An automatic machine and an automatic method for grinding the edges of glass sheets are disclosed. The machine is provided with a machine body with motorized support and conveyance rollers or belts, an input conveyor with motorized support and conveyance rollers or belts, an output conveyor with motorized support and conveyance rollers and belts. There are at least two elements for conveying the glass sheets, a lower one and an upper one, which actuate respectively the synchronous motions about a lower axis and an upper axis, which engage and convey the glass sheets, which are interfaced alternately, for example the odd sheets with the lower conveyance elements and the even sheets with the upper conveyance.

A modular apparatus (10) for machining flat sheets, in particular glass, plate glass, or mirror sheets or sheets made from stone materials or the like, comprising machining moduli consisting of a first store (16) suitable for receiving sheets to be machined (25) and a second store (18) suitable for receiving machined sheets (27), a first grinding machine (12), and a second grinding machine (14) suitable for performing grinding machinings along the peripheral edges of said sheets (25), one or more further moduli for machining said flat sheets, if any, of the corner cutting, drill, or washing machine types, possibly associated with said first and second grinding machines (12, 14), and interface means for transferring said flat sheets between said machining moduli.

A method of removing material from a surface of an ultrasound directing element comprising a plastic material is provided. The method includes mounting the ultrasound directing element to a mounting block of a sanding apparatus. The mounting block includes an engagement member that moves from a release position to an engagement position thereby engaging the ultrasound directing element. The mounting block is moved along a base of the sanding apparatus bringing a surface of the ultrasound directing element into contact with a sanding surface. Material is removed from the surface of the ultrasound directing element using the sanding surface.

A machine tool comprises first and second support arms, and a rigid structure which couples the first support arm to the second support arm. A first rotary drive is operable to rotate the first support arm and the rigid structure relative to each other about a first rotational reference axis, and a second rotary drive is operable to rotate the second support arm and the rigid structure relative to each other about a second rotational reference axis, wherein the first and second rotational reference axes are parallel and spaced apart by a fixed distance. A control arrangement is configured to control the first and second rotary drives such that a workpiece mount carried by the second support arm follows a predetermined path relative to a tool mount carried by the first support arm in a plane perpendicular to the rotational reference axes.

The invention relates to a grinding machine, which is suitable for a robot-supported grinding process. According to one embodiment, the grinding machine has a housing, a motor arranged in the interior of the housing, a fan wheel arranged on a motor shaft of the motor in the interior of the housing, and a support plate coupled to the motor shaft for receiving a grinding disc. The support plate has openings for intake of grinding dust into the interior of the housing. The grinding machine furthermore has an outlet arranged in a wall of the housing for exhausting the grinding dust out of the interior of the housing and a non-rerun valve arranged in the wall of the housing. The non-return valve enables an to escape from the interior of the housing, but prevents intake of air into the interior of the housing.

A hard wafer grinding method includes a rough grinding step of forming a section along the diameter of a hard wafer into a centrally recessed shape by roughly grinding the hard wafer such that a central part of the hard wafer is thinner than a peripheral part of the hard wafer, a finish grinding step of expanding a ground area of the hard wafer from the peripheral part in an annular shape to the central part while dressing lower surfaces of finish grinding stones by the peripheral part of the hard wafer of the centrally recessed shape after the rough grinding, then setting the whole of a radius part of the hard wafer as the ground area, and further finish-grinding the hard wafer so as to obtain a predetermined thickness.

The invention relates to a device for integrally processing a housing of a Computing, Communication, and Consumer (3C) product. The device includes a loading frame and an upper frame, where a material receiving device is arranged in the loading frame, a width of the loading frame is greater than that of the housing, a grinding device is arranged below the upper frame, and the grinding device includes a grinding movement device; the grinding movement device is connected to a grinding installation block, an outer side of the grinding installation block is provided with grinding lifting balls, a grinding arc block is embedded in an inner side of an upper portion of the grinding installation block, and the upper frame is provided with a material pressing device. An outer side of the loading frame is provided with a feeding and discharging device.

A pusher that holds a substrate includes: a pusher body, and a plurality of seating members that is attached to the pusher body and on which a substrate is seated. Each of the plurality of seating members includes: a pedestal member including a seating portion on which the substrate is seated and a magnet disposed at a position different from the seating portion, and supported by the pusher body such that the position of the magnet is moved according to seating or leaving of the substrate; a seating sensor configured to detect movement of the magnet; and a magnetic member disposed to shield a portion between a movable region of the magnet and the seating sensor.

The present disclosure relates to a grinding head (1) for a floor grinding machine for grinding floor surfaces of stone or stone-like material. Such a grinding head (1) comprises a lower casing member (3), comprising a lower support (31) and an upwardly extending edge portion (32), and an upper casing number (2), comprising an upper cover (21) and a downwardly extending edge portion (22), wherein the upper casing member (2) is joinable to the lower casing member (3) by causing axially distal portions of the edge portions to bear on each other.

There is disclosed a substrate processing apparatus which can align a center of a substrate with a central axis of a process stage with high accuracy to prevent a defective substrate from being produced. The substrate processing apparatus includes: an eccentricity detecting mechanism configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, held on the centering stage, from a central axis of the centering stage; and an aligner configured to align the center of the substrate with a central axis of a process stage. The aligner obtains, after the substrate is transferred from the centering stage to the process stage, an amount of eccentricity and an eccentricity direction of the center of the substrate from the central axis of the process stage by use of the eccentricity detecting mechanism; and confirms that the obtained amount of eccentricity of the center of the substrate from the central axis of the process stage is within a predetermined allowable range.