Provided is a connector module providing superior shielding performance with small number of components. The connector module includes a terminal module having a center conductor, a tubular insulator holder supporting the center conductor and a tubular conductive shell, and a shield case. A bottom portion of the shield case includes a protruding portion bent from an edge of an opening portion through which the terminal module extends and protruding in a cylindrical form. The terminal module is joined to the shield case with an outer circumferential face of the conductive shell and an inner circumferential face of the protruding portion being placed in face contact with each other.

Objects are to provide a ferrite powder having a residual magnetization and a coercive force larger than those of spherical hard ferrite particle, and magnetic permeability μ″ is maximum in a specific frequency range, a manufacturing method thereof, a resin compound containing the ferrite powder, and a molded product made from the resin compound. To achieve the objects, a hexagonal plate shaped ferrite powder containing 7.8 to 9 wt % of Sr, 61 to 65 wt % of Fe, and 0.1 to 0.65 wt % of Mg, a manufacturing method thereof, a resin compound containing the hexagonal plate shaped ferrite powder, and a molded product made from the resin compound are employed.

Objects are to provide a ferrite powder having a residual magnetization and a coercive force larger than those of spherical hard ferrite particle, and magnetic permeability μ″ is maximum in a specific frequency range, a manufacturing method thereof, a resin compound containing the ferrite powder, and a molded product made from the resin compound. To achieve the objects, a hexagonal plate shaped ferrite powder containing 7.8 to 9 wt % of Sr, 61 to 65 wt % of Fe, and 0.1 to 0.65 wt % of Mg, a manufacturing method thereof, a resin compound containing the hexagonal plate shaped ferrite powder, and a molded product made from the resin compound are employed.

Disclosed are EMI shielded packages, electronic device packages, and related methods. EMI shielded packages are formed by applying an insulating material to a first side of a substrate strip, separating the substrate strip into segments, adhering the insulating material of the segments to a solid conductor, applying a conductive paste around lateral sides of the segments, curing the conductive paste, and cutting through the conductive paste and the solid conductor to form the EMI packages. An electronic device package includes a substrate including electronic circuitry, an EMI shield, and an insulating material insulating the substrate from the EMI shield. The EMI shield includes a solid conductor adhered to the insulating material, and a cured conductive paste at least partially surrounding a lateral edge of the substrate. The cured conductive paste electrically connects the solid conductor to a conductive terminal in a lateral side of the substrate.

A flexible flat cable (FFC) includes a first insulation layer, at least one pair of conductors, a plurality of low-k dielectric layers, two second insulation layers, and at least one shielding layer. The pair of conductors is located within the first insulation layer. Each pair of conductors includes a plurality of first conductors, and the first conductors are axially extending and arranged in parallel. The low-k dielectric layers are embedded in the first insulation layer. Each of the pair of conductors or each of the first conductors is covered and surrounded with one low-k dielectric layer. The two second insulation layers are located on two surfaces of the first insulation layer. The shielding layer is located on the two second insulation layers opposite to the first insulation layer.

The present invention relates generally to the field of faraday cages. More specifically, the present invention relates to a carport tent faraday cage device. The device is primarily comprised of a tent body, further comprised of at least one roof frame, at least one wall frame, and at least one door. The tent body is comprised of three layers, an exterior layer, a middle layer, and an interior layer. Further, the tent body material has a middle layer that is comprised of a woven copper wire to prevent the electromagnetic radiation from entering the device. The device further is comprised of a grounding stake and a tether to direct the electrical current away from the device and into the ground. The device provides users with a device to store their vehicles, or other electronic devices without the risk of damage by electromagnetic radiation.

According to one embodiment, an electromagnetic wave attenuator includes a first structure body. The first structure body includes a first member, a second member, and a third member. The first member includes a first magnetic layer and a first nonmagnetic layer alternately provided in a first direction. The first nonmagnetic layer is conductive. The first direction is a stacking direction. The second member includes a second magnetic layer and a second nonmagnetic layer alternately provided in the first direction. The second nonmagnetic layer is conductive. The third member includes a third nonmagnetic layer. The third nonmagnetic layer is conductive. A direction from the third member toward the first member is along the first direction. A direction from the third member toward the second member is along the first direction. A first magnetic layer thickness is greater than a second magnetic layer thickness.

A shield case, joined to a circuit board on which electronic components are mounted and covering the electronic components, has a top plate portion covering the electronic components, and a plurality of terminal leg portions formed in a way of projecting in a direction intersecting with the top plate portion from a peripheral edge portion of the top plate portion. Each of the plurality of terminal leg portions has: a leg portion stretching from the top plate portion; a terminal portion which extends in a direction intersecting with the leg portion from a front-end of the leg portion and is joined to the circuit board; and an expansion terminal portion which is formed by bending a front-end portion of each of the terminal portions along an end surface of the circuit board and has a length exceeding a thickness of the circuit board.

A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.

A camera module comprising: a housing; a lens assembly that is fixed to the housing and comprises at least one lens; a circuit board that is arranged inside the housing and comprises a first circuit board and a second circuit board, on which image sensors arranged to face the lens are mounted, respectively; and a first shield can arranged inside the housing so as to support edges of the first and second circuit boards.