base module and a field-bus connection is provided for the data line, where the data line is arranged within the housing. An extra-low voltage line and a low voltage line are arranged within the housing, where the extra-low voltage line is connected to the extra-low voltage connections and the low voltage line is connected to the low voltage connections.

A LIDAR system that includes a laser unit, a receiving unit, and a cooling device for generating a cooling airflow. The laser unit, the receiving unit, and the cooling device are situated rotatingly about a rotational axis, so that the cooling airflow for cooling the rotating components is generated by the LIDAR system itself.

To improve cooling capability, power conversion apparatus 1 that converts a direct current voltage into an alternating current voltage includes: first substrate 100 on which power conversion circuit 2 is mounted; second substrate 200 on which driving circuit 3 that drives power conversion circuit 2 is mounted; and shield plate 300 that is disposed between first substrate 100 and second substrate 200, and first substrate 100 is a metal substrate.

An electronic device casing includes a body, a movable apparatus, and a handle structure. The body comprises a first stopping surface and a second stopping surface disposed opposite to each other. The movable apparatus is adapted to be detachably assembled in the body. The handle structure is pivotally disposed to the movable apparatus. The handle structure comprises a first arm corresponding to the first stopping surface and a second arm corresponding to the second stopping surface. The movable apparatus is adapted to move between a removed position and an assembled position by rotating the handle structure between an upper pulled position and a lower pressed position.

An electrical assembly is provided with a housing cast from an aluminum material to shield from electromagnetic interference, with a cavity sized to retain electrical components, an opening, and a series of receptacles formed about a perimeter of the opening. A seal is oriented about the perimeter of the opening. A cover is formed from an aluminum sheet material to shield from electromagnetic interference and is sized to enclose the opening. A plurality of mechanical retainers is formed about a perimeter of the cover and sized to align with the series of receptacles, to be mechanically deformed into the series of receptacles to affix the cover to the housing.

A printed circuit board includes a first wiring structure including first insulating layers and first wiring layers; a second wiring structure disposed on the first wiring structure and including second insulating layers and second wiring layers; and a third wiring structure disposed on the second wiring structure and including a third insulating layer and a third wiring layer disposed on the third insulating layer. At least a portion of at least one of the second wiring layers has a fine pitch, relatively finer than those of the first wiring layers and the third wiring layer, wherein at least a portion of one of the first wiring layers is connected to at least a portion of the third wiring layer through a first wiring via, and wherein the first wiring via penetrates at least one of the first insulating layers, the second insulating layers, and the third insulating layer.

An embodiment of the present disclosure provides a substrate structure applied to a power module. In the substrate structure applied to a power module, the substrate includes an upper substrate and a lower substrate, a plurality of semiconductor devices disposed on the lower substrate, a source signal electrode transmitting a source signal to the semiconductor devices, and a gate signal electrode transmitting a gate signal to the semiconductor devices, one of the source signal electrode or the gate signal electrode is connected to the upper substrate through a conductive column, and a signal transmitted by one of the source signal electrode or the gate signal electrode is transmitted to the semiconductor devices through the upper substrate.