B29K79/00

3-D structures having high temperature stability and improved microporosity

The present invention relates to 3-D structures having high temperature stability and improved micro-porosity as well as processes of making and using same. The disclosed 3-D are advantageous because they have low densities and low permittivities. When compared to previous 3-D structures, the present structures maintain their low permittivities over a broader range of electromagnetic frequencies. Thus, when used in communication devices such as array antennas, can provided higher communication performance in high temperature environments.

Heat resistant polyimide film

A high temperature resistant polyimide film and its preparation method. The present invention relates to a polyimide film and its preparation method and solves the problems of honeycomb's and skin panel's core adhesive-polyimide film with insufficient heat resistance, no climbing of bonding core structure and adhesive fillet formation. The high temperature resistant polyimide film is made by polyimide solution, inorganic filler modifier and interface coupling agent by the steps of: under specific temperature and stirring conditions, adding inorganic filler modifier and interface coupling agent to polyimide solution, stirring to obtain the adhesive agent; filtering and degassing the adhesive agent, casting to a stainless steel drum with carrier cloth and release paper to obtain a self-supporting film; then heating and annealing to obtain the final polyimide film. The present invention is applied to high temperature resistant polyimide film and its preparation method.

Three-dimensional printed composites using sodium silicate binder

A three-dimensional object comprises stacked substrate layers infiltrated by a hardened material. Each substrate layer is a sheet-like structure that comprises fibers held together by a sodium silicate binder. The substrate layer material may be non-woven or woven. The substrate layer may be a non-woven fiber veil bound by a sodium silicate binder. The fibers may optionally include carbon fibers, ceramic fibers, polymer fibers, glass fibers, metal fibers, or a combination thereof.

Dip molding composition, method of producing glove, and glove
11780992 · 2023-10-10 · ·

Provided is, a glove production method including: (1) the step of immersing a glove forming mold in a liquid coagulant containing calcium ions so as to allow the coagulant to adhere to the glove forming mold; (2) the dispersion step of leaving a dip molding composition to stand with stirring; (3) the dipping step; (4) the gelling step; (5) the leaching step; (6) the beading step; (7) the precuring step; and (8) the curing step, in which method the steps (3) to (8) are performed in the order mentioned, and the dip molding composition has a specific formulation.

Polyimide-based composite film and display device comprising same

Embodiments relate to a polyimide-based composite film, which comprises a base film comprising a polyimide-based resin; and a functional layer disposed on the base film, wherein when the side of the functional layer located opposite to the side in contact with the base film is referred to as a first side and when the side of the base film in contact with the functional layer is referred to as a second side, the leveling index represented by Equation 1 is less than 0.75.

Cross-linkable thermoplastics, and processes of making and using same

The invention relates to cross-linkable thermoplastics, processes of making such cross-linkable thermoplastics and products comprising such cross-linkable thermoplastics. Such cross-linkable thermoplastics provide articles made by the additive manufacturing (AM) process with increased strength, the desired in use temperature stability and the desired thermo-oxidative stability.

Prepreg, laminate, and molding

The present invention aims at providing a prepreg for producing a laminate suitable as a structural material, and a laminate, which have excellent tensile shear joining strength, fatigue joining strength, and interlaminar fractural toughness values, and can be firmly integrated with another structural member by welding. The present invention is a prepreg including the following structural components [A], [B], and [C], wherein [C] is present on a surface of the prepreg, [C] is a crystalline thermoplastic resin having a glass transition temperature of 100 C. or higher or an amorphous thermoplastic resin having a glass transition temperature of 180 C. or higher, and the reinforcing fibers [A] are present which are included in a resin area including [B] and a resin area including [C] across an interface between the two resin areas: [A] reinforcing fibers; [B] a thermosetting resin; and [C] a thermoplastic resin.

Three-dimensional printed composites using engineered powders

A three-dimensional object comprises stacked substrate layers infiltrated by a hardened material comprising engineered powder that is transformed into a substance that flows and subsequently hardens into the hardened material in a spatial pattern that infiltrates positive regions, and does not infiltrate negative regions, in the substrate layers. The powder may be emulsion aggregation powder, chemically-produced toner powder, or a combination. It may be a thermoplastic or thermosettable polymer and may include nylon, elastomers, polyolefins, polyethylene, polyether ether ketone, polyimide, polyetherimide, polyphenylene sulfide, polystyrene, polypropylene, polymethyl methacrylate, and polyaryletherketone, or a combination. The powder particles may have a pre-specified controlled shape and/or a non-homogenous composition. Surface treatments and/or additives may be used to control powder flow and charge distribution. Each substrate layer may be a sheet-like structure comprising fibers held together by binder. The binder may include sodium silicate.

Fiber composites comprising a circuit, and method therefor

Fiber-composite parts that incorporate a very thin electrical circuit, and a method for making the parts via compression molding, are disclosed. The electrical circuit is encapsulated by a film having a melting point that exceeds the maximum temperature to which the film is exposed during compression molding. The electrical circuit is disposed in a composite ply, in a lay-up of composite plies, and electrical leads are routed through the composite plies so that the lead are accessible in the molded fiber-composite part.

Additive manufacturing employing polyimide-containing formulations

A method of additive manufacturing of a three-dimensional object, comprises: dispensing from a first array of nozzles a modeling material formulation containing a polyimide precursor to form a layer in a configured pattern corresponding to a shape of a slice of the object; applying to the layer ultraviolet radiation and infrared radiation from two different radiation sources; and repeating the dispensing and the application of radiation to form a plurality of layers in configured patterns corresponding to shapes of other slices of the object. Optionally, an additional modeling material formulation or a support material formulation is dispensed from a second array of nozzles.