An EMI attenuation device includes a housing stator, a fan rotor, and an electrical bridge therebetween. The housing stator has an aperture therethrough, and at least a portion of the housing stator is electrically conductive. The fan rotor is adjacent to the aperture and has a rotational axis relative to the housing stator and a proximate surface proximate the housing stator. The fan rotor is electrically conductive, and the proximate surface is continuous around a rotational direction of the fan rotor. The electrical bridge is between the proximate surface of the fan rotor and a contact surface of the housing stator.

Electromagnetic-wave-absorbing particles for a GHz band are represented by the following [Empirical Formula 1] and include M-type hexaferrite as a major phase:
Sr.sub.1-xR.sub.xFe.sub.y-2zM.sub.2zO.sub.a,  [Empirical Formula 1] where R is one or more selected from Ba, Ca, and La, M is one or more selected from Zn, Ti, and Zr, 0<x≤0.8, 8≤y≤14, 0<z≤1.5, and a is 19.

An electronic device is provided, which may include a first housing; a second housing configured to accommodate at least a portion of the first housing and guide a sliding movement of the first housing; a display including a first display area disposed on the first housing and a second display area extending from the first display area; a PCB configured to accommodate at least one electronic component; a support member configured to support the PCB; a side wall member connected to the support member and facing at least a portion of the first housing; a heat dissipation sheet configured to receive heat from the at least one electronic component, the heat dissipation sheet being disposed on the support member and the side wall member; and a heat dissipation member disposed on the side wall member and facing the heat dissipation sheet.

A shielding cover shields and protects a component in an electronic device. The shielding cover includes a cover body and a flexible printed circuit board disposed on the cover body. A first opening is disposed on an end face of the cover body, and the flexible printed circuit board may be affixed to an outer side of the end face of the cover body through soldering, bonding, or the like, blocking the first opening.

A switchable wire includes filaments, each of which includes a heat-activated material layer that may be indirectly heated to change its state between different states having different electrical conductivity. In an example embodiment the indirect heating may be electrically resistance heating by passing electrical current through an electrically-resistive core of the filament. The heat passing through an electrically-insulative coating around the core, and into a heat-activated material layer around the electrically-insulative coating. The heat-activated material may be a chalcogenide material that is shiftable between a crystalline electrically-conducting state and an amorphous electrically-insulating state. The state of the material may be controlled by controlling the heating profile through controlling heating in the core. Many such filaments may be twisted together to form a switchable wire. Such wires may be used in any of a variety of devices where switchable electrical conductivity is desired.

A wireless electrical energy transmission system is provided. The system comprises a wireless transmission base configured to wirelessly transmit electrical energy or data via near field magnetic coupling to a receiving antenna configured within an electronic device. The wireless electrical energy transmission system is configured with at least one transmitting antenna and a transmitting electrical circuit positioned within the transmission base. The transmission base is configured so that at least one electronic device can be wirelessly electrically charged or powered by positioning the at least one device external and adjacent to the transmission base.

A module includes a substrate having a first surface and at least one recess on the first surface, and an electronic component mounted on the first surface. The electronic component is connected to the substrate via a plurality of bumps. All of the plurality of bumps are connected to the first surface inside any of the at least one recess. A height of the plurality of bumps is greater than a depth of the at least one recess. When viewed in a direction perpendicular to the first surface, a part of the electronic component is located outside an outer periphery of any recess selected from the at least one recess.

A module includes: a substrate having a first face; a plurality of components mounted on the first face; a resin film that covers the plurality of components along contours of the plurality of components and also covers a part of the first face; and a shield film formed to overlap the resin film. The first face is provided with a ground electrode. The resin film has an opening, and the shield film is connected to the ground electrode via the opening.

A high-frequency circuit includes a first electric conductor layer, a first dielectric layer, a circuit layer, a second dielectric layer, a second electric conductor layer arranged in this order, and the circuit layer includes a ground pattern and a transmission line of a high-frequency signal. An electromagnetic wave shield is disposed around the transmission line. The electromagnetic wave shield includes a ground electric conductor on inner surfaces of a plurality of holes extending through the first dielectric layer, the ground pattern, the second dielectric layer, the first electric conductor layer, and the second electric conductor layer. The plurality of holes are a plurality of elongated holes provided at an interval in a direction in which the transmission line is surrounded. In each of the plurality of elongated holes, a longitudinal dimension in the direction in which the transmission line is surrounded is larger than a width dimension.

A portable shelter with electromagnetic interference (EMI) protection includes a plurality of walls that define an interior space. The walls can be fixed or movable. An EMI protected edge connector joins at least two of the walls together. The EMI protected edge connector assembly can be fixed or hinged. The edge connector can include a metallic outer edge member with two legs and a separate metallic inner edge member with two legs to define an edge channel therebetween with: (i) the first outer leg and the first inner leg are arranged parallel and spaced-apart relative to each other; and (ii) the second outer leg and the second inner leg arranged parallel and spaced-apart relative to each other. The shelter walls can include an inner surface covered by a metallic foil inner layer. A first wall panel is received in a first portion of the edge channel with its metallic foil inner layer contacting the inner edge member and a second wall panel is received in a second portion of the edge channel with it metallic foil inner layer contacting the inner edge member.