The invention relates to a support pin (10) for supporting a substrate (80) in a placement area of a placement machine (100) and a placement machine (100) with at least one placement head (101), a magazine (104) with a plurality of such support pins (10) and a placement board (103).

A management device causes a mobile work device to execute a pre-replacement process of detaching a pre-served feeder from a mounting attachment portion before a component shortage of a feeder and attaching a replacement feeder corresponding to a feeder predicted to be subjected to the component shortage to the mounting attachment portion from which the pre-served feeder is detached when the feeder attached to the mounting attachment portion is predicted to be subjected to the component shortage and the mounting attachment portion is in a predetermined serving state such that there is no vacancy in the mounting attachment portion and the pre-served feeder to be used in the next and subsequent productions is attached to a part of the mounting attachment portion.

The image processing device displays, on a display, a virtual screen obtained by viewing, from above, an aggregate board in which multiple unit boards having a common component configuration are arranged. A control section of the image processing device uses one unit board at a predetermined position among the multiple unit boards as a reference unit board, generates a detailed image in which respective components are arranged on the unit board based on positional information of all components to be mounted on the unit boards, for the reference unit board, generates a simplified image obtained by simplifying the unit board, for a non-reference unit board other than the reference unit board among the multiple unit boards, and displays a simple virtual screen displaying the detailed image at a position of the reference unit board and the simplified image at a position of the non-reference unit board as the virtual screen.

Disclosed is a portable electronic device including a front cover that forms a front face of the electronic device, a rear cover that forms a rear face of the electronic device, a bezel that surrounds a space formed by the front cover and the rear cover, a display device that is embedded in the space and includes a screen region that is exposed through the front cover, a metal structure that is positioned within the space and includes a first face facing the front cover and a second face facing the rear cover, a non-metal structure that is positioned within the space to partially overlap with the metal structure and includes a first surface facing the front cover and a second surface facing the rear cover, and a metal filler extending from the first surface to the second surface of the non-metal structure through a portion of the non-metal structure.

Disclosed is a portable electronic device including a front cover that forms a front face of the electronic device, a rear cover that forms a rear face of the electronic device, a bezel that surrounds a space formed by the front cover and the rear cover, a display device that is embedded in the space and includes a screen region that is exposed through the front cover, a metal structure that is positioned within the space and includes a first face facing the front cover and a second face facing the rear cover, a non-metal structure that is positioned within the space to partially overlap with the metal structure and includes a first surface facing the front cover and a second surface facing the rear cover, and a metal filler extending from the first surface to the second surface of the non-metal structure through a portion of the non-metal structure.

It is an object of the present invention to provide a component management system or the like that can accurately predict component exhaustion in a component mounting device that performs work at a line. Specifying section updates the time table based on the arrival time point or the unloading time point in each of component mounting devices. Arrival predicting section predicts the arrival time point in each component mounting device based on the time table and updates a prediction table. Since component-exhaustion predicting section acquires the arrival time point of a circuit board for which a component will be exhausted from the prediction table and calculates a component exhaustion time point, it is possible to predict the component exhaustion time point with high accuracy. An operator can perform a replenishment work based on the component exhaustion time point.

The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a cover glass layer to a structural housing while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to a structural. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In other embodiments, the cover glass layer can be attached using magnets or a tongue and groove design.

The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a cover glass layer to a structural housing while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to a structural. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In other embodiments, the cover glass layer can be attached using magnets or a tongue and groove design.

Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens.

A substrate tray for accommodating at least one ceramic substrate therein including: an accommodation part including a first opening part of which the upper side is open so that the ceramic substrate can be accommodated and withdrawn; and a support part formed on the circumference of the accommodation part so as to support the side wall circumference of the ceramic substrate, wherein the support part includes: an inner wall in contact with at least one surface of the ceramic substrate; an outer wall spaced a predetermined distance from the inner wall; an upper surface for connecting the inner wall to the outer wall; and a second opening part formed to be open in the direction opposite to the first opening part at a location facing the upper surface between the inner wall and the outer wall.