A Hall sensor includes a Hall well, such as an implanted region in a surface layer of a semiconductor structure, and four doped regions spaced apart from one another in the implanted region. The implanted region and the doped regions include majority carriers of the same conductivity type. The sensor also includes a dielectric layer that extends over the implanted region, and an electrode layer over the dielectric layer to operate as a control gate to set or adjust the sensor performance. A first supply circuit provides a first bias signal to a first pair of the terminals, and a second supply circuit provides a second bias signal to the electrode layer.

Damascene-based approaches for embedding spin hall MTJ devices into a logic processor, and the resulting structures, are described. In an example, a logic processor includes a logic region including a metallization layer. The logic processor also includes a memory array including a plurality of two-transistor one magnetic tunnel junction (MTJ) spin hall effect electrode (2T-1MTJ SHE electrode) bit cells. The spin hall effect electrodes of the 2T-1MTJ SHE electrode bit cells are disposed in a lower dielectric layer laterally adjacent to the metallization layer of the logic region. The MTJs of the 2T-1MTJ SHE electrode bit cells are disposed in an upper dielectric layer laterally adjacent to the metallization layer of the logic region.

Various embodiments provide a triaxial magnetic sensor, formed on or in a substrate of semiconductor material having a surface that includes a sensing portion and at least one first and one second sensing wall, which are not coplanar to each other. The sensing portion and the first sensing wall form a first solid angle, the sensing portion and the second sensing wall form a second solid angle, and the first sensing wall and the second sensing wall form a third solid angle. A first Hall-effect magnetic sensor extends at least partially over the sensing portion, a second Hall-effect magnetic sensor extends at least partially over the first sensing wall, and a third Hall-effect magnetic sensor extends at least partially over the second sensing wall.

Diffusing a root identity of an entity among association and event covenants in a multi-dimensional computing security system involves generating a first generation of diffusion of identities of entities participating in mediated association and generating a second generation of diffusion of identities of the entities through recombinant mediated association of the entities and at least one other entity. The second generation of diffusion of identities facilitates securely constraining a computing system action associated with one of the entities.

A magnetic sensor includes first to fourth resistor sections and a plurality of MR elements. Each of the plurality of MR elements belongs to any of first to fourth groups. The first to fourth groups are defined based on the areas of top surfaces of the MR elements. The first resistor section, the second resistor section, the third resistor section, and the fourth resistor section are constituted of the first group, the second group, the third group, and the fourth group, respectively; the second group, the first group, the fourth group, and the third group, respectively; the first group, the fourth group, the third group, and the second group, respectively; or the third group, the second group, the first group, and the fourth group, respectively.

Synthesizing a control object for a computing event, the control object for securing a computing resource based on a set of access and privilege information provided through a set of mediated associations that are represented by an enchained set of certificates, portions of which are encrypted including entity-specific paths to entity-specific predecessor certificates and partial decryption keys therefor, wherein the control object is applied to secure the computing resource for performing a computing action indicated by a process-type entity identified in the certificate for the control object.

A method for manufacturing a Hall sensor, an insulation layer being initially applied to a wafer including an ASIC or integrated into the wafer, a Hall layer, for example, made of InSb or another III-V semiconductor material, being situated thereon, and this Hall layer being at least sectionally recrystallized with the aid of a laser. The insulation layer may be porous or may include a cavity or reflective layer for thermal protection of the ASIC.

A magnetic field controlled transistor circuit includes a first electrode, a second electrode, and a channel including a magneto-resistive material. The channel is arranged between the first and second electrodes and electrically coupled to the first and second electrodes. The transistor circuit further includes a third electrode, a fourth electrode, and a control layer including an electrically conductive material. The control layer is arranged between the third and fourth electrodes and electrically coupled to the third and fourth electrodes. In addition, an insulating layer including an insulating material is provided. The insulating layer is arranged between the channel and the control layer and configured to electrically insulate the channel from the control layer. A related method for operating a transistor circuit and a corresponding design structure are also provided.

A one-dimensional magnetic field sensor comprises a support, a single elongated magnetic field concentrator or two magnetic field concentrators, which are separated by a first gap, and at least one magnetic sensor element. The magnetic field concentrator, or both thereof, consists of at least two parts which are separated from each other by second gaps. A two-dimensional magnetic field sensor comprises a support, a single magnetic field concentrator which consists of at least three parts which are separated from each other by gaps, and at least two magnetic sensor elements.

A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a “Z” axis magnetic field onto sensors orientated in the XY plane.