Provided is a polyamide resin composition capable of achieving high toughness and high breaking strain at the same time. Also provided is a molded article produced by molding the polyamide resin composition, and a method for manufacturing the molded article using the polyamide resin composition. A polyamide resin composition comprising: 100 parts by weight of polyamide resin (A) that is composed of a structural unit derived from diamine and a structural unit derived from dicarboxylic acid, and 0.05 to 0.45 parts by weight of an olefin-maleic anhydride copolymer (B), wherein 50 mol % or more of the structural unit derived from diamine is derived from at least one of metaxylylenediamine and paraxylylenediamine; the molar ratio of the structural unit derived from metaxylylenediamine and the structural unit derived from paraxylylenediamine is 100:0 to 40:60; 50 mol % or more of the structural unit derived from dicarboxylic acid is derived from sebacic acid; and the polyamide resin (A) has a terminal amino group concentration of 10 to 30 μeq/g.

Provided is a polyamide resin composition capable of achieving high toughness and high breaking strain at the same time. Also provided is a molded article produced by molding the polyamide resin composition, and a method for manufacturing the molded article using the polyamide resin composition. A polyamide resin composition comprising: 100 parts by weight of polyamide resin (A) that is composed of a structural unit derived from diamine and a structural unit derived from dicarboxylic acid, and 0.05 to 0.45 parts by weight of an olefin-maleic anhydride copolymer (B), wherein 50 mol % or more of the structural unit derived from diamine is derived from at least one of metaxylylenediamine and paraxylylenediamine; the molar ratio of the structural unit derived from metaxylylenediamine and the structural unit derived from paraxylylenediamine is 100:0 to 40:60; 50 mol % or more of the structural unit derived from dicarboxylic acid is derived from sebacic acid; and the polyamide resin (A) has a terminal amino group concentration of 10 to 30 eq/g.

Described herein are photopolymerizable compositions for use in 3D printing. The compositions contain highly crosslinkable acrylate monomers, oligomers comprising a polyether acrylate oligomer, a polyester oligomer, an unsaturated polyester oligomer, or a combination thereof and a photoinitiator. The compositions, after photopolymerization, have a high heat deflection temperature, while maintaining strong mechanical properties. Also described are methods for fabricating three dimensional objects utilizing these compositions, and three dimensional objects made from these compositions.