B29K2271/00

METHOD FOR PRODUCING AN OBJECT BY MELTING A POLYMER POWDER IN A POWDER SINTERING DEVICE
20180001549 · 2018-01-04 · ·

A method for producing an object by melting a polymer powder in a powder sintering device. For example, a method for producing an object by melting a polymer powder in a powder sintering device under a laser beam, implementing a rheological analysis of the polymers, in order to determine the conditions for producing the object by melting polymer powders.

Co-curing process for the joining of composite structures
09731453 · 2017-08-15 · ·

A method of fabricating a composite assembly may include providing a first laminate and a second laminate respectively formed of first and second composite plies, and having a respective first and second cured section and a respective first and second uncured section. The method may further include interleaving the first composite plies in the first uncured section with the second composite plies in the second uncured section to form an interfacial region. The method may additionally include curing the interfacial region to join the first laminate to the second laminate and form a unitized composite assembly.

Co-curing process for the joining of composite structures
09731453 · 2017-08-15 · ·

A method of fabricating a composite assembly may include providing a first laminate and a second laminate respectively formed of first and second composite plies, and having a respective first and second cured section and a respective first and second uncured section. The method may further include interleaving the first composite plies in the first uncured section with the second composite plies in the second uncured section to form an interfacial region. The method may additionally include curing the interfacial region to join the first laminate to the second laminate and form a unitized composite assembly.

Peel ply for surface preparation and bonding method using the same
11192351 · 2021-12-07 · ·

A method for surface preparation of a composite substrate prior to adhesive bonding. The surface preparation method includes applying a resin-containing peel ply onto a composite substrate, followed by co-curing. The resin-containing peel ply contains a non-removable textile carrier and a removable woven fabric embedded therein. After co-curing, the peel ply is removed from the composite substrate such that the removable woven fabric is removed but the non-removable textile carrier and a film of residual resin remain on the composite substrate, thereby creating a modified, bondable surface on the composite substrate. The composite substrate with the modified surface can be bonded to another composite substrate, whereby the textile carrier remains an integrated part of the final bonded structure.

Peel ply for surface preparation and bonding method using the same
11192351 · 2021-12-07 · ·

A method for surface preparation of a composite substrate prior to adhesive bonding. The surface preparation method includes applying a resin-containing peel ply onto a composite substrate, followed by co-curing. The resin-containing peel ply contains a non-removable textile carrier and a removable woven fabric embedded therein. After co-curing, the peel ply is removed from the composite substrate such that the removable woven fabric is removed but the non-removable textile carrier and a film of residual resin remain on the composite substrate, thereby creating a modified, bondable surface on the composite substrate. The composite substrate with the modified surface can be bonded to another composite substrate, whereby the textile carrier remains an integrated part of the final bonded structure.

Poly(aryl-ether-ketone) (PAEK) powder suitable for multiple use in sintering methods
11746188 · 2023-09-05 · ·

Provided is a poly(aryl-ether-ketone) (PAEK) powder suitable for use in a method for building objects layer-by-layer by electromagnetic radiation-generated sintering, which is obtained from a thermal pretreatment at a temperature between 260° C. and 290° C. and which has a melting temperature which is stable, at the build temperature, and below or equal to 330° C.

Use of PEKK for producing parts with low gas permeability
11377520 · 2022-07-05 · ·

The use of PEKK for lowering the CO.sub.2 and H.sub.2S permeability of a part intended to enter into contact with a petroleum effluent. Also, a pipe for transporting a petroleum effluent, including a layer intended to be in contact with the petroleum effluent, wherein the layer intended to be in contact with the petroleum effluent comprises PEKK and has a CO.sub.2 permeability at 130° C. of less than 10.sup.−8 cm.sup.3, for a thickness of 1 cm and a surface area of 1 cm.sup.2 and per second and bar of CO.sub.2 pressure and/or an H.sub.2S permeability at 130° C. of less than 10.sup.−8 cm.sup.3 for a thickness of 1 cm and a surface area of 1 cm.sup.2 and per second and bar of H.sub.2S pressure, the amount of CO.sub.2 and H.sub.2S being measured by GC, respectively. Lastly, a number of methods for manufacturing such a pipe.

FLEXIBLE BLADDER TANKS INCLUDING POLYKETONE
20220106105 · 2022-04-07 ·

The present disclosure provides a plastic bladder for containing a liquid. The bladder includes a barrier layer and a recycled plastic layer adjacent to the barrier layer. The bladder further includes a fitting in contact with the layer.

Depositing arced portions of fiber-reinforced thermoplastic filament
11292190 · 2022-04-05 · ·

A technique for depositing fiber-reinforced thermoplastic filament in an arc is disclosed that mitigates the centripetal forces that arise in the prior art. In accordance with the illustrative embodiment, the centripetal forces are ameliorated by twisting the filament while depositing it in an arc.

PEEL PLY FOR SURFACE PREPARATION AND BONDING METHOD USING THE SAME
20210283891 · 2021-09-16 ·

A method for surface preparation of a composite substrate prior to adhesive bonding. The surface preparation method includes applying a resin-containing peel ply onto a composite substrate, followed by co-curing. The resin-containing peel ply contains a non-removable textile carrier and a removable woven fabric embedded therein. After co-curing, the peel ply is removed from the composite substrate such that the removable woven fabric is removed but the non-removable textile carrier and a film of residual resin remain on the composite substrate, thereby creating a modified, bondable surface on the composite substrate. The composite substrate with the modified surface can be bonded to another composite substrate, whereby the textile carrier remains an integrated part of the final bonded structure.