Patent classifications
B
B29
B29K
B29K283/00
Fused filament fabrication method using filaments that include a binder configured to release a secondary material
11697243
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2023-07-11
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A method may include fused filament fabricating a fused filament fabricated component by delivering a softened filament to selected locations at or adjacent to a build surface. The softened filament may include a binder and a primary material. The binder is configured to release a secondary material upon heating at or above a conversion temperature. The method also may include heating the fused filament fabricated component to a temperature at or above the conversion temperature to sinter the primary material to form a sintered part and cause the binder to release the secondary material within the sintered part.