A method and apparatus for protecting a furnace floor of a black liquor recovery boiler, where the furnace floor is covered by a protective layer, the protective layer being formed of a salt mixture including at least two different salts.

A method and apparatus for protecting a furnace floor of a black liquor recovery boiler, where the furnace floor is covered by a protective layer, the protective layer being formed of a salt mixture including at least two different salts.

Provided is a slot die coater including: at least two die blocks; a shim plate provided between the two die blocks to form a slot; and a manifold provided in the die block and configured to accommodate a coating solution, wherein the slot die coater is configured to discharge and apply the coating solution to a substrate. The shim plate includes an open portion such that a coating width of a coating layer applied on the substrate is determined, and a part of a corner of the shim plate defining the open portion from which the coating solution is discharged, is chamfered. When a thickness of the coating solution applied on the substrate is A, the chamfered part has a shape cut by a depth equal to or greater than A to inside of the corner in a region away inward by A from the end of the shim plate.

There is provided a multi-slot die coater that is easy to adjust a coating gap and can achieve widthwise deviation control of the coating gap. According to the present disclosure, a step is formed between rear surfaces of die blocks through a fixing block including a step adjustment block. The step adjustment block has a preset thickness, and the step adjustment block is mounted between any one die block and a flat plate-shaped block, and the other die block is coupled to the flat plate-shaped block, and thus the step is naturally formed between the rear surfaces of the die blocks by the coupling of the die blocks to the fixing block including the step adjustment block.

Embodiments of the invention are directed to a thin film fabricating apparatus which may be employed in mass production and may stably provide a uniform nano-order layer. An exemplary embodiment of a thin film fabricating apparatus includes: an electrode bath which contains a thin film-forming material; a plurality of needle electrodes disposed in the electrode bath; a plurality of ring electrodes disposed on the electrode bath at positions corresponding to the needle electrodes; and a substrate stand disposed opposite to the needle electrodes and the ring electrodes, where the substrate stand holds the substrate, on which a thin film is to be formed.

A fluid application device having a contact nozzle assembly with a fluidic oscillator is provided. The fluid application device includes an applicator head and a nozzle assembly. The nozzle assembly includes a first conduit configured to receive a first fluid from the applicator head, a second conduit configured to receive a second fluid from the applicator head and an application conduit including a receptacle and first and second branches. The receptacle is fluidically connected with the first conduit and configured to receive the first fluid. The first and second branches are fluidically connected to the second conduit and receptacle and are configured to receive the second fluid. The nozzle assembly further includes an orifice fluidically connected to the application conduit and configured to discharge the first fluid for application onto a strand of material, and a guide slot extending from the orifice and configured to receive the strand of material.

Methods, systems, and compositions for the liquid-phase deposition (LPD) of thin films. The thin films can be coated onto the surface of porous components of electrochemical devices, such as battery electrodes. Embodiments of the present disclosure achieve a faster, safer, and more cost-effective means for forming uniform, conformal layers on non-planar microstructures than known methods. In one aspect, the methods and systems involve exposing the component to be coated to different liquid reagents in sequential processing steps, with optional intervening rinsing and drying steps. Processing may occur in a single reaction chamber or multiple reaction chambers.

Methods, systems, and compositions for the liquid-phase deposition (LPD) of thin films. The thin films can be coated onto the surface of porous components of electrochemical devices, such as battery electrodes. Embodiments of the present disclosure achieve a faster, safer, and more cost-effective means for forming uniform, conformal layers on non-planar microstructures than known methods. In one aspect, the methods and systems involve exposing the component to be coated to different liquid reagents in sequential processing steps, with optional intervening rinsing and drying steps. Processing may occur in a single reaction chamber or multiple reaction chambers.

Methods, systems, and compositions for the liquid-phase deposition (LPD) of thin films. The thin films can be coated onto the surface of porous components of electrochemical devices, such as battery electrodes. Embodiments of the present disclosure achieve a faster, safer, and more cost-effective means for forming uniform, conformal layers on non-planar microstructures than known methods. In one aspect, the methods and systems involve exposing the component to be coated to different liquid reagents in sequential processing steps, with optional intervening rinsing and drying steps. Processing may occur in a single reaction chamber or multiple reaction chambers.

Methods, systems, and compositions for the liquid-phase deposition (LPD) of thin films. The thin films can be coated onto the surface of porous components of electrochemical devices, such as battery electrodes. Embodiments of the present disclosure achieve a faster, safer, and more cost-effective means for forming uniform, conformal layers on non-planar microstructures than known methods. In one aspect, the methods and systems involve exposing the component to be coated to different liquid reagents in sequential processing steps, with optional intervening rinsing and drying steps. Processing may occur in a single reaction chamber or multiple reaction chambers.