Substrates that are bonding targets are bonded in ambient atmosphere via bonding films, including oxides, formed on bonding faces of the substrates. The bonding films, which are metal or semiconductor thin films formed by vacuum film deposition and at least the surfaces of which are oxidized, are formed into the respective smooth faces of two substrates having the smooth faces that serve as the bonding faces. The bonding films are exposed to a space that contains moisture, and the two substrates are overlapped in the ambient atmosphere such that the surfaces of the bonding films are made to be hydrophilic and the surfaces of the bonding films contact one another. Through this, a chemical bond is generated at the bonded interface, and thereby the two substrates are bonded together in the ambient atmosphere. The bonding strength γ can be improved by heating the bonded substrates at a temperature.

A method utilizing cold welding to prepare grain boundaries having different included angles includes using a device including a support member. Two bent members are arranged opposite to each other in the support member. One ends of the two bent members are both fixedly connected to the support member, one end, away from the support member, of any bent member is fixedly connected to a first sample, one end, away from the support member, of the other bent member is fixedly connected to a second sample, and the first sample and the second sample are arranged corresponding to each other. The bent member includes a first metal sheet and a second metal sheet having different thermal expansion coefficients. An angle between the first sample and the second sample during butt welding can be controlled by changing an included angle of a bimetallic sheet.

A method utilizing cold welding to prepare grain boundaries having different included angles includes using a device including a support member. Two bent members are arranged opposite to each other in the support member. One ends of the two bent members are both fixedly connected to the support member, one end, away from the support member, of any bent member is fixedly connected to a first sample, one end, away from the support member, of the other bent member is fixedly connected to a second sample, and the first sample and the second sample are arranged corresponding to each other. The bent member includes a first metal sheet and a second metal sheet having different thermal expansion coefficients. An angle between the first sample and the second sample during butt welding can be controlled by changing an included angle of a bimetallic sheet.

A bonding device for bonding an electronic element includes an engaging component. The engaging component has a first surface and a second surface opposite to the first surface. The engaging component includes a plurality of recesses at the second surface. The plurality of recesses are configured to cover a plurality of projections of an electronic element. The engaging component is coupled to a heating component.

A bonding device for bonding an electronic element includes an engaging component. The engaging component has a first surface and a second surface opposite to the first surface. The engaging component includes a plurality of recesses at the second surface. The plurality of recesses are configured to cover a plurality of projections of an electronic element. The engaging component is coupled to a heating component.

A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film.

A liquid cooling jacket is produced by forming a first butted portion where a step side face of a peripheral wall portion and an outer peripheral side face of a sealing body butt each other and a third butted portion where a step side face of a support pillar portion and a hole wall of the hole portion of the sealing body portion butt each other with a gap, and friction-stirring by inserting a tip side pin and a base side pin of a primary joining rotary tool that is rotating into the sealing body and moving the primary joining rotary tool along the third butted portion with an outer circumferential face of the tip side pin being kept off the step side face while having a second aluminum alloy of the sealing body flow into the gap.

A machine tool includes a first spindle, a second spindle, and a joining means for joining the axial ends of workpieces gripped by the spindles to form a joined workpiece. The machine tool further includes an electric servomotor for moving the first spindle in the direction intersecting the axis of the first spindle, a current value detection means for detecting the current value of the electric servomotor, and a misalignment detecting means for detecting misalignment of a first workpiece and a second workpiece in the joined workpiece, based on the current value detected by the current value detection means when the joined workpiece gripped by the two spindles is rotated.

The invention has a feature of comprising a butting process of forming a stepped butted portion and a joining process of performing friction-stir-welding on the stepped butted portion, wherein the rotary tool includes a base side pin having a taper angle larger than a taper angle of a tip side pin, and a pin step portion in a staircase shape is formed on an outer circumferential face of the base side pin, and wherein in the joining process, a rotation direction and a translation method of the rotary tool are set such that the second metal member is on an advancing side, a target angle by which a rotation axis of the rotary tool is inclined toward the second metal member is set such that a burr formed on a front face of the second metal member after the joining process has a thickness between 0 and 130 μm.

A method and associated device for joining a battery cell tab to a plurality of foils associated with a plurality of electrodes of a battery cell are described. This includes arranging the plurality of foils in a stack, and joining, via a first joining device, the plurality of foils, wherein the first joining device defines a joining region. A portion of the battery cell tab is arranged on the plurality of foils, and joined, via a second joining device, to the plurality of foils. The second joining device generates a weld joint that is encompassed within the joining region defined by the first joining device. In doing so, weld quality and strength of internal welds in a battery cell may be improved by reducing the occurrence of porosities and cracks in the foil/tab weld joints.