A filter-based color imaging array that resolves N different colors detects only 1/N.sup.th of the incoming light. In the thermal infrared wavelength range, filtering loss is exacerbated by the lower sensor detectivity at infrared wavelengths than at visible wavelengths. To avoid loss due to filtering, most spectral imagers use bulky optics, such as diffraction gratings or Fourier transform interferometers, to resolve different colors. Fortunately, it is possible to avoid filtering loss without bulky optics: detect light with interleaved arrays of sub-wavelength-spaced antennas tuned to different wavelengths. An optically sensitive element inside each antenna absorbs light at the antenna's resonant wavelength. Metallic slot antennas offer high efficiency, intrinsic unidirectionality, and lower cross-talk than dipole or bowtie antennas. Graphene serves at the optically active material inside each antenna because its 2D nature makes it easily adaptable to this imager architecture.

A thermoelectric converter includes a first substrate that is deformable, a second substrate that is deformable, a plurality of thermoelectric conversion elements, and a group of electrodes. The plurality of thermoelectric conversion elements are disposed between the first substrate and the second substrate. The group of electrodes electrically interconnect the plurality of thermoelectric conversion elements. The plurality of thermoelectric conversion elements are arranged in a plurality of rows. The group of electrodes include a bridge electrode disposed across a first row and a second row among the plurality of rows. The first row is adjacent to the second row. The bridge electrode has a first part whose thickness is smaller than a thickness of each of remaining electrodes other than the bridge electrode among the group of electrodes and whose surface area is larger than a surface area of each of the remaining electrodes.

Method for generation of electrical power within a three-dimensional integrated structure comprising several elements electrically interconnected by a link device, the method comprising the production of a temperature gradient in at least one region of the link device resulting from the operation of at least one of the said elements, and the production of electrical power using at least one thermo-electric generator comprising at least one assembly of thermocouples electrically connected in series and thermally connected in parallel and contained within the said region subjected to the said temperature gradient.

A microelectronic device including a substrate having a semiconductor material containing an embedded thermoelectric cooler with thermally anisotropic mesas between the cold terminal and the hot terminal of the embedded thermoelectric cooler adjacent to a heat source; the adjacent embedded thermoelectric cooler providing a temperature reduction for the heat source resulting in increased safe operating area (SOA) for the microelectronic device. The thermally anisotropic mesas are formed in parallel with deep trenches used as isolation in the microelectronic device.

In some aspects, the disclosed technology provides microelectronic devices which can effectively dissipate heat and methods of forming the disclosed microelectronic devices. In some embodiments, a disclosed device may include a first integrated device die. The disclosed device may further include a thermoelectric element bonded to the first integrated device die. The disclosed device may further include a heat sink disposed over at least the thermoelectric element. The thermoelectric element may be configured to transfer heat from the first integrated device die to the heat sink. The thermoelectric element directly may be bonded to the first integrated device die without an adhesive.

Operations for integrating thermoelectric devices in Fin FET technology may be implemented in a semiconductor device having a thermoelectric device. The thermoelectric device includes a substrate and a fin structure disposed on the substrate. The thermoelectric device includes a first connecting layer and a second connecting layer disposed on opposing ends of the fin structure. The thermoelectric device includes a first thermal conductive structure thermally and a second thermal conductive structure thermally coupled to the opposing ends of the fin structure. The fin structure may be configured to transfer heat from one of the first thermal conductive structure or the second thermal conductive structure to the other thermal conductive structure based on a direction of current flow through the fin structure. In this regard, the current flow may be adjusted by a power circuit electrically coupled to the thermoelectric device.

A thermoelectric conversion module has a plurality of cold side substrates, a plurality of first electrodes, a plurality of thermoelectric conversion elements, a plurality of second electrodes, X-axis connectors, and Y-axis connectors. The second electrodes are disposed on the cold side substrates six at a time. Between adjacent cold side substrates, two of X-axis connectors as inter-substrate connectors or Y-axis connectors are disposed. One of the plurality of inter-substrate connectors is connected from one of the first electrodes positioned on one of the cold side substrates to one of the second electrodes positioned on another one of the cold side substrates. The other inter-substrate connector is connected from the other one of the first electrodes on the another one of the cold side substrates to the second electrode on the one cold side substrate.

A system and method system for conveying power from a heat source is disclosed. The system includes a conduit constructed of a heat conducting material. The conduit defines a passageway containing a primary working fluid, where the conduit is either mounted upon or extends within at least a portion of a barrier. The conduit is configured to conduct thermal energy generated by the heat source and transfer the thermal energy to the primary working fluid flowing within the passageway. The system also includes a thermoelectric generator in thermal communication with the conduit. The thermoelectric generator has a hot side and a cold side. The primary working fluid transfers the thermal energy to the hot side of the thermoelectric generator to heat the hot side of the thermoelectric generator to a temperature greater than the cold side and create electric current.

Thermoelectric conversion cells of a thermoelectric conversion element include a thermoelectric conversion layer formed on a main surface of a substrate, an insulating layer covering the thermoelectric conversion layer, a first electrode including a first layer and a second layer, and a second electrode. The first layer connects to the main surface of the thermoelectric conversion layer via a first contact hole, and the second layer covers the first layer. The second electrode connects to the main surface of the thermoelectric conversion layer via a second contact hole. The second layer and the second electrode, and the first layer are formed from materials having different work functions. In thermoelectric conversion cells that are adjacent to each other, the second layer of one of the thermoelectric conversion cells and the second electrode of the other of the thermoelectric conversion cells are formed integrally, and the thermoelectric conversion cells are connected in series.

A Peltier effect heat transfer system (208) comprising: a plurality of heat transfer elements (301-308); wherein each heat transfer element (301-308) comprises at least one semiconductor element pair arranged to yield Peltier effect heat transfer, each semiconductor element pair comprising a P-doped semiconductor element (408) and an N-doped semiconductor element (410); and the heat transfer elements (301-308) are independent such that each heat transfer element (301-308) can be activated so as to yield Peltier effect heat transfer independently of each other heat transfer element (301-308).