A device structure includes a first series connection of a first phase change memory (PCM) switch and a second PCM switch. The first PCM switch includes a first heater line, a first PCM line, and a first contact electrode and a second contact electrode located on the first heater line. The second PCM switch includes a second heater line, a second PCM line, and a third contact electrode and a fourth contact electrode located on the second heater line. The second contact electrode is electrically connected to the third contact electrode. The fourth contact electrode is electrically grounded. One of the first contact electrode and the second contact electrode includes an radio-frequency (RF) signal input port. Another of the first contact electrode and the second contact electrode comprises an RF signal output port. The device structure may function as a combination PCM switch that decreases noise level during signal transmission.

The present disclosure relates to a switch system that provides a control method for switches based on dual-phase materials. The disclosed switch system includes a heat resistor, a power management (PM) unit configured to provide a control voltage at a voltage port coupled to the heat resistor, and a phase-change-based switch. Herein, the heat resistor is underneath the phase-change-based switch, and configured to generate heat energy from the control voltage and provide the heat energy to the phase-change-based switch. The phase-change-based switch is capable of being switched on and off by switching between a crystalline phase and an amorphous phase based on the heat energy provided by the heat resistor. The control voltage provided by the PM unit contains waveform information of target heat energy required for switching on and off the phase-change-based switch.

The present disclosure relates to a switch system that provides a control method for switches based on dual-phase materials. The disclosed switch system includes a heat resistor, a power management (PM) unit configured to provide a control voltage at a voltage port coupled to the heat resistor, and a phase-change-based switch. Herein, the heat resistor is underneath the phase-change-based switch, and configured to generate heat energy from the control voltage and provide the heat energy to the phase-change-based switch. The phase-change-based switch is capable of being switched on and off by switching between a crystalline phase and an amorphous phase based on the heat energy provided by the heat resistor. The control voltage provided by the PM unit contains waveform information of target heat energy required for switching on and off the phase-change-based switch.

A pyroelectric generator may be included in the same semiconductor device as a radio frequency (RF) switch (e.g., a phase-change material (PCM) RF switch and/or other types of RF switch). The pyroelectric generator includes a pyroelectric material layer between two electrodes. The pyroelectric generator is configured to scavenge thermal energy that is generated during the operation of the RF switch, and to convert the thermal energy into electrical energy that may be stored and reused.

A dielectric isolation layer having a top surface may be formed over a substrate. A heater line, a phase change material (PCM) line, and an in-process conductive barrier plate may be formed over the dielectric isolation layer. An electrode material layer may be formed over the in-process conductive barrier plate. The electrode material layer and the in-process conductive barrier plate may be patterned such that patterned portions of the in-process conductive barrier plate include a first conductive barrier plate contacting a first area of a top surface of the PCM line, and a second conductive barrier plate contacting a second area of the top surface of the PCM line, and patterned portions of the electrode material layer include a first electrode contacting the first conductive barrier plate and a second electrode contacting the second conductive barrier plate.

A dielectric isolation layer having a top surface may be formed over a substrate. A heater line, a phase change material (PCM) line, and an in-process conductive barrier plate may be formed over the dielectric isolation layer. An electrode material layer may be formed over the in-process conductive barrier plate. The electrode material layer and the in-process conductive barrier plate may be patterned such that patterned portions of the in-process conductive barrier plate include a first conductive barrier plate contacting a first area of a top surface of the PCM line, and a second conductive barrier plate contacting a second area of the top surface of the PCM line, and patterned portions of the electrode material layer include a first electrode contacting the first conductive barrier plate and a second electrode contacting the second conductive barrier plate.

A dielectric isolation layer having a top surface may be formed over a substrate. A heater line, a phase change material (PCM) line, and an in-process conductive barrier plate may be formed over the dielectric isolation layer. An electrode material layer may be formed over the in-process conductive barrier plate. The electrode material layer and the in-process conductive barrier plate may be patterned such that patterned portions of the in-process conductive barrier plate include a first conductive barrier plate contacting a first area of a top surface of the PCM line, and a second conductive barrier plate contacting a second area of the top surface of the PCM line, and patterned portions of the electrode material layer include a first electrode contacting the first conductive barrier plate and a second electrode contacting the second conductive barrier plate.

A dielectric isolation layer having a top surface may be formed over a substrate. A heater line, a phase change material (PCM) line, and an in-process conductive barrier plate may be formed over the dielectric isolation layer. An electrode material layer may be formed over the in-process conductive barrier plate. The electrode material layer and the in-process conductive barrier plate may be patterned such that patterned portions of the in-process conductive barrier plate include a first conductive barrier plate contacting a first area of a top surface of the PCM line, and a second conductive barrier plate contacting a second area of the top surface of the PCM line, and patterned portions of the electrode material layer include a first electrode contacting the first conductive barrier plate and a second electrode contacting the second conductive barrier plate.

A phase change switch device is provided, including: a first phase change switch including a phase change material, a heater device arranged to heat the phase change material, a first switch terminal electrically coupled to the phase change material, a second switch terminal electrically coupled to the phase change material, a first heater supply terminal electrically coupled to the heater and a second heater supply terminal electrically coupled to the heater, a second phase change switch including a phase change material, a heater device arranged to heat the phase change material, a first switch terminal electrically coupled to the phase change material, a second switch terminal electrically coupled to the phase change material, a first heater supply terminal electrically coupled to the heater and a second heater supply terminal electrically coupled to the heater, wherein the first switch terminal of the second phase change switch is electrically coupled to the first heater supply terminal of the second phase change switch.

A phase change switch device is provided, including: a first phase change switch including a phase change material, a heater device arranged to heat the phase change material, a first switch terminal electrically coupled to the phase change material, a second switch terminal electrically coupled to the phase change material, a first heater supply terminal electrically coupled to the heater and a second heater supply terminal electrically coupled to the heater, a second phase change switch including a phase change material, a heater device arranged to heat the phase change material, a first switch terminal electrically coupled to the phase change material, a second switch terminal electrically coupled to the phase change material, a first heater supply terminal electrically coupled to the heater and a second heater supply terminal electrically coupled to the heater, wherein the first switch terminal of the second phase change switch is electrically coupled to the first heater supply terminal of the second phase change switch.