A wafer processing method of the present invention includes mounting a wafer part on a chuck table, loading a ring cover unit on the chuck table to restrain the wafer part to the chuck table, spraying, by a spray suction arm module, a processing solution onto the wafer part and suctioning, by the spray suction arm module, foreign materials from the processing solution, unloading the ring cover unit from the chuck table, and spraying, by a spray arm module, a cleaning solution onto the wafer part to clean the wafer part.

A wafer processing method of the present invention includes mounting a wafer part on a chuck table, loading a ring cover unit on the chuck table to restrain the wafer part to the chuck table, spraying, by a spray suction arm module, a processing solution onto the wafer part and suctioning, by the spray suction arm module, foreign materials from the processing solution, unloading the ring cover unit from the chuck table, and spraying, by a spray arm module, a cleaning solution onto the wafer part to clean the wafer part.

The present application discloses a display panel manufacturing device and a cleaning method. The display panel manufacturing device includes: a machine table, a working pipeline, a gas supply means and a liquid supply means; a detection means is provided on the machine table; a first automatic valve is provided on a gas supply pipeline; and a second automatic valve is provided on a liquid supply pipeline.

The present application discloses a display panel manufacturing device and a cleaning method. The display panel manufacturing device includes: a machine table, a working pipeline, a gas supply means and a liquid supply means; a detection means is provided on the machine table; a first automatic valve is provided on a gas supply pipeline; and a second automatic valve is provided on a liquid supply pipeline.

A light-emitting device includes: a first light- emitting unit that extends in one direction and has a first emission surface located along the one direction, the first emission surface emitting light; a second light-emitting unit that is located in the one direction with respect to the first light-emitting unit, that extends in the one direction, and that has a second emission surface located along the one direction, the second emission surface emitting light; a first cleaning unit that is capable of moving in the one direction and an opposite direction that is opposite to the one direction to clean the first emission surface; a second cleaning unit that is capable of moving in the one direction and the opposite direction to clean the second emission surface; and a transmission unit that extends from the first cleaning unit and the second cleaning unit in the one direction and that transmits a moving force for moving the first cleaning unit and the second cleaning unit to the first cleaning unit and the second cleaning unit.

A light-emitting device includes: a first light- emitting unit that extends in one direction and has a first emission surface located along the one direction, the first emission surface emitting light; a second light-emitting unit that is located in the one direction with respect to the first light-emitting unit, that extends in the one direction, and that has a second emission surface located along the one direction, the second emission surface emitting light; a first cleaning unit that is capable of moving in the one direction and an opposite direction that is opposite to the one direction to clean the first emission surface; a second cleaning unit that is capable of moving in the one direction and the opposite direction to clean the second emission surface; and a transmission unit that extends from the first cleaning unit and the second cleaning unit in the one direction and that transmits a moving force for moving the first cleaning unit and the second cleaning unit to the first cleaning unit and the second cleaning unit.

A robotic system for providing a surface cleaning device to a solar panel device, the robotic system may include (a) a drive unit that is configured to move the robotic system in relation to the solar panel device; (b) a support unit that comprises guiding elements, the guiding elements are configured to support the surface cleaning device; wherein the guiding elements comprise a first guiding element and a second guiding element; (c) an alignment unit that is configured to align, during an alignment process, the first guiding element and the second guiding element with the solar panel device; (d) sensing units that comprises a first sensing unit and a second sensing unit; wherein the first sensing unit is configured to sense a first spatial relationship between the first guiding element and a first portion of the solar panel device; wherein the second sensing unit is configured to sense a spatial relationship.

A robotic system for providing a surface cleaning device to a solar panel device, the robotic system may include (a) a drive unit that is configured to move the robotic system in relation to the solar panel device; (b) a support unit that comprises guiding elements, the guiding elements are configured to support the surface cleaning device; wherein the guiding elements comprise a first guiding element and a second guiding element; (c) an alignment unit that is configured to align, during an alignment process, the first guiding element and the second guiding element with the solar panel device; (d) sensing units that comprises a first sensing unit and a second sensing unit; wherein the first sensing unit is configured to sense a first spatial relationship between the first guiding element and a first portion of the solar panel device; wherein the second sensing unit is configured to sense a spatial relationship.

A substrate processing apparatus 1 includes a controller 61 configured to perform a first recipe and a second recipe in parallel. Each of the first recipe and the second recipe includes a first transfer processing of transferring a substrate from a transit unit 14 to a liquid processing unit 17, a liquid processing, a second transfer processing of transferring the substrate from the liquid processing unit 17 to a drying unit 18 and a drying processing. The controller 61 determines, while the first recipe on a first substrate in substrates is being performed, when the second recipe on a second substrate in the substrates is started, a start timing of the first transfer processing of the second substrate such that a time period of the second transfer processing of the first substrate does not overlap with a time period of the second transfer processing of the second substrate.

A substrate processing apparatus 1 includes a controller 61 configured to perform a first recipe and a second recipe in parallel. Each of the first recipe and the second recipe includes a first transfer processing of transferring a substrate from a transit unit 14 to a liquid processing unit 17, a liquid processing, a second transfer processing of transferring the substrate from the liquid processing unit 17 to a drying unit 18 and a drying processing. The controller 61 determines, while the first recipe on a first substrate in substrates is being performed, when the second recipe on a second substrate in the substrates is started, a start timing of the first transfer processing of the second substrate such that a time period of the second transfer processing of the first substrate does not overlap with a time period of the second transfer processing of the second substrate.