A polishing apparatus according to an embodiment includes a polishing pad including a polishing surface for polishing a polishing target object and a membrane including a contact surface that is in contact with the polishing target object on the opposite side of the polishing surface. The contact surface is deformed from a flat surface into an uneven surface in response to pressure applied to the membrane.

A system and method for a grinding disc, the grinding disc made out of three discs, capable of grinding in three positions such as the bottom, side, and top instead of only one position, the top disc and middle disc having an aperture such that a shaft having a washer and bar is connected to the discs by sliding the through the top disc whereby the washer is then received by the middle disc, the discs are then fastened together with the bar protruding from the discs whereby the bar may be connected to a tool such as drill, the grinding disc may then be used at multiple angles when connected to the tool

A system and method for a grinding disc, the grinding disc made out of three discs, capable of grinding in three positions such as the bottom, side, and top instead of only one position, the top disc and middle disc having an aperture such that a shaft having a washer and bar is connected to the discs by sliding the through the top disc whereby the washer is then received by the middle disc, the discs are then fastened together with the bar protruding from the discs whereby the bar may be connected to a tool such as drill, the grinding disc may then be used at multiple angles when connected to the tool

A grinding method for grinding a plurality of platelike workpieces at a time is provided. The workpieces are attached to a support member and held on a chuck table. A grinding wheel is brought into contact with the workpieces to grind the workpieces at a time. The grinding wheel includes a disk-shaped wheel base having a first surface, a plurality of first abrasive members arranged annularly on the first surface of the wheel base, and a plurality of second abrasive members arranged annularly on the first surface of the wheel base radially inside the first abrasive members in a concentric relationship with the first abrasive members. The radial spacing between the first abrasive members and the second abrasive members is set larger than the minimum spacing between any adjacent ones of the workpieces.

A grinding method for grinding a plurality of platelike workpieces at a time is provided. The workpieces are attached to a support member and held on a chuck table. A grinding wheel is brought into contact with the workpieces to grind the workpieces at a time. The grinding wheel includes a disk-shaped wheel base having a first surface, a plurality of first abrasive members arranged annularly on the first surface of the wheel base, and a plurality of second abrasive members arranged annularly on the first surface of the wheel base radially inside the first abrasive members in a concentric relationship with the first abrasive members. The radial spacing between the first abrasive members and the second abrasive members is set larger than the minimum spacing between any adjacent ones of the workpieces.

Provided is technical means capable of supplying a polishing liquid having a uniform slurry flow rate to a CMP polishing device. There is a blending flow channel 40 communicating with a flow channel in which a slurry, ultra-pure water, a chemical, and hydrogen peroxide water are transferred. In this blending flow channel 40, a plurality of types of liquids are blended, and the blended liquid is supplied to the CMP polishing device 8 as a plurality of polishing liquid. A blending tank 52A storing the polishing liquid obtained by blending the liquids is included. A flow channel reaching the CMP polishing device 8 is a circulation flow channel that returns to the blending tank 52A via a branching point 17A from the blending tank 52A toward the CMP polishing device 8.

A substrate processing apparatus which can remove foreign matters attached to the entire upper surface of a substrate such as a wafer is disclosed. The substrate processing apparatus includes: a substrate holding apparatus; and a processing head configured to scrub an upper surface of a substrate. The substrate holding apparatus includes: a substrate holder configured to hold the substrate; and a substrate rotating mechanism configured to rotate the substrate held by the substrate holder. The substrate holder is disposed below the upper surface of the substrate so as not to project above the upper surface of the substrate in a state where the substrate is held by the substrate holder.

A cleaning apparatus capable of effectively removing dirt attached to a bottom surface of a heat exchanger, is disclosed. The cleaning apparatus cleans the heat exchanger for regulating a surface temperature of a polishing pad. This cleaning apparatus includes: a moving mechanism configured to move the heat exchanger between a temperature-regulating position in which the heat exchanger can exchange heat with the polishing pad, and a retreat position in which the heat exchanger is separated from a surface of the polishing pad; and a cleaning mechanism configured to clean a bottom surface of the heat exchanger moved to the retreat position The retreat position is located on a side of the polishing pad. The cleaning mechanism includes at least one cleaning nozzle for ejecting a cleaning liquid to the bottom surface of the heat exchanger, or a cleaning tank in which the bottom surface of the heat exchanger can be immersed.

A method for correcting non-rigid thin-walled tubular elements having geometric deficiencies, wherein, following correction, the tubular elements may perform over a wide range of pressure and temperatures, for example as a rocket motor beaker, from about −70 C to about 1000 C. Correction is required to remove asperities, maximize cylindricity, squaring a forward end wall and a rearward end wall, so that the forward end wall of the tube product may be fitted, bonded and sealed to a circular planar element using a labyrinth-joint closure. The method provides uniformity so that both the tubular elements and the circular planar elements are interchangeably uniform in size, shape and performance, and may be readily assembled into non-rigid thin-walled tube products.

A method of machining a tip profile of a blade for a turbomachine includes coupling the blade to a component of the turbomachine; supporting the component on a machining apparatus, the machining apparatus being configured to remove material from the blade according to a cutting path defined within a coordinate system of the machining apparatus, wherein the component is supported such that a datum axial end face of the component is aligned with a datum of the coordinate system of the machining apparatus; and machining the blade according to the cutting path. A system for machining a tip profile of a blade for a turbomachine accomplishes the method.