An automatic soldering processing system is disclosed and includes a soldering-point information obtaining unit, a soldering-parameter generating unit, a solder feeding unit, an iron tip, a motion control unit, and a temperature control unit. The soldering-point information obtaining unit obtains an image of at least one soldering-point of an electronic product, the soldering-parameter generating unit generates soldering parameters such as solder feeding speed, solder feeding amount, moving speed, moving path, heating temperature and heating time for the at least one soldering-point correspondingly according to the image. The solder feeding unit feeds solder based on the solder feeding speed and the solder feeding amount, the iron tip performs a soldering action by using the solder, and the motion control unit and the temperature control unit control the iron tip according to the moving speed, the moving path, the heating temperature, and the heating time.

Described herein is an aluminium alloy multi-layered brazing sheet product for brazing in an inert-gas atmosphere without a flux, comprising a core layer made of a 3xxx alloy comprising 0.20-0.75 wt. % Mg, and provided with a covering clad layer comprising 2-5 wt. % Si on one or both sides of said 3xxx alloy core layer and a Al—Si brazing clad layer comprising 7-13 wt. % Si positioned between the 3xxx alloy core layer and the covering clad layer, wherein the covering clad layer has a thickness X.sub.1 and the Al—Si brazing clad layer has a thickness X.sub.2 and wherein X.sub.2≥2X.sub.1. The invention further relates to the use of an aluminium alloy multi-layered brazing sheet product in a fluxfree controlled atmosphere brazing (CAB) operation to produce a heat exchanger apparatus.

Disclosed herein are unitary printed circuit boards (PCBs) and methods of using them for testing an integrated circuit (IC). In some embodiments, a unitary PCB comprises a main board portion and a flexible PCB portion, which are configured to be detached from each other at a separation location on the unitary PCB. The main board portion comprises a plurality of pads, and the flexible PCB portion comprises a plurality of through-holes, where a layout of the through-holes corresponds to a layout of the plurality of pads. In some embodiments, a method of testing an IC of a device comprises separating the unitary PBC into a main board portion and a flexible PCB portion, attaching the IC to the main board portion, soldering the main board portion to a platform PCB of the device, and attaching the flexible PCB portion to the main board portion.

A semiconductor device includes: a package including: a lower surface, at least one first metal surface at an outer periphery of the lower surface, and at least one second metal surface at the lower surface at a location different from the at least one first metal surface; a mounting substrate disposed below the package and including: an upper surface, at least one first metal pattern disposed at the upper surface below the at least one first metal surface, and at least one second metal pattern disposed at the upper surface below the at least one second metal surface; a first bonding member containing a metal material and bonding the at least one first metal surface and the at least one first metal pattern; and a second bonding member containing a metal material and bonding the at least one second metal surface and the at least one second metal pattern.

A method of connecting two CMC substrates that includes providing two substrates; placing one substrate approximate to the other substrate, such that at least a portion of the two substrates overlap and define a brazing area; placing a brazing material approximate the brazing area; defining a primary raster pattern that encompasses the brazing area and a portion of the two substrates outside the brazing area; defining a secondary raster pattern that encompasses the brazing area; allowing a laser to scan the primary raster pattern to preheat the brazing area to a temperature below the brazing material's melting point; allowing the laser to scan the secondary raster pattern to heat the brazing area to a temperature that is above the brazing material's melting point; melting and allowing the brazing material to flow within the brazing area; and cooling the brazing area to form a brazed joint connecting the two substrates.

A solder bump forming member including: a base substrate having a plurality of recesses; and solder particles in the recesses, in which the solder particle has an average particle diameter of 1 to 35 μm and a C.V. value of 20% or less, and a part of the solder particle projects from the recess, or in cross-sectional view, when a depth of the recess is designated as H.sub.1, and a height of the solder particle is designated as H.sub.2, H.sub.1<H.sub.2 is established.

A nickel-based brazing foil with a composition consisting essentially of 11 atom %<Cr≤16 atom %, 0 atom %≤Mo≤3.5 atom %, 4 atom %≤B≤5.5 atom %, 11 atom %≤Si≤16 atom %, 0 atom %≤P≤0.5 atom %, 0 atom %≤C≤0.85 atom %, 0 atom %≤Fe≤5 atom %, 0 atom %≤Co≤5 atom %, 0 atom %≤Cu≤2 atom %, 0 atom %≤V≤2 atom %, 0 atom %≤Nb≤2 atom %, incidental impurities of ≤1.0 wt. % and the rest Ni, is provided.

The invention relates to a method for fusing a solder material deposit by means of laser energy, in which laser radiation emitted from a first laser source is applied to the solder material deposit in a first application phase by means of a first laser device (11) and laser radiation emitted from a second laser source is applied to the solder material deposit in a second application phase by means of a second laser device (12), said first laser source having a lower laser power than the second laser source, a switch being made from the first application phase to the second application phase by means of a switching device (30) and said switch being triggered by a temperature sensor, by means of which the temperature of the solder material deposit is measured at least during the first application phase.

A printing method for selectively depositing braze powders on a surface comprises extruding a filament from a nozzle moving relative to a surface, where the filament comprises a flowable carrier mixed with a braze powder. As the nozzle moves, the filament is deposited on the surface in a predetermined pattern defined by the motion of the nozzle relative to the surface; thus, the braze powders are deposited at one or more predetermined locations on the surface.

A bonding device for bonding an electronic element includes an engaging component. The engaging component has a first surface and a second surface opposite to the first surface. The engaging component includes a plurality of recesses at the second surface. The plurality of recesses are configured to cover a plurality of projections of an electronic element. The engaging component is coupled to a heating component.