The wafer trimming device includes a chuck table configured to hold a target wafer via suction, thereby fixing the target wafer, a notch trimmer configured to trim a notch of the target wafer, and an edge trimmer configured to trim an edge of the target wafer. The notch trimmer includes a notch trimming blade configured to rotate about a rotation axis perpendicular to a circumferential surface of the target wafer. The edge trimmer includes an edge trimming blade configured to rotate about a rotation axis parallel to the circumferential surface of the target wafer.

Examples are disclosed that relate to planarizing substrates without use of an abrasive. One example provides a method of chemically planarizing a substrate, the method comprising introducing an abrasive-free planarization solution onto a porous pad, contacting the substrate with the porous pad while moving the porous pad and substrate relative to one another such that higher portions of the substrate contact the porous pad and lower portions of the substrate do not contact the porous pad, and removing material from the higher portions of the substrate via contact with the porous pad to reduce a height of the higher portions of the substrate relative to the lower portions of the substrate.

An endless abrasive belt for a sanding machine includes a flexible support structure, on an upper side of the support structure, an active layer with a binder and abrasive grains held in the binder. A transponder device is affixed to an underside of the endless abrasive belt, the transponder device including an attachment region and a flag, the attachment region being glued onto the underside by an adhesive layer, the flag being held by the attachment region and projecting laterally away from the endless abrasive belt, and a transponder including a transponder chip and an aerial for a wireless data connection with the sanding machine is arranged in the flag.

A polishing apparatus capable of forming a step-shaped recess having a right-angled cross section in an edge portion of a substrate, such as a wafer, is disclosed. The polishing apparatus includes: a substrate rotating device configured to rotate the substrate about a rotation axis; a first roller having a first circumferential surface configured to press a polishing tape against the edge portion of the substrate; and a second roller having a second circumferential surface in contact with the first circumferential surface. The second roller has a tape stopper surface that restricts movement of the polishing tape in a direction away from the rotation axis. The tape stopper surface is located radially outward of the first circumferential surface.

A tool sharpener has first and second guide surfaces to respectively support a cutting tool adjacent first and second abrasive surfaces. A drive assembly moves the first and second abrasive surfaces with respect to the first and second guide surfaces. A control circuit directs a user to place the cutting tool against the first abrasive surface using the first guide surface to sharpen a cutting edge of the tool during a first sharpening operation. The control circuit activates an indicator mechanism at a conclusion of the first sharpening operation to direct the user to perform a second sharpening operation in which the user presents the cutting tool against the second abrasive surface using the second guide surface to sharpen the cutting edge.

A workpiece fixing device for fixing a workpiece by vacuum for machining thereof includes a support device on which the workpiece can be laid for fixing, and at least one vacuum chamber which is formed starting from the support device. The workpiece fixing device has a first fixing region and a second fixing region different from the first fixing region. The support device has a first support channel profile in the first fixing region and a second support channel profile different from the first support channel profile in the second fixing region.

A pipe coating removal apparatus (1) for removing all or some of the coating on a pipe, the pipe coating removal apparatus (1) having a pipe support means (2) for supporting a length of pipe. and further having a tool carriage (3). The tool carriage (3) being capable of supporting two or more different types of pipe coating removal tools (4), (5), (6), (7), (8), (80), (81), (82) and/or (70). The pipe coating removal apparatus (1) being capable of causing relative movement between the tool carriage (3) and the pipe support means (2) to remove all or some of the coating on the pipe that is supportable by the pipe support means (2).

A grinding device is operated by grinding of a surface of the workpiece with at least one grinding medium while recording actual data of the surface after grinding with at least one data collection device. Actual data recorded during grinding is then compared with target data stored in an electronic memory in an electronic data processing device. Based on the comparison, adjustments are made to at least one grinding parameter if a deviation of the actual data from the target data exceeds a predetermined limit.

An apparatus (10) for machining a workpiece (12) comprises at least two machining elements (14a, 14b) and a rotating belt (16) for moving the machining elements (14a, 14b) relative to a workpiece (12) to be machined. The machining elements (14a, 14b) each comprise a main body (20a, 20b) and a first connecting element (22a, 22b) connected to the main body (20a, 20b), which first connecting element is connectable to a second connecting element (24a, 24b) complementary to the first connecting element (22a, 22b) and connected to the belt (16). The first connecting element (22a, 22b) comprises a rotary body (26a, 26b). The second connecting element (24a, 24b) has a connection area (28a, 28b) for connection with the rotary body (26a, 26b). When the rotary body (26a, 26b) is rotated in a first rotary direction (R1) the rotary body (26a, 26b) is connected to the connection area (28a, 28b). When the rotary body (26a, 26b) is rotated in a second rotary direction (R2) opposed to the first rotary direction (R1) the rotary body (26a, 26b) is separated from the connection area (28a, 28b). The rotary body (26a, 26b) is arranged relative to the main body (20a, 20b) and connected to the latter in such a manner that during machining of the workpiece (12) a resulting force is exerted on the rotary body (26a, 26b) via the main body (20a, 20b), which force provides a torque for a rotation of the rotary body (26a, 26b) in the first rotary direction (R1).

An apparatus (10) for machining a workpiece (12) comprises at least two machining elements (14a, 14b) and a rotating belt (16) for moving the machining elements (14a, 14b) relative to a workpiece (12) to be machined. The machining elements (14a, 14b) each comprise a main body (20a, 20b) and a first connecting element (22a, 22b) connected to the main body (20a, 20b), which first connecting element is connectable to a second connecting element (24a, 24b) complementary to the first connecting element (22a, 22b) and connected to the belt (16). The first connecting element (22a, 22b) comprises a rotary body (26a, 26b). The second connecting element (24a, 24b) has a connection area (28a, 28b) for connection with the rotary body (26a, 26b). When the rotary body (26a, 26b) is rotated in a first rotary direction (R1) the rotary body (26a, 26b) is connected to the connection area (28a, 28b). When the rotary body (26a, 26b) is rotated in a second rotary direction (R2) opposed to the first rotary direction (R1) the rotary body (26a, 26b) is separated from the connection area (28a, 28b). The rotary body (26a, 26b) is arranged relative to the main body (20a, 20b) and connected to the latter in such a manner that during machining of the workpiece (12) a resulting force is exerted on the rotary body (26a, 26b) via the main body (20a, 20b), which force provides a torque for a rotation of the rotary body (26a, 26b) in the first rotary direction (R1).