A method measures an edge of a workpiece by scanning. The scanning is performed by a scanning tool mounted on a moving head of an edge-facing machine while that moving head is moved along the edge to be measured before, during or after an edge facing tool of the edge-facing machine that faces the edge. The method can be performed by an edge-facing machine that includes at least one edge facing tool and that further includes a scanning tool mounted on a movable head of the machine, which head is movable along an edge of a workpiece.

A wafer edge polishing apparatus includes a cleaning mechanism exhibiting a superb effect of cleaning slurry residue adhered on a chuck table. This edge polishing device is provided with: a chuck table which sucks/holds a wafer; a rotation drive mechanism which rotates the chuck table; an edge polishing unit which polishes an edge of the wafer while supplying slurry to the wafer, which is rotating while being sucked/held by the chuck table; and a cleaning unit which removes slurry residue on the chuck table. The cleaning unit includes a cleaning head, and cleans the chuck table through high-pressure cleaning and brush-cleaning by using the cleaning head, wherein the cleaning head is provided with a high-pressure jet nozzle and a brush surrounding the periphery of the high-pressure jet nozzle.

A wafer edge polishing apparatus includes a cleaning mechanism exhibiting a superb effect of cleaning slurry residue adhered on a chuck table. This edge polishing device is provided with: a chuck table which sucks/holds a wafer; a rotation drive mechanism which rotates the chuck table; an edge polishing unit which polishes an edge of the wafer while supplying slurry to the wafer, which is rotating while being sucked/held by the chuck table; and a cleaning unit which removes slurry residue on the chuck table. The cleaning unit includes a cleaning head, and cleans the chuck table through high-pressure cleaning and brush-cleaning by using the cleaning head, wherein the cleaning head is provided with a high-pressure jet nozzle and a brush surrounding the periphery of the high-pressure jet nozzle.

Provided are a method of polishing a silicon wafer and a method of producing a silicon wafer which can reduce the formation of step-forming microdefects on a silicon wafer. The method includes: a double-side polishing step of performing polishing on front and back surfaces of a silicon wafer; a notch portion polishing step of performing polishing on a beveled portion of a notch portion of the silicon wafer after the double-side polishing step; a peripheral beveled portion polishing step of performing polishing on the beveled portion on the periphery of the silicon wafer other than the beveled portion of the notch portion after the notch portion polishing step; and a finish polishing step of performing finish polishing on the front surface of the silicon wafer after the peripheral beveled portion polishing step. The notch portion polishing step is performed in a state where the front surface is wet with water.

A grinding machine includes a main part and an end case. A driving unit is connected to the end case and includes a first motor which has an output shaft with a groove. A grinding unit is connected to the end case, and cantilevered above the main part. The grinding unit includes a grinding wheel set which has a central axle with a slide. The slide is located in the groove of the output shaft of the first motor. A driving wheel is connected to the central axle. An adjustment device includes a second motor which drives an eccentric unit that has an eccentric axle, and the eccentric axle extends through a bearing which is located in a recess formed to the driving wheel. The driving wheel is driven by the eccentric unit to move the grinding wheel set of the grinding unit left and right.

A method for producing an intermediate glass plate includes a defect formation step, a separation step, and a polishing step. In the defect formation step, a defect is formed on main surfaces of glass blanks by irradiating a laminate of the glass blanks with a laser beam from one side in a lamination direction in which the glass blanks are laminated, along the lamination direction, and moving the laser beam relative to the laminate such that a circle is drawn in a view from the main surfaces of the glass blanks. In the separation step, a cylindrical laminate is formed by separating a removal target portion along the defect while maintaining the laminate. In the polishing step, a side wall surface of the laminate is polished while maintaining the cylindrical laminate so as to obtain a disk-shaped intermediate glass plate that has been subjected to edge surface polishing.

A cutting device includes: a cutting blade that advances toward and recedes from a continuous body of electrode plates or separators so as to cut the continuous body; and a cleaning member that advances and recedes together with the cutting blade and comes into contact with a cutting section of the continuous body and cleans the cutting section.

A sanding automation system for removing a surface defect of an exterior component includes a first robot for generating an inspection mark of a certain pattern on an exterior component with uniform pressure through an inspection mark tool to secure visibility of a surface defect, a vision system for analyzing an image of the exterior component photographed through at least one vision sensor and recognizing a surface defect marking position and a surface defect depth level displayed on the exterior component on which the inspection mark is generated, and a second robot for removing the surface defect by sequentially moving a sanding tool to at least one of the surface defect marking positions and performing a sanding operation with the set amount of sanding according to a corresponding surface defect depth level.

A sanding automation system for removing a surface defect of an exterior component includes a first robot for generating an inspection mark of a certain pattern on an exterior component with uniform pressure through an inspection mark tool to secure visibility of a surface defect, a vision system for analyzing an image of the exterior component photographed through at least one vision sensor and recognizing a surface defect marking position and a surface defect depth level displayed on the exterior component on which the inspection mark is generated, and a second robot for removing the surface defect by sequentially moving a sanding tool to at least one of the surface defect marking positions and performing a sanding operation with the set amount of sanding according to a corresponding surface defect depth level.

Letting a particle diameter be Dx (μm) when a cumulative particle volume cumulated from the small particle diameter side reaches x (%) of the total particle volume in a particle size distribution obtained regarding cerium oxide included in a polishing liquid using a laser diffraction/scattering method, D5 is 1 μm or less, and a difference between D95 and D5 is 3 μm or more.