Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a package substrate, that comprises a bumpout region on a first surface of the package substrate, and a pin region on a second surface of the package substrate. In an embodiment, a data path from the bumpout region to the pin region is included in the electronic package. In an embodiment, a ground path brackets the data path from the bumpout region to the pin region.

A semiconductor device including a substrate; bottom electrodes on the substrate, each bottom electrode including a first region and a second region, the second region containing an additional element relative to the first region; a first supporting pattern on the substrate and in contact with a portion of a side surface of each bottom electrode; a top electrode on the bottom electrodes; a dielectric layer between the bottom electrodes and the top electrode; and a capping layer between the bottom electrodes and the dielectric layer, the capping layer covering a top surface and a bottom surface of the first supporting pattern, wherein the second region is in contact with the capping layer, and the capping layer and the dielectric layer include different materials from each other.

A semiconductor device and a method of fabricating a semiconductor device, the device including a semiconductor substrate that includes a trench defining an active region; a buried dielectric pattern in the trench; a silicon oxide layer between the buried dielectric pattern and an inner wall of the trench; and a polycrystalline silicon layer between the silicon oxide layer and the inner wall of the trench, wherein the polycrystalline silicon layer has a first surface in contact with the semiconductor substrate and a second surface in contact with the silicon oxide layer, and wherein the second surface includes a plurality of silicon grains that are uniformly distributed.

A semiconductor device that enables lower power consumption and data storage imitating a human brain is provided. The semiconductor device includes a control unit, a memory unit, and a sensor unit. The memory unit includes a memory circuit and a switching circuit. The memory circuit includes a first transistor and a capacitor. The switching circuit includes a second transistor and a third transistor. The first transistor and the second transistor include a semiconductor layer including a channel formation region with an oxide semiconductor, and a back gate electrode. The control unit has a function of switching a signal supplied to the back gate electrode, in accordance with a signal obtained at the sensor unit.

A semiconductor device that enables lower power consumption and data storage imitating a human brain is provided. The semiconductor device includes a control unit, a memory unit, and a sensor unit. The memory unit includes a memory circuit and a switching circuit. The memory circuit includes a first transistor and a capacitor. The switching circuit includes a second transistor and a third transistor. The first transistor and the second transistor include a semiconductor layer including a channel formation region with an oxide semiconductor, and a back gate electrode. The control unit has a function of switching a signal supplied to the back gate electrode, in accordance with a signal obtained at the sensor unit.

The present disclosure provides a semiconductor structure having an air gap surrounding a lower portion of a bit line, and a manufacturing method of the semiconductor structure. The semiconductor structure includes a substrate; a bit line structure disposed over the substrate; a first dielectric layer, surrounding the bit line structure; a second dielectric layer, surrounding a lower portion of the first dielectric layer, wherein the second dielectric layer is separated from the first dielectric layer by a first air gap; and a third dielectric layer, surrounding an upper portion of the first dielectric layer and sealing the first air gap.

A semiconductor device includes a device layer with a semiconductor element, a first dielectric layer on the device layer, a first conductive line on the device layer and surrounded by the first dielectric layer, and a second dielectric layer on the first dielectric layer and around the first conductive line. The semiconductor includes a spacer disposed on the first conductive line and abutting a sidewall of the second dielectric layer, and a first conductive via disposed on the first conductive line and the spacer. The first conductive via includes a first segment positioned over the spacer and including a first width, and a second segment positioned between the first segment the first conductive line and including a second width. The first width is larger than the second width.

A memory structure includes a substrate; a first gate structure, a second gate structure and a third gate structure disposed on the substrate, separated from each other along the first direction and respectively extending along the second direction and the third direction; channel bodies separated from each other and passing through the first gate structure, the second gate structure and the third gate structure along the first direction; dielectric films disposed between the first gate structure, the second gate structure, the third gate structure and the channel bodies; and a first side plug electrically connected to the substrate and the channel bodies. The first gate structure, the second gate structure and the third gate structure surround each of the dielectric films and each of the channel bodies, and the dielectric films do not include a charge storage structure.

A memory cell includes a transistor and a capacitor. The transistor includes a gate electrode, a gate dielectric disposed over the gate electrode, a channel feature disposed over the gate dielectric and overlapping the gate electrode, a source electrode disposed over the channel feature and electrically connected to the capacitor, and two drain electrodes disposed over the channel feature. The drain electrodes are disposed at opposite sides of the source electrode. The channel feature has a first channel portion extending between and interconnecting one drain electrode and the source electrode, and a second channel portion extending between and interconnecting the other drain electrode and the source electrode. The gate electrode overlaps both of the first channel portion and the second channel portion of the channel feature.

The present application provides a memory device having a memory cell with reduced protrusion protruding from the memory cell. The memory device includes a semiconductor substrate having a fin portion protruding from a surface of the semiconductor substrate; a semiconductive layer disposed conformal to the fin portion; a conductive layer disposed over the semiconductive layer; an insulating layer disposed over the conductive layer; and a protrusion including a first protruding portion laterally protruding from the semiconductive layer and along the surface, a second protruding portion laterally protruding from the conductive layer and over the first protruding portion, and a third protruding portion laterally protruding from the insulating layer and over the second protruding portion, wherein the protrusion has an undercut profile.