An implantable device includes a flexible cable, a circuit chip, a fluid adhesion layer, and a vapor deposited layer. The flexible cable includes a lead-in part, a stimulation part and a connection part connected between the lead-in part and the stimulation part. The circuit chip is fixed to a surface of one side of the lead-in part, and is electrically connected to the lead-in part. The fluid adhesion layer is adhered to an outer side of the circuit chip and an outer side of the lead-in part. The vapor deposited layer (4) is directly deposited on an outer side of the fluid adhesion layer.

A method of pretinning a guidewire core made of shape memory alloy and having an elongate axis, comprising: placing a ball of solder in a pocket in a soldering block; melting the ball of solder; holding a guidewire core over the ball of solder; lowering the guidewire core into the ball of solder; removing the guidewire from the ball of solder.

Methods for hydrophobizing bowstrings are described herein. In one aspect, the method can include applying a silicone-based hydrophobic coating to the bowstring; and curing the bowstring for a predefined period of time.

A composition for coating an overhead conductor is disclosed comprising: (i) a reflective agent; (ii) a photocatalytic 0 agent comprising ≥70 wt % anatase titanium dioxide (TiO.sub.2) having an average particle size (“aps”)≤100 nm; (iii) a polyorganosiloxane binder; and (iv) a superhydrophobic agent comprising either: surface functionalised silica nanoparticles, a functional polysiloxane or a polymethylsilsesquioxane.

A water-repellent structure includes: a base material; and a water-repellent layer located on a surface of the base material. The water-repellent layer contains water-repellent particles and filler particles having an average particle size that is 20 times or more as large as an average particle size of the water-repellent particles.

A method of pretinning a core wire for a guidewire having an elongate axis, comprising placing a ball of solder within a pocket in a soldering block; melting the ball of solder; holding a core wire over the ball of solder, with the elongate axis in a horizontal orientation; lowering a portion of the core wire into the ball of solder while maintaining the elongate axis in a horizontal orientation; removing the core wire from the ball of solder.

A method for altering adhesion properties of a surface of a substrate by a coating, comprising the steps of: a) ionizing a plasma gas at low temperature and at atmospheric pressure, thereby creating a plasma with a plasma temperature of at most 50° C.; b) introducing a precursor into a plasma gas afterglow of the plasma; c) subjecting the surface of the substrate to the plasma including the precursor, thereby forming a coating onto the surface. The plasma gas is essentially completely comprised of inert gas. The coating alters the adhesion properties of the surface.

A surface protect material is described that is high in UV resistance, able to protect the surface of the prepreg used as the parent material, able to prevent a fiber composite material from being deteriorated by UV, able to prevent defects during painting, able to serve for control of the resin flow, and is low in the volatilization percentage during curing, where the surface protect material is a coating agent for spraying or manual application comprising an epoxy resin composition containing at least the components [A] to [D]: [A] non-aromatic epoxy resin, [B] pigment having an number average particle size of 0.1 to 10 μm, [C] non-aromatic thermoplastic resin, and [D] cationic curing agent or anionic curing agent.

The present invention relates to a process for electroplating an adhesive composition onto at least one conductive element, in which the conductive element is placed in contact with the adhesive composition comprising: a phosphate salt and a resin based on: a compound A1, compound A1 being chosen from a compound A11 comprising at least two functions, one of these functions being a hydroxymethyl function and the other being an aldehyde function or a hydroxymethyl function, or a compound A12 comprising at least one aldehyde function, or a mixture of a compound A11 and of a compound A12; and a phenol A21. A potential difference is applied between the conductive element and the adhesive composition to coat the conductive element with an adhesive layer.

Methods for hydrophobizing bowstrings are described herein. In one aspect, the method can include applying a silicone-based hydrophobic coating to the bowstring; and curing the bowstring for a predefined period of time.