A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1, $\frac{\sigma D\times \sigma H}{\sigma D+\sigma H}\le 1.0,$
where σD is a standard deviation of tablet diameters and σH is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and (iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.

The present application relates to a resin composition for 3D printing, a 3D printing method using the same, and a three-dimensional shape comprising the same, and provides a resin composition which is capable of precisely forming a three-dimensional shape and implementing uniform curing properties of a three-dimensional shape.

A film that comprises a thermoplastic composition that contains a continuous phase that includes a polyolefin matrix polymer and a nanoinclusion additive dispersed within the continuous phase in the form of discrete domains is provided. The film is biaxially stretched in a machine direction and cross-machine direction to form a porous network in the composition. The porous network contains nanopores having a maximum cross-sectional dimension of about 800 nanometers or less. At least a portion of the nanopores are oriented in the cross-machine direction so that the axial dimension generally extends in the cross-machine direction and the cross-sectional dimension generally extends in the machine direction.

A fiber-reinforced polymeric composite structure having chemically active thermoset particles positioned in an interlaminar region between adjacent layers of reinforcement fibers and method of making the same. Upon curing of the composite structure, the chemically active functional groups on the thermoset particles form covalent bonds with the matrix resin surrounding the particles. In one embodiment, the particles are formed of a partially cured thermoset polymer with a degree of cure of less than 100%. In another embodiment, the particles are derived from a thermosettable resin composition, wherein the stoichiometry is such that there is a deficiency or an excess in the amount of curing agent that is necessary for reacting with 100% of the thermoset resin component. In some embodiments, the composition of the chemically active thermoset particles is the same or substantially the same as that of the matrix resin of the composite structure.

A film that comprises a thermoplastic composition that contains a continuous phase that includes a polyolefin matrix polymer and a nanoinclusion additive dispersed within the continuous phase in the form of discrete domains is provided. The film is biaxially stretched in a machine direction and cross-machine direction to form a porous network in the composition. The porous network contains nanopores having a maximum cross-sectional dimension of about 800 nanometers or less. At least a portion of the nanopores are oriented in the cross-machine direction so that the axial dimension generally extends in the cross-machine direction and the cross-sectional dimension generally extends in the machine direction.

A method for forming a composite component, the method comprising: providing a first mould tool and a second mould tool, the first and second mould tools being configured so as to be capable of defining at least part of a mould cavity between them, and the second mould tool having a moulding surface defined by at least two demountable mould bodies; attaching the first mould tool to a press at a first workstation; subsequently, at a second workstation spaced from the first workstation, loading at least part of the second mould tool with reinforcement material whilst the first mould tool remains attached to the press at the first workstation; moving the second mould tool to the press at the first workstation in such a position as to confront the first mould tool; causing the press to effect relative movement of the first and second tools to bring the first and second tools into mating arrangement so as to define a mould cavity therebetween; and setting in shape the reinforcement material located in the mould cavity.

A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1,

[00001]$\frac{.Math..Math.D.Math..Math.H}{.Math..Math.D+.Math..Math.H}1.0,$

where D is a standard deviation of tablet diameters and H is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and (iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.

A fiber-reinforced polymeric composite structure having chemically active thermoset particles positioned in an interlaminar region between adjacent layers of reinforcement fibers and method of making the same. Upon curing of the composite structure, the chemically active functional groups on the thermoset particles form covalent bonds with the matrix resin surrounding the particles. In one embodiment, the particles are formed of a partially cured thermoset polymer with a degree of cure of less than 100%. In another embodiment, the particles are derived from a thermosettable resin composition, wherein the stoichiometry is such that there is a deficiency or an excess in the amount of curing agent that is necessary for reacting with 100% of the thermoset resin component. In some embodiments, the composition of the chemically active thermoset particles is the same or substantially the same as that of the matrix resin of the composite structure.

A bracket assembly suitable for use with an electronic device is described. The bracket assembly may include a bracket body having a channel. The bracket assembly may further include a membrane embedded in the bracket body and designed to allow air, but not liquid (such as water), to pass through the membrane. The membrane may be at least partially surrounded by a membrane support molded to the membrane. The membrane and the membrane support may be disposed in a molding tool to receive a material used to mold the bracket body over the membrane and the membrane support. During the molding operation, the membrane support may act as a buffer to shield the membrane from temperature and pressure increases associated with the molding operation of the bracket body. The bracket assembly may improve the ability of the electronic device to prevent liquid ingress.

The present application relates to a resin composition for 3D printing, a 3D printing method using the same, and a three-dimensional shape comprising the same, and provides a resin composition which is capable of precisely forming a three-dimensional shape and implementing uniform curing properties of a three-dimensional shape.