A method and structure for a transfer process for an acoustic resonator device. In an example, a bulk acoustic wave resonator (BAWR) with an air reflection cavity is formed. A piezoelectric thin film is grown on a crystalline substrate. A first patterned electrode is deposited on the surface of the piezoelectric film. An etched sacrificial layer is deposited over the first electrode and a planarized support layer is deposited over the sacrificial layer, which is then bonded to a substrate wafer. The crystalline substrate is removed and a second patterned electrode is deposited over a second surface of the film. The sacrificial layer is etched to release the air reflection cavity. Also, a cavity can instead be etched into the support layer prior to bonding with the substrate wafer. Alternatively, a reflector structure can be deposited on the first electrode, replacing the cavity.

An object is to provide a piezoelectric film that has excellent flexibility in a sub-zero environment and exhibits the required flexibility even at room temperature, a laminated piezoelectric element in which the piezoelectric films are laminated, and an electroacoustic transducer using the piezoelectric film or the laminated piezoelectric element. The object is solved by the piezoelectric film including: a polymer-based piezoelectric composite material in which piezoelectric particles are dispersed in a matrix including a polymer material; and electrode layers formed on both surfaces of the polymer-based piezoelectric composite material, in which a loss tangent at a frequency of 1 Hz according to dynamic viscoelasticity measurement has a maximal value of greater than or equal to 0.1 existing in a temperature range of higher than or equal to −80° C. and lower than 0° C., and has a value of greater than or equal to 0.05 at 0° C.

A film structure (10) includes a substrate (11), a piezoelectric film (14) formed on the substrate (11) and containing first composite oxide represented by a composition formula Pb(Zr.sub.1-xTi.sub.x)O.sub.3, and a piezoelectric film (15) formed on the piezoelectric film (14) and containing second composite oxide represented by a composition formula Pb(Zr.sub.1-yTi.sub.y)O.sub.3. In the composition formulae, x satisfies 0.10<x≤0.20, and y satisfies 0.35≤y≤0.55. The piezoelectric film (14) has tensile stress, and the piezoelectric film (15) has compressive stress.

Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises a front face, a back face parallel to the front face, a piezoelectric layer having a top surface electrically coupled to the signal pad and a bottom surface electrically coupled to the ground pad. In this way, the transducer can work robustly and may be automatically mounted to an imaging probe.

A method for producing a piezoelectric transducer device is provided, including a membrane including at least one silicon and/or silicon nitride layer; a piezoelectric layer including at least one piezoelectric material with crystalline perovskite structure and arranged on the membrane; first and second electrodes electrically in contact with the piezoelectric layer; and in which the piezoelectric layer is in direct contact with the silicon and/or silicon nitride layer, or in which the piezoelectric layer is in contact with the silicon and/or silicon nitride layer solely through one or more metal layers.

A method of manufacturing a power generation element includes a first step of disposing a support unit that supports a vibration unit in one end portion of the vibration unit in one direction, and disposing a weight unit in the other end portion of the vibration unit in the one direction in a substrate including the vibration unit capable of vibrating, a second step of disposing a piezoelectric unit that generates power due to vibration in a portion of the vibration unit on an opposite side from the support unit side in a thickness direction of the substrate after the support unit and the weight unit are disposed in the vibration unit, and a third step of extracting a power generation element from the substrate by cutting an outer edge of the vibration unit in the thickness direction of the substrate after the piezoelectric unit is disposed in the vibration unit.

A pen-shaped input and/or output device and a method for generating a haptic signal are disclosed. In an embodiment a device includes an actuator unit that has a piezoelectric actuator, wherein the device is a pen-shaped input and/or output device, wherein the pen-shaped input and/or output is configured to use the piezoelectric actuator as a sensor, wherein the piezoelectric actuator is configured to generate a voltage as a result of an actuation of the pen-shaped input and/or output device, and wherein the pen-shaped input and/or output device has a second electronics circuit configured to detect the voltage generated by the piezoelectric actuator and store a characteristic value for the voltage generated.

An electronic device includes a support substrate, a piezoelectric layer that is provided on the support substrate, a functional element including an electrode provided on a surface of the piezoelectric layer, a metallic frame body that is provided on the support substrate so as to surround the piezoelectric layer and the functional element in a plan view, a metallic lid that is provided on the frame body so as to form a space between the lid and the support substrate, and seals the functional element into the space, and a columnar body that is provided between the support substrate and the lid in the space.

An electronic device includes a support substrate, a piezoelectric layer that is provided on the support substrate, a functional element including an electrode provided on a surface of the piezoelectric layer, a metallic frame body that is provided on the support substrate so as to surround the piezoelectric layer and the functional element in a plan view, a metallic lid that is provided on the frame body so as to form a space between the lid and the support substrate, and seals the functional element into the space, and a columnar body that is provided between the support substrate and the lid in the space.

The disclosure describes techniques to damp the proof mass motion of an accelerometer while achieving an underdamped resonator. In an example of an in-plane micro-electromechanical systems (MEMS) VBA, the proof mass may contain one or more damping combs that include one or more banks of rotor comb fingers attached to the proof mass. The rotor comb fingers may be interdigitated with stator comb fingers that are attached to fixed geometry. These damping comb fingers may provide air damping for the proof mass when the MEMS die is placed into a package containing a pressure above a vacuum. The geometry of the damping combs with a reduced air gap and large overlap area between the rotor comb fingers and stator comb fingers. The geometry of resonator of the VBA of this disclosure may be configured to avoid air damping.