B23K33/00

METHOD AND DEVICE FOR MANUFACTURING JOINING APPARATUS
20230009387 · 2023-01-12 ·

A method of manufacturing a joining apparatus includes: providing a first metal member including an opening and a joint structure; providing a second metal member including an outer circumferential wall capable of contacting an inner circumferential wall that surrounds the opening and a joined structure, to which the joint structure is joined; causing the first metal member and the second metal member to move relative to each other, bringing one of a first joining section, which is configured by the inner circumferential wall and the outer circumferential wall, and a second joining section, which is configured by the joint structure and the joined structure, into contact, and separating the other joining section; starting energization between the first and the second metal members; bringing components of the other joining section into contact with each other; and joining the first and second joining sections by the relative movement and the energization.

PRE-STRESSED STEEL SHEET AND METHOD OF MANUFACTURING SAME
20230008459 · 2023-01-12 · ·

The present invention relates to a pre-stressed steel sheet and a method a method of manufacturing the same.

An embodiment of the present invention provides a pre-stressed steel sheet comprising: a base material; and a plurality of weld lines formed on the base materials, wherein the average spacing between each pair of the weld lines is equal to or greater than five times the width of the weld lines and equal to or less than half the width of the steel sheet.

According to an aspect of the present invention, a pre-stressed steel sheet having improved bendability can be provided, and accordingly when the pre-stressed steel sheet is applied to a structural member such as a girder or beam, the bendability of a structure can be improved.

WELDING STRUCTURE OF PRESS FORMED PART, STRUCTURAL PART FOR AUTOMOTIVE BODY INCLUDING THE WELDING STRUCTURE, AND METHOD FOR MANUFACTURING WELDING PART (AS AMENDED)

A welding structure of a press-formed part made by combining and joining two parts formed by press-forming and each having an opening portion on at least one side of a cross-section, while the opening portions face each other, and includes a step portion that is provided by forming a bent projection projecting outwardly on a tip end portion of a side wall portion of a lower side part, partially or entirely on a joining surface. A tip end side of the step portion is fitted into the opening portion of an upper side part, and the step portion of the lower side part and the tip end of a side wall portion of the upper side part are linearly joined by arc welding.

WELDING STRUCTURE OF PRESS FORMED PART, STRUCTURAL PART FOR AUTOMOTIVE BODY INCLUDING THE WELDING STRUCTURE, AND METHOD FOR MANUFACTURING WELDING PART (AS AMENDED)

A welding structure of a press-formed part made by combining and joining two parts formed by press-forming and each having an opening portion on at least one side of a cross-section, while the opening portions face each other, and includes a step portion that is provided by forming a bent projection projecting outwardly on a tip end portion of a side wall portion of a lower side part, partially or entirely on a joining surface. A tip end side of the step portion is fitted into the opening portion of an upper side part, and the step portion of the lower side part and the tip end of a side wall portion of the upper side part are linearly joined by arc welding.

Semiconductor device with stacked terminals
11570921 · 2023-01-31 · ·

A semiconductor device includes: a housing; a substrate inside the housing; first and second semiconductor circuits on the substrate; and first and second planar terminals electrically connected to the first and second semiconductor circuits, respectively, the first and second planar terminals stacked on top of each other, wherein each of the first and second planar terminals extends away from the housing.

Semiconductor device with stacked terminals
11570921 · 2023-01-31 · ·

A semiconductor device includes: a housing; a substrate inside the housing; first and second semiconductor circuits on the substrate; and first and second planar terminals electrically connected to the first and second semiconductor circuits, respectively, the first and second planar terminals stacked on top of each other, wherein each of the first and second planar terminals extends away from the housing.

CONNECTOR DEVICE

A connector device includes a connector housing including a plurality of terminal accommodating chambers, a plurality of terminals accommodated in the plurality of terminal accommodating chambers, and a plurality of electric wires configured to be welded to the respective one of the plurality of terminals. A laser radiation through hole is formed in side walls, each forming the terminal accommodating chambers, the laser radiation through hole being configured to allow the plurality of terminals and the plurality of electric wires to be welded with each other inside the terminal accommodating chambers, and the laser radiation through hole is configured to allow laser light emitted from a laser welding machine disposed outside the connector housing to enter one of the plurality of terminal accommodating chambers.

METHOD FOR PRODUCING A SOLDER DEPOSIT, AND SOLDER DEPOSIT
20220402059 · 2022-12-22 · ·

in a method for producing a solder deposit in a metal sheet, a depression is made in a topside of the metal sheet through deep drawing, thereby causing material to protrude on a bottom side of the metal sheet. The metal sheet is then subjected to a material forming process to produce a collar such that the collar projects in relation to the topside. The collar is then at least partially pressed in a direction of the depression to reduce a cross-sectional area of a mouth of the depression, and the protruding material on the bottom side is completely pushed back so that the bottom side in a region of the depression is in one plane with neighboring regions of the bottom side.

METHOD FOR PRODUCING A SOLDER DEPOSIT, AND SOLDER DEPOSIT
20220402059 · 2022-12-22 · ·

in a method for producing a solder deposit in a metal sheet, a depression is made in a topside of the metal sheet through deep drawing, thereby causing material to protrude on a bottom side of the metal sheet. The metal sheet is then subjected to a material forming process to produce a collar such that the collar projects in relation to the topside. The collar is then at least partially pressed in a direction of the depression to reduce a cross-sectional area of a mouth of the depression, and the protruding material on the bottom side is completely pushed back so that the bottom side in a region of the depression is in one plane with neighboring regions of the bottom side.

Junction structure

A junction structure includes a first metallic material, a second material different in type from the first metallic material, and a welding wire as a third material similar to the first metallic material. The second material is stacked on the first material. The molten metal of the third metallic material is deposited by arc welding into the through part of the second material so as to form a flanged or tapered bead, so that the first and third metallic materials and the second material are fixed together.