H10N35/00

FLUID TRANSPORT SYSTEMS COMPRISING A MAGNETIC SHAPE MEMORY PIPE

A fluid transport system that includes a magnetic shape memory pipe having an input end opposite an output end and an outer surface opposite an inner surface. The inner surface defines an inner diameter of the magnetic shape memory pipe and the magnetic shape memory pipe includes a magnetic shape memory alloy. The fluid transport system further includes one or more magnetic field generating devices surrounding the outer surface of the magnetic shape memory pipe and configured to generate a control magnetic field that, when applied to a region of the magnetic shape memory pipe, alters the inner diameter of the region of the magnetic shape memory pipe.

METHOD FOR PRODUCING A DEFORMATION BODY FOR MEASURING A FORCE AND/OR A TORQUE FOR A ROLL STABILIZATION SYSTEM FOR A VEHICLE, AND DEFORMATION BODY
20230408353 · 2023-12-21 · ·

A method is proposed for the production of a deformation body (100) for measuring a force and/or a torque for a roll stabilization system of a vehicle. In one example, the method comprises a step of preparing a support material, a step of producing a central element (104) that can be connected to the support material and can be deformed by the force, and a step of connecting the support material to the central element (104) in order to produce the deformation body (100).

METHOD OF MANUFACTURING AN AMBIENT ENERGY TRANSDUCER, IN PARTICULAR AN AMBIENT ENERGY ELECTRIC ELEMENT

A method of manufacturing an ambient energy converter that includes a supporting substrate of a first conductor material as a first electrode, a layer of ferroelectric material, and a layer of a second conductor material as a second electrode. The two conductor materials have different concentrations of free electrons. The ferroelectric material includes one or more ferroelectric semiconductors. The method includes providing a plate of the conductor material for the first electrode as a supporting substrate, subjecting the carrier substrate to a surface treatment, depositing the layer of ferroelectric material (BTO layer) on a front side of the carrier substrate, masking the edges of the BTO layer on the front side of the carrier substrate while leaving at least one portion located within the edges of the BTO layer free, and applying the conductor material intended for the second electrode to the area kept free of masking.

Flexible Printed Circuit Board (PCB) -Based Mobile Sensor Platform
20230412095 · 2023-12-21 ·

Novel tools and techniques are provided for implementing flexible printed circuit board (PCB)-based mobile sensor platform. In various embodiments, a flexible PCB-based mobile sensor platform includes a body portion(s) and at least one of a microcontroller, a locomotion system, sensors, a transceiver(s), and/or the like, each disposed on the body portion(s). The locomotion system includes one or more flexible PCB portions and corresponding actuators. Based on instructions from the microcontroller, at least one actuator may cause bending and unbending of a corresponding flexible PCB portion(s) that causes the flexible PCB-based mobile sensor platform to move toward a target location within a first environment. Upon arrival, the sensors may collect sensor data regarding at least one of the target location, an object located at the target location, or a portion of the object, and the microcontroller may send the collected sensor data to an external device via the transceiver.

Flexible Printed Circuit Board (PCB) -Based Mobile Sensor Platform
20230412095 · 2023-12-21 ·

Novel tools and techniques are provided for implementing flexible printed circuit board (PCB)-based mobile sensor platform. In various embodiments, a flexible PCB-based mobile sensor platform includes a body portion(s) and at least one of a microcontroller, a locomotion system, sensors, a transceiver(s), and/or the like, each disposed on the body portion(s). The locomotion system includes one or more flexible PCB portions and corresponding actuators. Based on instructions from the microcontroller, at least one actuator may cause bending and unbending of a corresponding flexible PCB portion(s) that causes the flexible PCB-based mobile sensor platform to move toward a target location within a first environment. Upon arrival, the sensors may collect sensor data regarding at least one of the target location, an object located at the target location, or a portion of the object, and the microcontroller may send the collected sensor data to an external device via the transceiver.

Actuator device and method for operating an actuator device
10928625 · 2021-02-23 · ·

An actuator device includes at least one stationary unit, with at least one electromagnetic actuator element which is movable relative to the stationary unit, and with at least one shape-memory element which is implemented at least partly of a shape-shiftable shape-memory material, wherein the shape-memory element is configured, in at least one operation state, to at least partly hinder a movement of the actuator element in a first movement direction and in a second movement direction that differs from the first movement direction, at least via a mechanical deformation.

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

A method for fabricating semiconductor device includes the steps of: forming a substrate having a magnetic tunneling junction (MTJ) region and a logic region; forming a MTJ on the MTJ region; forming a top electrode on the MTJ; forming an inter-metal dielectric (IMD) layer around the MTJ; removing the IMD layer directly on the top electrode to form a recess; forming a first hard mask on the IMD layer and into the recess; removing the first hard mask and the IMD layer on the logic region to form a contact hole; and forming a metal layer in the recess and the contact hole to form a connecting structure on the top electrode and a metal interconnection on the logic region.

Magnetostrictive actuator with center bias

Exemplary practice of the present invention provides a magnetostrictive actuator characterized by linear force output and uniform magnetic biasing. A center bias magnet combined with a flux transfer tube produces a uniform magnetic bias down the length of a magnetostrictive component. Depending on the inventive embodiment, the magnetostrictive component may include one magnetostrictive element or a pair of collinear magnetostrictive elements. A center bias magnet, in combination with a flux transfer tube, drives magnetic flux through the magnetostrictive component (e.g., a series of magnetostrictive rods) in opposite directions, while surrounding drive coils apply flux in the same direction through the magnetostrictive component. The net response is substantially linear with respect to the drive coil current. The flux transfer tube applies distributed magnetic flux to the magnetostrictive component at a rate that ensures uniform magnetic flux density down the length of the magnetostrictive component.

SWEPT VERTICAL MAGNETIC FIELD ACTUATION ELECTROMOTIVE DRIVE AND PUMP
20210082604 · 2021-03-18 ·

A system may include a magnetic shape memory (MSM) element having a first end and a second end, where a longitudinal axis of the MSM element extends from the first end to the second end. The system may further include a permanent magnet having a first pole and a second pole, where the first pole and the second pole are aligned perpendicularly to the longitudinal axis of the MSM element. The system may also include a first electromagnet directed to the first end of the MSM element and a second electromagnet directed to the second end of the MSM element.

Semiconductor device and method for fabricating the same

A method for fabricating semiconductor device includes the steps of: forming a substrate having a magnetic tunneling junction (MTJ) region and a logic region; forming a MTJ on the MTJ region; forming a top electrode on the MTJ; forming an inter-metal dielectric (IMD) layer around the MTJ; removing the IMD layer directly on the top electrode to form a recess; forming a first hard mask on the IMD layer and into the recess; removing the first hard mask and the IMD layer on the logic region to form a contact hole; and forming a metal layer in the recess and the contact hole to form a connecting structure on the top electrode and a metal interconnection on the logic region.