A method for forming a capacitor opening hole and a method for forming a memory capacitor are provided. The method for forming a capacitor opening hole includes: providing a substrate, and forming a sacrificial layer and a supporting layer, which are stacked, on the surface of the substrate (S100); forming multiple hollow first side wall structures, spaced apart, on the surface of the supporting layer (S200); forming a second material layer on the surface of the first side wall structure to constitute a second side wall structure (S300); and etching the sacrificial layer and the supporting layer by taking the first side wall structure and the second side wall structure as masks to form the capacitor opening hole (S400).

In one aspect, a semiconductor device includes: a first metal layer disposed on a substrate; a dielectric layer disposed on a side of the first metal layer distant from the substrate; a second metal layer disposed on a side of the dielectric layer distant from the first metal layer, the potential of the second metal layer being higher than the potential of the first metal layer; and a metal ring disposed on a side of the dielectric layer distant from the first metal layer, the metal ring being arranged around an outer side of the second metal layer. A portion of the metal ring is located in the dielectric layer.

The present disclosure provides a high-temperature resistant nano-copper produced by laser direct writing, a preparation method and an application thereof. The high-temperature resistant nano-copper exhibits excellent oxidation resistance, thermal stability and superior conductivity. In this disclosure, the preparation is simple, and the nano-copper oxide ink can be stored for extended periods without being affected by oxidation. It is suitable for various manufacturing processes including printing, coating, and other similar methods. Moreover, based on laser direct writing, the processing efficiency is high, enabling the one-step integration of multi-performance of the high-temperature resistant nano-copper. The high-temperature resistant nano-copper described in the present disclosure can be used as an interconnection circuit in an integrated sensor system based on all-laser in-situ direct writing, and can be widely applied in fields of aerospace, automobile, electronics, etc.

A method for manufacturing a capacitor array includes: providing a substrate provided with a device area configured for forming a capacitor and a peripheral area located at a periphery of the device area; forming successively a first support layer and a first sacrificial layer on the substrate; etching the first sacrificial layer of the peripheral area to expose the first support layer, so as to form a first via; and filling the first via to form a support pillar.

A method for manufacturing a capacitor array includes: providing a substrate provided with a device area configured for forming a capacitor and a peripheral area located at a periphery of the device area; forming successively a first support layer and a first sacrificial layer on the substrate; etching the first sacrificial layer of the peripheral area to expose the first support layer, so as to form a first via; and filling the first via to form a support pillar.

Disclosed are a capacitor dielectric layer, a manufacturing method therefor, and a capacitor structure. The capacitor dielectric layer includes any at least two stacked layers among a first stacked layer, a second stacked layer, and a third stacked layer, which are stacked along a first direction. Each stacked layer includes a first dielectric layer and a second dielectric layer. A main crystalline phase of the first dielectric layer is at least one of a tetragonal structure phase and an orthorhombic structure phase, and a main crystalline phase of the second dielectric layer is at least one of the tetragonal structure phase and the orthorhombic structure phase. The capacitor dielectric layer has a high dielectric constant and low leakage current.

Methods for fabricating optically active quantum memories into quantum-grade diamond thin films and then bonding them to semiconductor substrates are described. Semiconductor substrates are optically and electronically functionalized in preparation for using a flip-chip bonding technique to bond the functionalized substrates to overgrown diamond thin films that host color centers. By purposefully growing quantum-grade diamond thin films and implanting them with color centers separately from fabrication processes that functionalize the substrates, the high quality, purity, and crystallinity of the thin films are preserved, while also allowing for further customization of the types of color centers that are implanted into the diamond.

Methods for fabricating optically active quantum memories into quantum-grade diamond thin films and then bonding them to semiconductor substrates are described. Semiconductor substrates are optically and electronically functionalized in preparation for using a flip-chip bonding technique to bond the functionalized substrates to overgrown diamond thin films that host color centers. By purposefully growing quantum-grade diamond thin films and implanting them with color centers separately from fabrication processes that functionalize the substrates, the high quality, purity, and crystallinity of the thin films are preserved, while also allowing for further customization of the types of color centers that are implanted into the diamond.