A cleaning device for selectively bombarding a surface with a media sequence, the sequence including at least a first gaseous medium and a second liquid medium, includes a nozzle configured to bombard the surface with the second medium; a cleaning valve with a holding port, a pressure port, a plunger, and a pressure outlet; and a high-pressure accumulator configured to store the first medium. The first medium is loaded with an accumulator pressure. The cleaning device further includes a changeover valve configured to selectively create a connection between a first medium supply line and a holding line connected to the holding port. The pressure outlet is configured to bombard the surface with the first medium in pulse-like fashion.

A robotic device for working on a surface includes a body including: a tool for working on the surface; a controller moving the body along the surface; a first set of at least two rotors mounted to the body and generating thrust in a first direction towards the surface; and a second set of at least two rotors mounted to the body and generating thrust in a second direction away from the surface. A sensor measures a distance between the body and the surface, and a computer adjusts the first set of rotors and the second set of rotors in response to the sensor to place the body in position to work on the surface. In particular, the first set of rotors and the second set of rotors generate a net force on the body to it in non-contact position to work on the surface.

The present invention provides a method for cleaning a component for use in an ultra-high vacuum. The method may comprise the steps of placing the component to be cleaned in a vacuum furnace chamber; plasma cleaning the component at a temperature of greater than about 80° C.; and evacuating the chamber to a pressure of less than about 10E-5 mbar. Apparatus for performing such methods and kits comprising said components are also provided.

The present application provides a dispensing apparatus for processing an electronic component, comprising: a first track component and a second track component, a first flow-guiding component and a second flow-guiding component, the first flow-guiding component being arranged at the top of the first track component, the second flow-guiding component being arranged at the top of the second track component, the first flow-guiding component having at least one first gas inlet and at least one first gas outlet in communication with each other, the at least one first gas inlet being configured to be in communication with a clean gas source, the second flow-guiding component having at least one second gas inlet and at least one second gas outlet in communication with each other, the at least one second gas inlet being arranged facing the first gas outlet, and the at least one second gas outlet being configured to be in communication with a gas discharge motive power apparatus, so that clean gas can flow toward the at least one second gas inlet from the at least one first gas outlet, thereby forming a clean gas region above the electronic component to be processed, to avoid contamination with impurities during processing.

The present disclosure relates to an apparatus and method for cleaning a chamber, and more particularly, to an apparatus and method for cleaning a chamber, which are capable of cleaning the chamber which is contaminated while depositing a thin film on a substrate. The chamber cleaning method in accordance with an exemplary embodiment is a method for cleaning a chamber configured to deposit a zinc oxide, the method comprising: supplying a chlorine (Cl)-containing gas and a hydrogen (H)-containing gas into a chamber; activating and reacting the separately supplied gases with each other inside the chamber to generate a reaction gas; and firstly cleaning the chamber with the reaction gas.

A system and method for cleaning, protecting and lubricating hyperbolic rollers and bearings for bending, using air and oil, placed in a rotating rotor (1) that contains rollers (32) placed on bearings (34) and shafts (33) inside roller housings (30), where rollers (32) are positioned at an angle with respect to the bending axis and, as bending occurs they cause bending and also as rotor (1) rotates around the item being bent it straightens and feeds the item. Rollers (32) are placed on bearings (34) and are protected through rotational seals (35). The bearings' (34) area of rollers (32) inside the rotational seal (35) is supplied with air at pressure higher than the atmospheric, so that inflow of contaminants are inhibited, or is supplied with air enriched with oil so that bearings (34) are lubricated, and rotational seals (35) located next to bearings (34) of the rollers (32) allow the air flow from the area between the bearings towards the surrounding area.

The present disclosure relates to an apparatus and method for cleaning a chamber, and more particularly, to an apparatus and method for cleaning a chamber, which are capable of cleaning the chamber which is contaminated while depositing a thin film on a substrate. The chamber cleaning method in accordance with an exemplary embodiment is a method for cleaning a chamber configured to deposit a zinc oxide, the method comprising: supplying a chlorine (Cl)-containing gas and a hydrogen (H)-containing gas into a chamber; activating and reacting the separately supplied gases with each other inside the chamber to generate a reaction gas; and firstly cleaning the chamber with the reaction gas.

The present disclosure provides embodiments of a system and method for detecting processing chamber condition. The embodiments include performing a wafer-less processing step in a processing chamber to determine the condition of the chamber walls. Based on an analysis of the residual gas resulting from the wafer-less processing step, an operator or a processing controller can determine whether the chamber walls have deteriorated to such an extent as to be cleaned.

A cleaning device for selectively bombarding a surface with a media sequence, the sequence including at least a first gaseous medium and a second liquid medium, includes a nozzle configured to bombard the surface with the second medium; a cleaning valve with a holding port, a pressure port, a plunger, and a pressure outlet; and a high-pressure accumulator configured to store the first medium. The first medium is loaded with an accumulator pressure. The cleaning device further includes a changeover valve configured to selectively create a connection between a first medium supply line and a holding line connected to the holding port. The pressure outlet is configured to bombard the surface with the first medium in pulse-like fashion

A device is described for protecting a sensor window. The device includes a two-piece nozzle system and is configured for generating a first and a second fluid flow, a first piece of the two-piece nozzle system being fixedly situated with respect to the sensor window, and a second piece of the two-piece nozzle system being configured for assuming different positions with respect to the first piece of the two-piece nozzle system, and the two-piece nozzle system being aligned with respect to the sensor window to direct a predominant portion of the first fluid flow in parallel to the sensor window and to direct a predominant portion of the second fluid flow in the direction onto the sensor window.