Patent classifications
H10K2102/00
Thermally activated delayed fluorescent molecular material, a synthesizing method therefor, and an electroluminescent device
A thermally activated delayed fluorescent molecular material, a synthesizing method therefor, and an electroluminescent device are provided. The thermally activated delayed fluorescent molecular containing an indenobenzoselenoheteroaromatic ring donor is synthesized, so that an electron donating ability of the donor is increased, and an non-radiative transition rate is effectively inhibited, thereby increasing photo-luminescence quantum yield (PLQY) of the molecule; and increasing the twist angle between the electron donor and the electron acceptor. Meanwhile, electron cloud overlapping between highest occupied molecular orbital (HOMO) and lowest unoccupied molecular orbital (LUMO) is reduced, thereby obtaining a smaller ΔE.sub.ST value. The organic electroluminescent device adopts the thermally activated delayed fluorescent molecular material prepared according to the synthesizing method, and thus has high luminous efficiency and long service life.
Soft memristor for soft neuromorphic system
The present disclosure provides a soft memristor for soft neuromorphic system including a substrate, a first electrode layer formed on the substrate, a metal diffusion barrier layer formed on the first electrode layer, a resistive switching material layer formed on the metal diffusion barrier layer, and a second electrode layer formed on the resistive switching material layer.
Backside etch process for transparent silicon oxide technology
Increasing transparency of one or more micro-displays. A method includes attaching a transparent cover to at least a portion of a semiconductor wafer. The at least a portion of the semiconductor wafer includes the one or more micro-displays. The one or more micro-displays include one or more active silicon areas. The method further includes, after the transparent cover has been attached to the at least a portion of the semiconductor wafer, removing silicon between one or more of the active silicon areas.
Electronic device including display and camera
Various embodiments of the disclosure relate to an electronic device including a display and a camera. The electronic device may include a camera overlapping the display and configured to photograph external light passing through the display, wherein the display may include: a colorless and transparent substrate, a pixel layer disposed in a first direction from the substrate and comprising organic light-emitting diode (OLED) type pixels, an organic encapsulation layer (e.g., thin film encapsulation (TFE)) disposed in the first direction from the pixel layer, and a color filter layer disposed in the first direction from the organic encapsulation layer, wherein the display may include: a first area overlapping at least a portion of the camera and a second area not overlapping the camera, wherein an arrangement density of a first group of pixels in the first area may be lower than an arrangement density of a second group of pixels in the second area, and wherein the color filter layer may include first color filters overlapping the pixels of the first group, second color filters overlapping the pixels of the second group, a black matrix disposed between the second color filters in the second area, and a transmission area disposed between the first color filters in the first area.
Organic light emitting diode display
An OLED display according to an exemplary embodiment includes: a substrate that includes a display area and a non-display area; a pixel circuit that is disposed in the display area; organic light emitting diodes and barrier ribs that are disposed on the pixel circuit; an encapsulation layer that covers the pixel circuit, the organic light emitting diodes, and the barrier ribs; and a color filter that is disposed on the encapsulation layer, wherein the encapsulation layer comprises an edge area that is adjacent to the non-display area in the display area and a center area not directly adjacent to the non-display area and having the edge area disposed therebetween, the color filter comprises a first color filter, a second color filter, a third color filter, and color filter overlapped portions where the first color filter, the second color filter, and the third color filter are overlapped, and the color filter overlapped portions are disposed in areas where the barrier ribs are disposed, and a thickness of the color filter is greater in the edge area than in the center area.
3D display apparatus in which a display panel has a curvature
A 3D display apparatus in which a display panel has a curvature is provided. A lower barrier layer, an upper barrier layer and lenticular lenses may be sequentially stacked on the display panel. The lower barrier layer and the upper barrier layer may include openings corresponding pixel areas of the display panel, respectively. Each opening of the lower barrier layer and each opening of the upper barrier layer may be disposed on an imaginary line passing through the corresponding pixel area of the display panel and a setting region. Thus, in the 3D display apparatus, the quality of the realized 3D image may be improved.
N-type end-bonded metal contacts for carbon nanotube transistors
A method for manufacturing a semiconductor device includes forming a first dielectric layer on a substrate, forming a carbon nanotube (CNT) layer on the first dielectric layer, forming a second dielectric layer on the carbon nanotube (CNT) layer, patterning a plurality of trenches in the second dielectric layer exposing corresponding portions of the carbon nanotube (CNT) layer, forming a plurality of contacts respectively in the plurality of trenches on the exposed portions of the carbon nanotube (CNT) layer, performing a thermal annealing process to create end-bonds between the plurality of the contacts and the carbon nanotube (CNT) layer, and depositing a passivation layer on the plurality of the contacts and the second dielectric layer.
Display device including light emitting element including reflection electrode on which multiple metallic conductive layers are stacked and method for manufacturing same
A wiring line is provided on a TFT layer, in which the wiring line is formed in the same layer and formed of the same material as those of a reflection electrode. The reflection electrode includes a plurality of metallic conductive layers made up of a low resistance metallic material, an oxide-based lower transparent conductive layer provided on a lower surface side of a lowermost metallic conductive layer constituting a lowermost layer, an oxide-based upper transparent conductive layer having light reflectivity and provided on an upper surface side of an uppermost metallic conductive layer constituting an uppermost layer, and an oxide-based intermediate transparent conductive layer provided between the plurality of metallic conductive layers.
Light-emitting apparatus having a groove in the insulating layer between the light-emitting region and an end of the insulating layer
A light-emitting apparatus includes an insulating layer including a light-emitting region including a light-emitting element, and a groove provided in the insulating layer. The groove is provided in a portion between the light-emitting region and an end of the insulating layer, and has a zigzag pattern or a wrapping pattern.
Organic light-emitting display panel and organic light-emitting display device
An organic light-emitting display panel having a display area and a non-display area surrounding the display area and includes a base substrate, an organic light-emitting layer, a pixel definition layer, and a microlens layer that are located in the display area is disclosed. The organic light-emitting layer is located at a side of the base substrate and includes light-emitting units. The pixel definition layer includes first openings, and each light-emitting unit is located in one of the first openings. The microlens layer is located at a side of the pixel definition layer facing away from the base substrate and includes at least one first microlens. An orthogonal projection of the first microlens on the base substrate is located between orthogonal projections of two adjacent first openings on the base substrate.