A wearable audio device sized to fit within an ear of an user comprises an outer housing; a circuit board positioned within the outer housing; a battery having an anode and a cathode, the battery being connected to the circuit board; a speaker adjacent the battery; and an electromagnetic interference (“EMI”) shield tab coupled to the anode. The EMI shield tab may be configured to shield the speaker from EMI generated by the circuit board and to provide an electrical interconnection to the anode. The EMI shield tab may be comprised of a high magnetic flux permeable metal material

A drive carrier for retaining a persistent storage drive in an enclosure. The drive carrier includes a mounting bracket, a handle coupled to the mounting bracket, and an electromagnetic interference (“EMI”) shielding apparatus disposed between mounting bracket and at least a portion of the handle. The mounting bracket is shaped to be coupled to the persistent storage drive. The EMI-shielding apparatus includes a plurality of EMI-shielding fingers. Each EMI-shielding finger includes a lower surface, an upper surface that is approximately parallel to the lower surface, and a contoured surface extending between the lower surface and the upper surface.

A technique for selectively configuring a case of a handheld device to shield an antenna from receiving or transmitting wireless signals is disclosed. The technique includes moving a blocking element on the case between a first position and a second position. The blocking element is a physical structure that is rotatable, slidable, or removable to switch between the first position and the second position. In response to moving the blocking element to the first position, the blocking element blocks wireless signals received or transmitted by the antenna of the handheld device. In response to moving the blocking element to the second position, wireless signals can be received or transmitted through the case by the antenna.

An electronic device including a shield structure is provided. The electronic device includes a first device including a first magnetic substance, a second device including a second magnetic substance, and a shield structure configured to shield at least part of a magnetic force generated between the first magnetic substance and the second magnetic substance, wherein the shield structure includes a shield member disposed between the first device and the second device and including a property of a magnetic substance, and a connecting member physically connected to at least part of the shield member and including a property of a nonmagnetic substance, wherein at least part of the connecting member is physically connected to a circuit board.

The present disclosure relates to a pre-5.sup.th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4.sup.th-Generation (4G) communication system such as Long Term Evolution (LTE). The present disclosure relates to connection structure for radio frequency components and electronic device including same According to various embodiments, a connection assembly for radio frequency (RF) components may include: a first RF component including an opening section and a protrusion formed in the opening section; an elastic structure; a printed circuit board (PCB); and a second RF component connected to the PCB. The elastic structure may be disposed on a first surface of the PCB, a first surface of the first RF component including the opening section may be coupled to the first surface of the PCB, and the protrusion of the first RF component may come in contact with the elastic structure, thereby forming an electrical connection between the first RF component.

An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

A high-frequency electronic component includes a ceramic multilayer substrate, ground electrodes provided at different layers of the ceramic multilayer substrate, and a shielding film covering at least a side surface among surfaces of the ceramic multilayer substrate. Two or more of the ground electrodes are exposed to the side surface of the ceramic multilayer substrate but do not protrude from this side surface, and are electrically connected to the shielding film. On the side surface of the ceramic multilayer substrate, the two or more of the ground electrodes at least partially overlap each other in a thickness direction of the ceramic multilayer substrate, with a distance in the thickness direction between the overlapping ground electrodes being 5 μm or greater.

A high-frequency electronic component includes a ceramic multilayer substrate, ground electrodes provided at different layers of the ceramic multilayer substrate, and a shielding film covering at least a side surface among surfaces of the ceramic multilayer substrate. Two or more of the ground electrodes are exposed to the side surface of the ceramic multilayer substrate and are electrically connected to the shielding film. On the side surface of the ceramic multilayer substrate, the two or more of the ground electrodes do not overlap each other in a thickness direction of the ceramic multilayer substrate.

A housing, a vibration assembly, and a vehicle including the vibration assembly is provided, wherein the housing includes a polymer layer and a metal layer. The metal layer is located at an innermost layer of the housing. A material used for the metal layer includes a metal material. The polymer layer is located on an outer side of the metal layer. A material used for the polymer layer includes a polymer material. The housing can convert mechanical vibration energy into heat energy for dissipation, thereby achieving a noise reduction effect.

An electronic component module includes a substrate having a main surface, an electronic component mounted on the main surface, a sealing resin having an insulation property and covering the electronic component and the main surface, and a conductive film that covers an outer surface of the sealing resin. The electronic component includes a housing whose outer surface has an insulation property, and a first external electrode arranged at one end of the housing. The electronic component module includes a conductive auxiliary layer that covers a part of the first external electrode and a part of the housing on a side of the electronic component opposite to the substrate. The sealing resin has a recessed portion that exposes the conductive auxiliary layer. A conductive portion is formed in the recessed portion and is connected to the conductive film and the conductive auxiliary layer.