Patent classifications
B23Q2716/00
Contact monitoring on a spindle of a machine tool
The invention relates to a device for monitoring the contact of a workpiece (1) or tool on a spindle (2) of a machine tool, which device has a contact surface (3) for the workpiece (1) or tool. At least one measurement nozzle (4) is arranged in the region of the contact surface in order to produce a fluid flow directed away from the contact surface (3). Upstream of the measurement nozzle, the fluid flow is conducted through a vacuum nozzle, which can comprise a jet nozzle (7c) and a collector nozzle (7b). When the fluid medium flows through the vacuum nozzle, the vacuum nozzle produces a negative pressure in a negative pressure chamber (9c). A pressure sensor (6) or pressure switch senses a measurement pressure (p3) in the negative pressure chamber.
Machine control device
A machine control device includes: an imaging control unit that controls the imaging device to capture two images at two different imaging positions; an imaging position information acquiring unit that acquires positional information of the two imaging positions; a measurement distance restoring unit that restores a measurement distance of the object based on two images, distance information between two imaging positions, and a parameter of the imaging device by using a stereo camera method; and a predetermined precision position calculating unit that calculates distance information between the two imaging positions at which the measurement precision of the object satisfies a predetermined precision based on the two images, the measurement distance of the object, and the parameter of the imaging device, in which the machine control device controls the position and orientation of the imaging device based on the distance information between the two imaging positions, and changes two imaging positions.
Machining Fixture Positioning Switch
A switch housing body has a base and a sidewall having an axis and extending from the base to a rim and having a pair of axial slots. A switch cap has: a cap body having a top web; and a sidewall extending from the top web to a rim and having a pair of holes. A shaft passes through the pair of axial slots and pair of holes. A spring biases the cap axially away from the housing from a compressed condition to an extended condition. A cap electrical contact and a housing electrical contact have an electrically closed condition at the compressed condition.
PROCESSING APPARATUS
There is provided a processing apparatus including a holding table having a holding surface for holding thereon a workpiece with a plurality of devices formed in respective areas demarcated on a face side of the workpiece by a plurality of projected dicing lines, a processing unit that processes the workpiece held on the holding table, an image capturing unit that captures an image of the workpiece held on the holding table, a moving unit that moves the holding table relatively to the processing unit and the image capturing unit in horizontal directions along the holding surface, a touch panel that displays thereon the image captured by the image capturing unit, and a control unit. The control unit detects a line in an image positioned within an allowable region based on a contact line traced on the image displayed on the touch panel and registers the detected line.
METHOD AND APPARATUS FOR PROCESSING SUBSTRATE
A method of cooling a substrate by bringing a cooler into direct contact with a stage on which the substrate is placed, and processing the substrate while rotating the stage in a state in which the cooler is moved away from the stage, includes: cooling the cooler to a target temperature in a state in which the stage is brought into direct contact with the cooler, and cooling the stage to an initial cooling temperature; raising a temperature of the stage; controlling the temperature of the stage to a steady cooling temperature when the temperature of the stage reaches the steady cooling temperature; and placing the substrate on the stage kept at the steady cooling temperature, and continuously performing a substrate processing on a plurality of substrates while rotating the stage in a state in which the stage is moved away from the cooler.
Locationing device for a machining point on a workpiece
A device for determining a location on an elongated workpiece, characterized in that the device comprises: a frame movable in a first direction, preferably in a longitudinal direction of the workpiece, positioning means to position the frame in relation to the sides of the workpiece, movable means movable in a second direction, preferably in a transverse direction with respect to the frame, a measuring point, the movement in first direction and second direction used to move measuring point in said directions, measuring equipment for determining the location of the measuring point in transverse and longitudinal respect to the workpiece.
Hand-held tool system
A hand-held tool system comprises a hand-held tool and a positioning device matching the hand-held tool. The hand-held tool comprises an output shaft and a working head coupled to the output shaft. The positioning device comprises a detecting module configured to detect a positional feature and/or a movement feature of the positioning device and output a parameter indicative of the positional feature and/or the movement feature, the detecting module and the working head having a preset distance therebetween; a storage module configured at least to record reference position information about the working head; a control module configured to acquire real-time position information about the working head based on the parameter, the preset distance and the reference position information; and an output module configured to output the real-time position information in a way that can be perceived.
CONTACT MONITORING ON A SPINDLE OF A MACHINE TOOL
The invention relates to a device for monitoring the contact of a workpiece (1) or tool on a spindle (2) of a machine tool, which device has a contact surface (3) for the workpiece (1) or tool. At least one measurement nozzle (4) is arranged in the region of the contact surface in order to produce a fluid flow directed away from the contact surface (3). Upstream of the measurement nozzle, the fluid flow is conducted through a vacuum nozzle, which can comprise a jet nozzle (7c) and a collector nozzle (7b). When the fluid medium flows through the vacuum nozzle, the vacuum nozzle produces a negative pressure in a negative pressure chamber (9c). A pressure sensor (6) or pressure switch senses a measurement pressure (p3) in the negative pressure chamber.
X-Y STAGE YAW CORRECTION METHOD AND X-Y STAGE
The technology disclosed in the present disclosure is a method for correcting a yaw of an X-Y stage, including: moving an XY moving body in an X-axis or Y-axis direction using an actuator; measuring a yaw, which is a rotational displacement of the moved XY moving body, using a sensor; calculating, by a controller, a rotational stiffness value to be corrected, using the measured yaw data; and adding yaw correction flexures having a stiffness corresponding to the rotational stiffness value to be corrected to the X-Y stage.
MACHINE CONTROL DEVICE
A machine control device includes: an imaging control unit that controls the imaging device to capture two images at two different imaging positions; an imaging position information acquiring unit that acquires positional information of the two imaging positions; a measurement distance restoring unit that restores a measurement distance of the object based on two images, distance information between two imaging positions, and a parameter of the imaging device by using a stereo camera method; and a predetermined precision position calculating unit that calculates distance information between the two imaging positions at which the measurement precision of the object satisfies a predetermined precision based on the two images, the measurement distance of the object, and the parameter of the imaging device, in which the machine control device controls the position and orientation of the imaging device based on the distance information between the two imaging positions, and changes two imaging positions.