A wearable garment includes a compression fabric with at least one electrode coupled to the compression fabric or sewn into seams of the wearable garment. The electrode includes a first layer comprising a metal integral conductive silicone rubber material configured to lay proximate to a wearer of the garment. The electrode may also include a second layer including a conducting metal sheet and a conductive lead coupled to the second layer. A non-conducting layer is configured to lay proximate to the compression fabric.

Method which is intended for producing an endless semi-finished product and having the following steps: feeding a silicone tube and a separate internal conductor, wherein the internal conductor runs in a first interior space formed by the silicone tube; encasing the fed silicone tube by production of an endless fibre tube, which encloses the silicone tube from the outside. The silicone tube is expanded so that a gap is formed between the silicone tube and the endless fibre tube. A matrix material is feed into the gap connecting the silicone tube and the endless fibre tube by virtue of the matrix material being cured.

A method of manufacturing a plurality of optical elements includes providing a first wafer (200) having lower alignment features (192) arranged on a first surface of the substrate, providing a second wafer (201) comprising, on a replication side, a plurality of replication sections, each replication section defining a surface structure of one of the optical elements, the second wafer (201) further comprising upper alignment features (194) protruding, on the replication side, further than an outermost feature of the replication sections, depositing liquid droplets (196) on the first side of the first wafer (200), and bringing the second wafer (201) and the first side of the first wafer (200) together, with liquid droplets (196) between the first wafer (200) and the second wafer (201), the upper alignment features (194) contacting the liquid droplets (196) on the lower alignment features (192) on the first side of the first wafer (200), and thereby causing the second wafer (201) to align with the first wafer (200) by capillary action.