Patent classifications
B32B2309/00
Poly-supported copper foil
A supported copper foil is disclosed, comprising: a poly-based film that contains polyimide and polytetrafluoroethylene; a thin copper foil; and an adhesive provided between the poly-based film and the thin copper foil, the adhesive removably coupling the poly-based film to the copper foil.
POLY-SUPPORTED COPPER FOIL
A supported copper foil is disclosed, comprising: a poly-based film that contains polyimide and polytetrafluoroethylene; a thin copper foil; and an adhesive provided between the poly-based film and the thin copper foil, the adhesive removably coupling the poly-based film to the copper foil.
Poly-supported copper foil
A method of manufacturing a supported copper product is disclosed. The method includes: providing a thin copper foil and a poly-based film containing polyimide and polytetrafluoroethylene, the poly-based film having an adhesive applied to a surface of the poly-based film; thermally treating the thin copper foil and the poly-based film along their respective lengths, the thermal treatment being adjustable to vary an amount of heat applied to the thin copper foil and the poly-based film; and attaching the thermally treated thin copper foil and the thermally treated poly-based film using the adhesive applied at the surface of the poly-based film.
PRODUCTION METHOD FOR HIGH-PRESSURE PROCESSED MULTILAYER STRUCTURE, AND HIGH-PRESSURE PROCESSING METHOD FOR MULTILAYER STRUCTURE
A production method for a high-pressure processed multilayer structure to be used for packages for foods and the like is provided. The production method includes: preparing a multilayer structure including an ethylene-vinyl alcohol copolymer (EVOH) layer formed from a resin composition containing an ethylene-vinyl alcohol copolymer having a saponification degree of greater than 99.7 mol % as a main component and an olefin resin layer having a thickness of less than 100 μm; and high-pressure processing the multilayer structure under a pressure of not lower than 200 MPa in an atmosphere at not lower than 20° C.
IN-LINE PROCESS OF PRODUCING A POLYMER FILM FOR DISPOSABLE HYGIENE PRODUCTS
A method of forming a disposable hygiene product includes providing a manufacturing line (10) having a back sheet station (12), a core layer station (14) and a top sheet station (16) connected by a conveying system (18), providing a back sheet (20) at the back sheet station, providing a core layer (22) at the core layer station, applying the core layer on the back sheet, providing a top sheet (24) at the top sheet station, and applying the top sheet on the back sheet and core layer. The back sheet station includes a fluid application device (28) configured to discharge a curtain of material to form a polymer film (201), and the back sheet includes the polymer film. A method of forming a back sheet of disposable hygiene product includes positioning a back sheet station in a disposable hygiene product manufacturing line, the back sheet station having a fluid application device and discharging, from the fluid application device, a curtain of material to form a polymer film. A disposable hygiene product manufacturing line includes a back sheet station having a fluid application device configured to discharge a curtain of material to form a polymer film.
POLY-SUPPORTED COPPER FOIL
A method of manufacturing a supported copper product is disclosed. The method includes: providing a thin copper foil and a poly-based film containing polyimide and polytetrafluoroethylene, the poly-based film having an adhesive applied to a surface of the poly-based film; thermally treating the thin copper foil and the poly-based film along their respective lengths, the thermal treatment being adjustable to vary an amount of heat applied to the thin copper foil and the poly-based film; and attaching the thermally treated thin copper foil and the thermally treated poly-based film using the adhesive applied at the surface of the poly-based film.