A transport unit for transporting printed circuit boards along a direction of transport within at least one zone of a soldering system, in particular a reflow soldering system, characterized in that a base part is provided with an output shaft that can be driven, and with at least two output wheels which are rotatably coupled to the output shaft, in that at least two drive parts which can be releasably fastened on and removed from the base part are each provided with a drive wheel in such a manner that the drive parts have drive rollers which are rotatably coupled to the drive wheel, and which act on the printed circuit board to transport the printed circuit board through the zone, and in that, when the drive parts are fastened to the base part, each of the output wheels is in engagement with the associated drive wheel.

A substrate processing system for an electronic device manufacturing system can include a factory interface forming an interior volume, and a partition disposed in the factory interface. The partition can divide the interior volume into a first factory interface chamber forming a second interior volume, and a second factory interface chamber forming a third interior volume. The partition can be configured to provide a first sealed environment in the first factory interface chamber and a second sealed environment in the second factory interface chamber.

A method of making a printed circuit board pallet is provided. The method of making the pallet illustratively includes the steps of: providing a base in a form of a polymer sheet stock; applying a fluid onto the base at selective locations where the pallet will be built-up to a three-dimensional form; depositing a polymer powder onto the base at the selective locations applied with the fluid; removing any excess amounts of the polymer powder not adhered to the fluid; and heating the pallet to fuse the polymer powder together and to the base.

A component mounting system for mounting a component on a substrate, the mounting system comprising a component supplying unit configured to supply the component; a substrate holding unit configured to hold the substrate in an orientation such that a mounting face for mounting the component on the substrate is facing vertically downward; a head configured to hold the component from vertically below; and a head drive unit that, by causing vertically upward movement of the head holding the component, causes the head to approach the substrate holding unit to mount the component on the mounting face of the substrate.

Provided is a heat-dissipating, shock-absorbing structure which is applicable to an electronic module with a hard disk drive. The heat-dissipating, shock-absorbing structure includes a heat-dissipating frame, an elastomer, and a plurality of heat conduction layers. The heat-dissipating frame has a fixing segment and two extending segments. The extending segments connect with two ends of the fixing segment. The fixing segment connects with one side of the hard disk drive. The distance between the extending segments is greater than the thickness of the hard disk drive. At least a portion of the elastomer is disposed at the extending segments. The heat conduction layers cover the elastomer.

An electronic component set includes a plurality of electronic components and a holding member that holds the plurality of electronic components. Each of the plurality of electronic components includes an identification unit. The plurality of electronic components are held by the holding member to allow an optical reader to read the identification unit of the each of the plurality of electronic components.

A consumer electronic product includes at least a transparent housing and a flexible display assembly enclosed within the transparent housing. In the described embodiment, the flexible display assembly is configured to present visual content at any portion of the transparent housing.

A consumer electronic product includes at least a transparent housing and a flexible display assembly enclosed within the transparent housing. In the described embodiment, the flexible display assembly is configured to present visual content at any portion of the transparent housing.

A service system and a server capable of increasing an operation rate of a production base are provided. The server acquires operation information of a component mounter in a mounting work from a host computer in the production base. The server generates analyzed result data obtained by analyzing the operation information based on the types of the manufacturers (component manufacturer and the package manufacturer) of electronic component and the package. The server transmits the generated analyzed result data to host computers in the other production bases.

A service system and a server capable of increasing an operation rate of a production base are provided. The server acquires operation information of a component mounter in a mounting work from a host computer in the production base. The server generates analyzed result data obtained by analyzing the operation information based on the types of the manufacturers (component manufacturer and the package manufacturer) of electronic component and the package. The server transmits the generated analyzed result data to host computers in the other production bases.