A potted electronic module includes an electronic assembly with a conductor such as a shunt that is arranged in a housing, and includes an electrical contact guided out through the housing wall, and a potting compound within the housing. The module may be produced by removing a protective layer from an area of the conductor by ablation, and then introducing a potting or casting compound into the housing, so that the potting compound covers a location at which the electrical contact passes through the housing wall, and the potting compound adheres directly onto the exposed conductor at the area at which the protective layer was removed.

A potted electronic module includes an electronic assembly with a conductor such as a shunt that is arranged in a housing, and includes an electrical contact guided out through the housing wall, and a potting compound within the housing. The module may be produced by removing a protective layer from an area of the conductor by ablation, and then introducing a potting or casting compound into the housing, so that the potting compound covers a location at which the electrical contact passes through the housing wall, and the potting compound adheres directly onto the exposed conductor at the area at which the protective layer was removed.

An apparatus for manufacturing a display device including: a photographing member configured to photograph a first alignment mark, a second alignment mark, a third alignment mark, and a fourth alignment mark, which are provided in a display panel; and a control member configured to set an imaginary reference point, taking into account the first alignment mark, the second alignment mark, the third alignment mark, and the fourth alignment mark, which are photographed by the photographing member. The control member sets a first position which is included in the imaginary reference point and at which a first imaginary straight line connecting the first alignment mark to the third alignment mark and a second imaginary straight line connecting the second alignment mark to the fourth alignment mark cross each other.

This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.

An electronic component reel set includes a first electronic component reel and a second electronic component reel. The first electronic component reel includes first electronic components each having a first characteristic value falling in a predetermined range above a reference characteristic value, a first electronic component package that stores the first electronic components linearly, a first reel body in which the first electronic component package is wound, and a first indicator portion indicating the first characteristic value. The second electronic component reel includes second electronic components each having a second characteristic value falling in a predetermined range below the reference characteristic value, a second electronic component package that stores the second electronic components linearly, a second reel body in which the second electronic component package is wound, and a second indicator portion indicating the second characteristic value.

There is provided a novel substrate support pin installation jig used when installing a substrate support pin for supporting a circuit substrate. The substrate support pin installation jig (hereinafter, may be simply referred to as a jig) according to the present disclosure includes a main body configured to move relative to a support base, multiple pin accommodating portions provided in the main body, and a positioned portion used for positioning on the support base. The substrate support pin is accommodated and held in at least one of multiple pin accommodating portions in the jig. The jig is placed on the support base in a state where a relative position is specified by the positioned portion. By releasing holding of the substrate support pin, the substrate support pin is installed on the support base, and then the jig is removed.

Described herein is an integrated data center that provides for efficient cooling, as well as efficient wire routing.

Described herein is an integrated data center that provides for efficient cooling, as well as efficient wire routing.

A method of making a printed circuit board pallet is provided. The method of making the pallet illustratively includes the steps of: providing a base in a form of a polymer sheet stock; applying a fluid onto the base at selective locations where the pallet will be built-up to a three-dimensional form; depositing a polymer powder onto the base at the selective locations applied with the fluid; removing any excess amounts of the polymer powder not adhered to the fluid; and heating the pallet to fuse the polymer powder together and to the base.

Systems, apparatus, methods, and techniques of assembly of discrete modules of a control panel are disclosed. The modules can be independently wired, tested, and installed into a control panel. Module definitions are defined specifying components to perform the electrical function, a mechanical arrangement of the components, electrical connections, and logical interactions of the module. A bill of materials can be generated based on a designation of a set of modules for a control panel and the module definitions. Modularly assembled control panels are disclosed. An assembly frame is described herein for temporarily mounting components of a module for independent assembly of a control module and for eventual removal and installation into a control panel frame. The assembly frame may include a faceplate frame and side frames and temporary mounting features.